JPS56151756A - Polyamide-imide resin composition - Google Patents

Polyamide-imide resin composition

Info

Publication number
JPS56151756A
JPS56151756A JP5532480A JP5532480A JPS56151756A JP S56151756 A JPS56151756 A JP S56151756A JP 5532480 A JP5532480 A JP 5532480A JP 5532480 A JP5532480 A JP 5532480A JP S56151756 A JPS56151756 A JP S56151756A
Authority
JP
Japan
Prior art keywords
imide resin
resin
formula
polyamide
aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5532480A
Other languages
Japanese (ja)
Other versions
JPS6333510B2 (en
Inventor
Yasushi Kubo
Toshihiko Aya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP5532480A priority Critical patent/JPS56151756A/en
Publication of JPS56151756A publication Critical patent/JPS56151756A/en
Publication of JPS6333510B2 publication Critical patent/JPS6333510B2/ja
Granted legal-status Critical Current

Links

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To improve the melt-flow characteristics of an aromatic polyamide-imide resin and the surface smoothness of the extrusion-molded resin, by incorporating a specific amount of a polyethylene resin.
CONSTITUTION: The composition is prepared by melting and mixing (A) 30W 99.9wt% of an aromatic polyamide-imide resin having the recurring unit of formula I (Ar is a trivalent aromatic residue containing at least one 6-membered carbon ring; R is bivalent aromatic and/or aliphatic group; R' is H, methyl or phenyl) as a main structure unit and containing <30mol% of the linking units of formula II and/or formula III, etc., (B) 0.1W10wt%, pref. 0.2W5wt% of a polyethylene resin, and (C) 0W70wt% of a filler such as abrasion resistance improving agent, reinforcing agent, flame-retardant, etc., at 300W380°C.
COPYRIGHT: (C)1981,JPO&Japio
JP5532480A 1980-04-28 1980-04-28 Polyamide-imide resin composition Granted JPS56151756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5532480A JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5532480A JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Publications (2)

Publication Number Publication Date
JPS56151756A true JPS56151756A (en) 1981-11-24
JPS6333510B2 JPS6333510B2 (en) 1988-07-05

Family

ID=12995356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5532480A Granted JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Country Status (1)

Country Link
JP (1) JPS56151756A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135253A (en) * 1983-01-24 1984-08-03 Toray Ind Inc Polyamide-imide sheet material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135253A (en) * 1983-01-24 1984-08-03 Toray Ind Inc Polyamide-imide sheet material

Also Published As

Publication number Publication date
JPS6333510B2 (en) 1988-07-05

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