JPS5755921A - Water-resistant epoxy resin composition - Google Patents

Water-resistant epoxy resin composition

Info

Publication number
JPS5755921A
JPS5755921A JP12985380A JP12985380A JPS5755921A JP S5755921 A JPS5755921 A JP S5755921A JP 12985380 A JP12985380 A JP 12985380A JP 12985380 A JP12985380 A JP 12985380A JP S5755921 A JPS5755921 A JP S5755921A
Authority
JP
Japan
Prior art keywords
epoxy resin
alkyl
water
resin composition
resistant epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12985380A
Other languages
Japanese (ja)
Inventor
Takaaki Fukai
Naomasa Hakamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP12985380A priority Critical patent/JPS5755921A/en
Publication of JPS5755921A publication Critical patent/JPS5755921A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: Titled composition prepared by mixing an epoxy resin containing a phenol resin precondensate curing agent and an inorganic filler with a coupling agent which is a silane compound free from groups reactive with functional groups of the resin and the curing agent under the curing condition.
CONSTITUTION: A water-resistant epoxy resin composition is prepared by mixing (A) an epoxy resin having at least two epoxy groups in the molecule with (B) a phenol resin precondensate, (C) an inorganic filler, e.g., silica, and (D) a silane coupling agent of the formula, wherein R1 is a 1W3C alkyl, vinyl, phenyl or meth- acryloxypropyl, R2 is a 1W15C alkyl, a 1W5C alkoxy-substituted alkyl, e.g., methyltriethoxysilane. Component D is preferably 0.05W5wt% based on component C.
EFFECT: It is possible to give high water resistance without lowering the strength.
USE: Insulating materials.
COPYRIGHT: (C)1982,JPO&Japio
JP12985380A 1980-09-18 1980-09-18 Water-resistant epoxy resin composition Pending JPS5755921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12985380A JPS5755921A (en) 1980-09-18 1980-09-18 Water-resistant epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12985380A JPS5755921A (en) 1980-09-18 1980-09-18 Water-resistant epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5755921A true JPS5755921A (en) 1982-04-03

Family

ID=15019869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12985380A Pending JPS5755921A (en) 1980-09-18 1980-09-18 Water-resistant epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5755921A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991139A (en) * 1982-11-16 1984-05-25 Meidensha Electric Mfg Co Ltd Thermally conductive electrically insulating material
JPS59126576A (en) * 1983-01-08 1984-07-21 Canon Inc Fixing device and roller for fixation
JPS6178823A (en) * 1984-09-27 1986-04-22 Toshiba Corp Epoxy resin composition
JPS61247753A (en) * 1985-04-26 1986-11-05 Toshiba Chem Corp Sealing resin composition
JPS61296020A (en) * 1985-06-26 1986-12-26 Toshiba Corp Epoxy resin liquid composition for sealing electronic part

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991139A (en) * 1982-11-16 1984-05-25 Meidensha Electric Mfg Co Ltd Thermally conductive electrically insulating material
JPS59126576A (en) * 1983-01-08 1984-07-21 Canon Inc Fixing device and roller for fixation
JPH0554112B2 (en) * 1983-01-08 1993-08-11 Canon Kk
JPS6178823A (en) * 1984-09-27 1986-04-22 Toshiba Corp Epoxy resin composition
JPS6251973B2 (en) * 1984-09-27 1987-11-02 Tokyo Shibaura Electric Co
JPS61247753A (en) * 1985-04-26 1986-11-05 Toshiba Chem Corp Sealing resin composition
JPH0514726B2 (en) * 1985-04-26 1993-02-25 Toshiba Chem Prod
JPS61296020A (en) * 1985-06-26 1986-12-26 Toshiba Corp Epoxy resin liquid composition for sealing electronic part

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