JPH0514726B2 - - Google Patents
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- Publication number
- JPH0514726B2 JPH0514726B2 JP60089042A JP8904285A JPH0514726B2 JP H0514726 B2 JPH0514726 B2 JP H0514726B2 JP 60089042 A JP60089042 A JP 60089042A JP 8904285 A JP8904285 A JP 8904285A JP H0514726 B2 JPH0514726 B2 JP H0514726B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- epoxy
- weight
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 22
- 229920003986 novolac Polymers 0.000 claims description 20
- 239000011342 resin composition Substances 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000005011 phenolic resin Substances 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 229920001568 phenolic resin Polymers 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 8
- 229930003836 cresol Natural products 0.000 claims description 8
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- -1 and among them Polymers 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FIHCECZPYHVEJO-UHFFFAOYSA-N ethoxy-dimethyl-phenylsilane Chemical compound CCO[Si](C)(C)C1=CC=CC=C1 FIHCECZPYHVEJO-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BKXVGDZNDSIUAI-UHFFFAOYSA-N methoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OC)C1=CC=CC=C1 BKXVGDZNDSIUAI-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Description
［発明の技術分野］
本発明は、半導体装置の封止用樹脂組成物に関
し、さらに詳しくは耐湿性、温寒サイクル性に優
れた、信頼性の高い封止用樹脂組成物に関するも
のである。
［発明の技術的背景とその問題点］
従来から、ダイオード、トランジスタ、集積回
路等の電子部品においては、熱硬化性樹脂を用い
て封止する樹脂封止法が行われてきた。この方法
はガラス、金属、セラミツクを用いたハーメチツ
クシール方式に比較して経済的に有利なため、広
く実用化されている。封止用樹脂としては、熱硬
化性樹脂が使用され、なかでも、信頼性および価
格の点からエポキシ樹脂の組成物が最も一般的に
用いられている。エポキシ樹脂組成物では、酸無
水物、芳香族アミン、ノボラツク型フエノール樹
脂等各種の硬化剤が使用されている。これらの中
でノボラツク型フエノール樹脂を硬化剤としたエ
ポキシ樹脂組成物は、他の硬化剤を使用したもの
に比べて、成形性、耐湿性に優れ、毒性がなく、
かつ安価であるため、半導体封止材料として広く
用いられている。
しかし、最近の半導体素子は、大形化、高密度
化の傾向が強まつているため、従来のノボラツク
型フエノール樹脂を硬化剤としたエポキシ樹脂組
成物で封止したものは、温寒サイクル試験を行う
と、ボンデイングワイヤのオープン、封止樹脂の
クラツク或いはペレツトのクラツクが発生して、
電子部品としての機能が果せず、信頼性に劣ると
いう問題があつた。また耐湿性試験を行つた場合
においても、温寒サイクル試験におけると同様な
現象が発生し大きな問題となつていた。
［発明の目的］
本発明の目的は、上記の問題点を解決するため
になされたもので耐湿性、温寒サイクルテスト、
成形性に優れた、信頼性の高い封止用樹脂組成物
を提供しようとするものである。
［発明の概要］
本発明者らは、上記の目的を達成しようと鋭意
研究を重ねた結果、エポキシ当量205以下のグレ
