JPS564647A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS564647A
JPS564647A JP7905879A JP7905879A JPS564647A JP S564647 A JPS564647 A JP S564647A JP 7905879 A JP7905879 A JP 7905879A JP 7905879 A JP7905879 A JP 7905879A JP S564647 A JPS564647 A JP S564647A
Authority
JP
Japan
Prior art keywords
compound
heat
resistant resin
resin composition
propenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7905879A
Other languages
Japanese (ja)
Inventor
Shuji Hayase
Shiyuuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7905879A priority Critical patent/JPS564647A/en
Publication of JPS564647A publication Critical patent/JPS564647A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A heat-resistant resin which is useful as an electrical insulating material and can be processed by casting, molding, or laminating, comprising an allylphenol compound, an epoxy resin, a silicon compound or an organosilane compound and an aluminum compound.
CONSTITUTION: A composition comprising (A) an allylphenol compound, (B) an epoxy resin, (C) at least 5wt% of at least one member selected from the class consisting of an Si-bonded OH-containing silicon compound and an organosilane compound and (D) an aluminum compound as a curing catalyst. Exemplary of the allylphenyl compound used are di[4-(3-propenyl)hydroxyphenyl]methane and 2,2-di[4-(3-propenyl)hydroxyphenyl]methane. Exemplary of the aluminum compound used are compounds represented by the formula, wherein R5 and R6 are alkyl groups; B is a group selected from the groups represented by the general formulas, where R7, R8, R9 and R10 are alkyl groups; a and b are each 0 or integers of 1W3 and a+b=3.
COPYRIGHT: (C)1981,JPO&Japio
JP7905879A 1979-06-25 1979-06-25 Heat-resistant resin composition Pending JPS564647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7905879A JPS564647A (en) 1979-06-25 1979-06-25 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7905879A JPS564647A (en) 1979-06-25 1979-06-25 Heat-resistant resin composition

Publications (1)

Publication Number Publication Date
JPS564647A true JPS564647A (en) 1981-01-19

Family

ID=13679289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7905879A Pending JPS564647A (en) 1979-06-25 1979-06-25 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS564647A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
US5114994A (en) * 1990-03-23 1992-05-19 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition for sealing semiconductor
JP2015187209A (en) * 2014-03-26 2015-10-29 三菱化学株式会社 thermosetting resin composition
KR101590344B1 (en) * 2015-04-30 2016-02-01 주식회사 맥서브 Fire extinguishing equipment of road tunnels

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
US5114994A (en) * 1990-03-23 1992-05-19 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition for sealing semiconductor
JP2015187209A (en) * 2014-03-26 2015-10-29 三菱化学株式会社 thermosetting resin composition
KR101590344B1 (en) * 2015-04-30 2016-02-01 주식회사 맥서브 Fire extinguishing equipment of road tunnels

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