JPS64116A - Curable epoxy resin composition - Google Patents

Curable epoxy resin composition

Info

Publication number
JPS64116A
JPS64116A JP10608387A JP10608387A JPS64116A JP S64116 A JPS64116 A JP S64116A JP 10608387 A JP10608387 A JP 10608387A JP 10608387 A JP10608387 A JP 10608387A JP S64116 A JPS64116 A JP S64116A
Authority
JP
Japan
Prior art keywords
formula
resin composition
specified
compound
hydroxyphenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10608387A
Other languages
Japanese (ja)
Other versions
JPH01116A (en
Inventor
Masahisa Yokota
Fumihiro Higashinakagaha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP10608387A priority Critical patent/JPS64116A/en
Publication of JPH01116A publication Critical patent/JPH01116A/en
Publication of JPS64116A publication Critical patent/JPS64116A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: To obtain a resin composition which can give a cured product of low coefficient of linear expansion and good practical properties, by using, as a component, a reaction product obtained by reacting a specified epoxy compound with a specified phenolic compound so that the product may have a specified total epoxy equivalent.
CONSTITUTION: A resin composition comprising a reaction product of an epoxy compound of formula I with at least one phenolic compound of formula II and having a total epoxy equivalent in the range of 230W320. In the formulas, R, R' and R" are each a halogen atom or a 1W4C alkyl, X and X' are each a 1W4C alkylene, sulfone, carbonyl, O, S or a chemical bond, n, n' and n" are each 0 or 1W4, and m is 0 or 1W10. The epoxy compound of formula I can be produced, for example, from bis(3,5-dimethyl-4-hydroxyphenyl)sulfone and an epihalohydrin. Examples of the compounds of formula II include bis(4- hydroxyphenyl)propane and phenol novolak.
COPYRIGHT: (C)1989,JPO&Japio
JP10608387A 1987-02-16 1987-04-28 Curable epoxy resin composition Pending JPS64116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10608387A JPS64116A (en) 1987-02-16 1987-04-28 Curable epoxy resin composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-32720 1987-02-16
JP3272087 1987-02-16
JP10608387A JPS64116A (en) 1987-02-16 1987-04-28 Curable epoxy resin composition

Publications (2)

Publication Number Publication Date
JPH01116A JPH01116A (en) 1989-01-05
JPS64116A true JPS64116A (en) 1989-01-05

Family

ID=26371303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10608387A Pending JPS64116A (en) 1987-02-16 1987-04-28 Curable epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS64116A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
JP2010001379A (en) * 2008-06-20 2010-01-07 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition, and its cured product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
JP2010001379A (en) * 2008-06-20 2010-01-07 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition, and its cured product

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