ゾールノボラツク型エポキシ樹脂と特定の有機け
い素化合物で表面処理した三酸化アンチモンを使
用した樹脂組成物が、優れた耐湿性、温寒サイク
ル性を有し、かつその他の特性もよく、封止用樹
脂組成物として好適なものであることを見いだ
し、本発明を完成したものである。即ち、本発明
は、
(A) エポキシ当量205以下のクレゾールノボラツ
ク型エポキシ樹脂、
(B) ノボラツク型フエノール樹脂、
(C) 一般式（）で示される有機けい素化合物で
表面処理された三酸化アンチモン
R′4-a−Si（―OR″）a …（）
（式中R′はアルキル基又はフエニル基を、
R″はアルキル基を、ａは１〜４の整数をそれ
ぞれ表す）
(D) 無機質充填材
を必須成分とするとともにハロゲン化エポキシ樹
脂を含まず、樹脂組成物に対して前記(C)表面処理
された三酸化アンチモンを0.1〜10重量％、(D)無
機質充填材を25〜90重量％それぞれ含有すること
を特徴とする封止用樹脂組成物である。そしてク
レゾールノボラツク型エポキシ樹脂のエポキシ基
(a)とノボラツク型フエノール樹脂のフエノール性
水酸基(b)とのモル比［(a)／(b)）］が0.1〜10の範
囲内である封止用樹脂組成物である。
本発明に用いる(A)エポキシ当量205以下のクレ
ゾールノボラツク型エポキシ樹脂としては、その
分子中にエポキシ基を少なくとも２個以上有する
とともにハロゲン原子を含まない化合物である限
り、分子構造、分子量などに特に制限はなく、一
般に使用されているクレゾールノボラツク型エポ
キシ樹脂を広く包含することができる。これらの
エポキシ樹脂は単独もしくは２種以上混合して用
いる。エポキシ樹脂のエポキシ当量は205以下で
あることが必要である。エポキシ当量が205を超
えると温寒サイクル性が悪くなり好ましくないか
らである。
本発明に用いる(B)ノボラツク型フエノール樹脂
としては、フエノール、アルキルフエノール等の
フエノール類とホルムアルデヒド或いはパラホル
ムアルデヒドを反応させて得られるノボラツク型
フエノール樹脂およびこれらの変性樹脂、例えば
エポキシ化もしくはブチル化ノボラツク型フエノ
ール樹脂等が挙げられ、これらは単独もしくは２
種以上混合して用いる。ノボラツク型フエノール
樹脂の配合割合は、前述の(A)エポキシ樹脂のエポ
キシ基(a)と(B)ノボラツク型フエノール樹脂のフエ
ノール性水酸基(b)とのモル比［(a)／(b)］が0.1〜
10の範囲内にあることが好ましい。モル比が0.1
未満もしくは10を超えると、耐湿性、成形作業性
および硬化物の電気特性が低下し、いずれの場合
も好ましくない。
本発明に用いる(C)特定の有機けい素化合物で表
面処理された三酸化アンチモンは、次の一般式で
示される有機けい素化合物で処理されたものであ
る。
R′4-a−Si（―OR″）a
（式中R′はアルキル基又はフエニル基を、
R″はアルキル基を、ａは１〜４の整数を表す）
具体的な化合物としては、メチルトリメトキシ
シラン、メチルトリエトキシシラン、ジメチルジ
メトキシシラン、ジメチルジエトキシシラン、ト
リメチルメトキシシラン、フエニルトリメトキシ
シラン、フエニルトリエトキシシラン、フエニル
ジメチルエトキシシラン、トリフエニルメトキシ
シランが挙げられ、これらは単独もしくは混合し
て使用する。三酸化アンチモンを表面処理する有
機けい素化合物の量は、三酸化アンチモン100重
量部に対して0.01〜20重量部の範囲であることが
好ましい。処理量が0.01重量部未満では、耐湿性
に効果はなく、また20重量部を超えると機械的強
度が低下し、いずれの場合も好ましくない。従つ
て上記範囲内であることが好ましい。このような
割合の有機けい素化合物で処理された三酸化アン
チモンは、樹脂組成物に対して0.1〜10重量％含
有することが好ましい。含有量が0.1重量％未満
では、耐湿性に効果がなく、また10重量％を超え
ると耐湿性が逆に悪化しいずれの場合も好ましく
ない。より好ましい配合量は0.5〜５重量％であ
る。
本発明に用いる(D)無機質充填材としては、シリ
カ粉末、アルミナ、タルク、炭酸カルシウム、チ
タンホワイト、クレー、アスベスト、マイカ、ベ
ンガラ、ガラス繊維、炭素繊維等が挙げられ、こ
れらは単独又は２種以上混合して使用する。これ
らの無機質充填材の中でも特にシリカ粉末および
アルミナが有効で好ましい。無機質充填材の配合
割合は、樹脂組成物の25〜90重量％である必要が
ある。配合量が25重量％未満では、耐湿性、機械
的特性、および成形性に効果なく、90重量％を超
るとかさばりが大きくなり、成形性が悪く実用に
適さない。
本発明の封止用樹脂組成物は、エポキシ当量
205以下のクレゾールノボラツク型エポキシ樹脂、
ノボラツク型フエノール樹脂、特定の有機けい素
化合物で表面処理された三酸化アンチモンおよび
無機質充填材を必須成分とするが、本発明の効果
を阻害しない限度において、必要に応じて例えば
