JPS55145730A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS55145730A JPS55145730A JP5404779A JP5404779A JPS55145730A JP S55145730 A JPS55145730 A JP S55145730A JP 5404779 A JP5404779 A JP 5404779A JP 5404779 A JP5404779 A JP 5404779A JP S55145730 A JPS55145730 A JP S55145730A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- alkyl
- expressed
- compound
- alkoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: To provide a titled composition with excellent electrical property, crack resistance, storage stability and curing velocity adjustable in a wide range comprising an allylphenol compound, an epoxy resin, a specific curing catalyst and a cure- promoting agent.
CONSTITUTION: A curing catalyst selected from (A) an allylphenol compound expressed by the formula I (wherein X is a divalent hydrocarbon group or the like such as alkylene, cycloalkylene, monocyclic or polycyclic arylene), (B) an epoxy resin such as of a bisphenol-A type, or a phenol-rovolak type, and (C) a metal chelating compound expressed by a formula Rn 1Rm-n 2Me (wherein R1 is alkoxy, acyloxy; R2 is alkyl acetoacetate, acetyl-acetone; m is 1W4; n is 0W3; Me is Al, Fe, Cu or the like) as well as a cure promoting agent selected from a silicone compound having one or more OH groups, directly, bound to Si expressed by the formula II (wherein R1, R2 are H, alkyl, haloalkyl or the like), an organosilane compound expressed by the formula III (wherein R1W3 are alkyl, OH, alkoxy or the like) are compounded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5404779A JPS55145730A (en) | 1979-05-04 | 1979-05-04 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5404779A JPS55145730A (en) | 1979-05-04 | 1979-05-04 | Curable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55145730A true JPS55145730A (en) | 1980-11-13 |
Family
ID=12959683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5404779A Pending JPS55145730A (en) | 1979-05-04 | 1979-05-04 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145730A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59135217A (en) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | Production of heat-resistant grout material |
WO1992003489A1 (en) * | 1990-08-27 | 1992-03-05 | Fujitsu Limited | Epoxy resin composition |
JP2015149140A (en) * | 2014-02-05 | 2015-08-20 | Fdk株式会社 | Nonaqueous organic electrolytic solution for lithium primary battery, and lithium primary battery |
-
1979
- 1979-05-04 JP JP5404779A patent/JPS55145730A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59135217A (en) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | Production of heat-resistant grout material |
JPS6230216B2 (en) * | 1982-12-21 | 1987-07-01 | Nippon Debukon Kk | |
WO1992003489A1 (en) * | 1990-08-27 | 1992-03-05 | Fujitsu Limited | Epoxy resin composition |
JP2015149140A (en) * | 2014-02-05 | 2015-08-20 | Fdk株式会社 | Nonaqueous organic electrolytic solution for lithium primary battery, and lithium primary battery |
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