JPS56109225A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS56109225A
JPS56109225A JP1216780A JP1216780A JPS56109225A JP S56109225 A JPS56109225 A JP S56109225A JP 1216780 A JP1216780 A JP 1216780A JP 1216780 A JP1216780 A JP 1216780A JP S56109225 A JPS56109225 A JP S56109225A
Authority
JP
Japan
Prior art keywords
compound
polyparabanic acid
resin composition
thermosetting resin
monomaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1216780A
Other languages
Japanese (ja)
Other versions
JPS6343420B2 (en
Inventor
Kiyoji Makino
Kazuyuki Tomonaga
Tsutomu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP1216780A priority Critical patent/JPS56109225A/en
Publication of JPS56109225A publication Critical patent/JPS56109225A/en
Publication of JPS6343420B2 publication Critical patent/JPS6343420B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

PURPOSE: A thermosetting resin composition with excellent heat resistance, mechanical characteristics and workability, useful for lamination or molding, which is obtained by mixing a bismaleimide compound, a polyparabanic acid and an imidazole compound.
CONSTITUTION: A dimaleimide compound or a mixture of the dimaleimide compound with a monomaleimide compound, a polyparabanic acid of formula I (wherein n is an integer) and an imidazole compound of formula II (wherein R1WR4 are H or alkyl) are mixed. The maleimide compound is preferably bismaleimide, which may be partially replaced by the monomaleimide. It is preferable to use 15W85wt% maleimide compound and 85W15wt% polyparabanic acid, each based on the total solid content in the maleimide compound and the polyparabanic acid.
COPYRIGHT: (C)1981,JPO&Japio
JP1216780A 1980-02-04 1980-02-04 Thermosetting resin composition Granted JPS56109225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1216780A JPS56109225A (en) 1980-02-04 1980-02-04 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1216780A JPS56109225A (en) 1980-02-04 1980-02-04 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS56109225A true JPS56109225A (en) 1981-08-29
JPS6343420B2 JPS6343420B2 (en) 1988-08-30

Family

ID=11797872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1216780A Granted JPS56109225A (en) 1980-02-04 1980-02-04 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS56109225A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01263159A (en) * 1988-04-14 1989-10-19 Fujikura Ltd Cover coating material composition for printed wiring board and printed wiring board therefrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01263159A (en) * 1988-04-14 1989-10-19 Fujikura Ltd Cover coating material composition for printed wiring board and printed wiring board therefrom

Also Published As

Publication number Publication date
JPS6343420B2 (en) 1988-08-30

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