天然ワツクス類、直鎖脂肪酸の金属塩、酸アミド
類、エステル類、パラフイン類などの離型剤、カ
ーボンブラツク、ベンガラなどの着色剤などを適
宜添加配合することができる。
本発明の封止用樹脂組成物を成形材料とする場
合の一般的方法は、まず三酸化アンチモンに
（）式の有機けい素化合物を添加してミキサー
等で十分均一に混合して表面処理を行う。この表
面処理済み三酸化アンチモンと無機質充填材とを
高速流動式混合機で均一に混合し、次いでエポキ
シ樹脂、ノボラツク型フエノール樹脂、その他原
料を所定の組成比に選択してミキサー等で十分均
一に混合した後、更に熱ロールによる溶融混合処
理、またはニーダ等による混合処理を行い、そし
て冷却固化させ、適当な大きさに粉砕して成形材
料とすることができる。
［発明の実施例］
次に本発明を実施例により具体的に説明するが
本発明は以下の実施例に限定されるものではな
い。以下の実施例および比較例において「％」と
あるのは「重量％」を意味する。
実施例
三酸化アンチモンにフエニルトリメトキシシラ
ンを添加し、高速流動式混合機で均一に混合して
三酸化アンチモンの表面処理をした。この処理済
の三酸化アンチモン３％とシリカ粉末69％を高速
流動式混合機で15分間混合し、次いでクレゾール
ノボラツク型エポキシ樹脂（エポキシ当量190）
18％とノボラツク型フエノール樹脂（フエノール
当量107）10％とを常温で添加混合し、90〜95℃
のロールで十分混練して樹脂組成物を製造した。
これを冷却した後粉砕し成形材料とした。
比較例
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）20％に、ノボラツク型フエノール樹脂
（フエノール当量107）10％およびシリカ粉末70％
を配合し、実施例と同様にして樹脂組成物および
成形材料を得た。
実施例および比較例で得られた成形材料を用い
てタブレツト化し、予熱してトランスフアー成形
で170℃に加熱した金型内に注入し、硬化させて
成形品とした。これらの成形品について、耐湿
性、温寒サイクルを試験した。その結果を第１表
に示したが本発明の顕著な効果が認められた。
[Technical Field of the Invention] The present invention relates to a resin composition for encapsulating a semiconductor device, and more particularly to a highly reliable resin composition for encapsulating that has excellent moisture resistance and thermal/cold cycling properties. [Technical Background of the Invention and Problems Therewith] Conventionally, electronic components such as diodes, transistors, and integrated circuits have been sealed using a resin encapsulation method using a thermosetting resin. This method is economically advantageous compared to hermetic seal systems using glass, metal, or ceramic, and is therefore widely put into practical use. Thermosetting resins are used as the sealing resin, and among them, epoxy resin compositions are most commonly used in terms of reliability and cost. Epoxy resin compositions use various curing agents such as acid anhydrides, aromatic amines, and novolac type phenolic resins. Among these, epoxy resin compositions using novolak type phenolic resin as a curing agent have excellent moldability and moisture resistance, are non-toxic, and have excellent moldability and moisture resistance compared to those using other curing agents.
