JPS56109225A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS56109225A JPS56109225A JP1216780A JP1216780A JPS56109225A JP S56109225 A JPS56109225 A JP S56109225A JP 1216780 A JP1216780 A JP 1216780A JP 1216780 A JP1216780 A JP 1216780A JP S56109225 A JPS56109225 A JP S56109225A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- polyparabanic acid
- resin composition
- thermosetting resin
- monomaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
PURPOSE: A thermosetting resin composition with excellent heat resistance, mechanical characteristics and workability, useful for lamination or molding, which is obtained by mixing a bismaleimide compound, a polyparabanic acid and an imidazole compound.
CONSTITUTION: A dimaleimide compound or a mixture of the dimaleimide compound with a monomaleimide compound, a polyparabanic acid of formula I (wherein n is an integer) and an imidazole compound of formula II (wherein R1WR4 are H or alkyl) are mixed. The maleimide compound is preferably bismaleimide, which may be partially replaced by the monomaleimide. It is preferable to use 15W85wt% maleimide compound and 85W15wt% polyparabanic acid, each based on the total solid content in the maleimide compound and the polyparabanic acid.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1216780A JPS56109225A (en) | 1980-02-04 | 1980-02-04 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1216780A JPS56109225A (en) | 1980-02-04 | 1980-02-04 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56109225A true JPS56109225A (en) | 1981-08-29 |
JPS6343420B2 JPS6343420B2 (en) | 1988-08-30 |
Family
ID=11797872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1216780A Granted JPS56109225A (en) | 1980-02-04 | 1980-02-04 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56109225A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01263159A (en) * | 1988-04-14 | 1989-10-19 | Fujikura Ltd | Cover coating material composition for printed wiring board and printed wiring board therefrom |
-
1980
- 1980-02-04 JP JP1216780A patent/JPS56109225A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01263159A (en) * | 1988-04-14 | 1989-10-19 | Fujikura Ltd | Cover coating material composition for printed wiring board and printed wiring board therefrom |
Also Published As
Publication number | Publication date |
---|---|
JPS6343420B2 (en) | 1988-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5611917A (en) | Thermosetting resin composition | |
ATE60070T1 (en) | STABLE WATER POLYMER DISPERSIONS. | |
JPS5749621A (en) | Preparation of heat-resistant resin | |
JPS56109225A (en) | Thermosetting resin composition | |
JPS54100488A (en) | Heat-resistant impregnation resin composition | |
JPS5757728A (en) | Non-polluting composite stabilizer | |
JPS54142298A (en) | Heat-resistant curable resin composition | |
JPS572328A (en) | Composition for adhesive | |
JPS5655449A (en) | Thermosetting resin composition | |
JPS57185330A (en) | Stabilized polyolefin resin composition | |
JPS57174314A (en) | Epoxy resin composition | |
JPS51129447A (en) | Thermoplastic resin composition | |
JPS5521461A (en) | Resin composition | |
JPS5620023A (en) | Curable composition | |
JPS55123622A (en) | Thermosetting resin composition | |
JPS5341398A (en) | Heat resistant resin composition | |
JPS565868A (en) | Coating for electrodeposition | |
JPS5783551A (en) | Resin composition containing polyamide | |
JPS5645948A (en) | Production of composite material | |
JPS56149432A (en) | Thermosetting resin composition | |
JPS57185332A (en) | Stabilized polyolefin resin composition | |
JPS55118920A (en) | Curable epoxy resin composition | |
JPS54129094A (en) | Thermosetting resin composition | |
JPS5486599A (en) | Thermosetting epoxy resin composition | |
JPS5698256A (en) | Resin composition |