JPS57151647A - Thermoplastic resin composition - Google Patents

Thermoplastic resin composition

Info

Publication number
JPS57151647A
JPS57151647A JP3529281A JP3529281A JPS57151647A JP S57151647 A JPS57151647 A JP S57151647A JP 3529281 A JP3529281 A JP 3529281A JP 3529281 A JP3529281 A JP 3529281A JP S57151647 A JPS57151647 A JP S57151647A
Authority
JP
Japan
Prior art keywords
resin
fillers
polyamide
residue
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3529281A
Other languages
Japanese (ja)
Inventor
Atsushi Suzuki
Yasushi Kubo
Toshihiko Aya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP3529281A priority Critical patent/JPS57151647A/en
Publication of JPS57151647A publication Critical patent/JPS57151647A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To prepare the titled composition having remarkably improved heat resistance and useful as automobile parts, etc., by adding a polyamide-imide resin to a polyarylene sulfide resin containing relatively large amount of fillers.
CONSTITUTION: (A) 25W50pts.wt. of a polyarylene sulfide resin having the recurring unit of formula [Ar-S] (Ar is bivalent organic residue having 6-membered ring) as main structural unit, is mixed with (B) 45W70pts.wt. of fillers (e.g. abrasion resistance improving agent, etc.) and (C) 0.1W5pts.wt. of a heat-resistance improving agent comprising a polyamide-imide resin having the recurring unit of formula (Ar' is trivalent aromatic residue having 6-membered ring; R is bivalent aromatic and/or aliphatic residue; R' is H, methyl or phenyl) as the main structural unit (70W100mol%), under melting and kneading at 250W400°C to obtain 100pts.wt. of the objective resin composition.
COPYRIGHT: (C)1982,JPO&Japio
JP3529281A 1981-03-13 1981-03-13 Thermoplastic resin composition Pending JPS57151647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3529281A JPS57151647A (en) 1981-03-13 1981-03-13 Thermoplastic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3529281A JPS57151647A (en) 1981-03-13 1981-03-13 Thermoplastic resin composition

Publications (1)

Publication Number Publication Date
JPS57151647A true JPS57151647A (en) 1982-09-18

Family

ID=12437692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3529281A Pending JPS57151647A (en) 1981-03-13 1981-03-13 Thermoplastic resin composition

Country Status (1)

Country Link
JP (1) JPS57151647A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134061A (en) * 1984-06-29 1986-02-18 アモコ、コ−ポレ−ション Blend of poly(amide imide) and poly(aryl ether ketone)
US7864151B1 (en) 1986-07-07 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Portable electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134061A (en) * 1984-06-29 1986-02-18 アモコ、コ−ポレ−ション Blend of poly(amide imide) and poly(aryl ether ketone)
US7864151B1 (en) 1986-07-07 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Portable electronic device

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