Since it is also inexpensive, it is widely used as a semiconductor encapsulation material. However, as recent semiconductor devices tend to be larger and more dense, devices encapsulated with epoxy resin compositions using conventional novolac type phenolic resin as a curing agent have been tested in hot and cold cycles. If this is done, an open bonding wire, a crack in the sealing resin, or a crack in the pellet may occur.
There was a problem that it could not function as an electronic component and was inferior in reliability. Furthermore, even when a moisture resistance test was conducted, the same phenomenon as in the hot/cold cycle test occurred, posing a major problem. [Object of the Invention] The object of the present invention is to solve the above-mentioned problems.
The present invention aims to provide a highly reliable sealing resin composition with excellent moldability. [Summary of the Invention] As a result of intensive research aimed at achieving the above object, the inventors of the present invention have developed a gresol novolak type epoxy resin with an epoxy equivalent of 205 or less and a trioxide surface treated with a specific organosilicon compound. The inventors have discovered that a resin composition using antimony has excellent moisture resistance, thermal cycleability, and other properties, and is suitable as a resin composition for sealing, and has completed the present invention. It is something. That is, the present invention provides (A) a cresol novolac type epoxy resin having an epoxy equivalent of 205 or less, (B) a novolac type phenol resin, and (C) a trioxide surface-treated with an organosilicon compound represented by the general formula (). Antimony R′ 4-a −Si(—OR″) a … () (In the formula, R′ is an alkyl group or a phenyl group,
(R'' represents an alkyl group, and a represents an integer from 1 to 4.) (D) The resin composition contains an inorganic filler as an essential component and does not contain a halogenated epoxy resin, and the resin composition is subjected to the above (C) surface treatment. This is a sealing resin composition characterized by containing 0.1 to 10% by weight of antimony trioxide and 25 to 90% by weight of (D) an inorganic filler. base
This is a sealing resin composition in which the molar ratio [(a)/(b))] between (a) and the phenolic hydroxyl group (b) of the novolak type phenolic resin is within the range of 0.1 to 10. The cresol novolac type epoxy resin (A) with an epoxy equivalent of 205 or less used in the present invention is a compound that has at least two epoxy groups in its molecule and does not contain a halogen atom. There are no particular limitations, and a wide range of commonly used cresol novolac type epoxy resins can be included. These epoxy resins may be used alone or in combination of two or more. The epoxy equivalent of the epoxy resin needs to be 205 or less. This is because if the epoxy equivalent exceeds 205, the thermal cycleability deteriorates, which is not preferable. The novolak type phenolic resin (B) used in the present invention includes novolak type phenolic resins obtained by reacting phenols such as phenols and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as epoxidized or butylated novolaks. type phenolic resins, etc., and these may be used alone or in combination of two
Use by mixing more than one species. The blending ratio of the novolak type phenolic resin is the molar ratio of the epoxy group (a) of the above-mentioned (A) epoxy resin and the phenolic hydroxyl group (b) of the novolak type phenolic resin (B) [(a)/(b)] is 0.1~
It is preferably within the range of 10. molar ratio is 0.1
If it is less than or exceeds 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, and either case is unfavorable. The antimony trioxide surface-treated with a specific organosilicon compound (C) used in the present invention is one treated with an organosilicon compound represented by the following general formula. R′ 4-a −Si(—OR″) a (in the formula, R′ is an alkyl group or a phenyl group,
(R'' represents an alkyl group, and a represents an integer from 1 to 4) Specific compounds include methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, trimethylmethoxysilane, and phenyltrimethoxysilane. Examples include methoxysilane, phenyltriethoxysilane, phenyldimethylethoxysilane, and triphenylmethoxysilane, which are used alone or in combination.The amount of organosilicon compound for surface treatment of antimony trioxide is The amount is preferably in the range of 0.01 to 20 parts by weight per 100 parts by weight of antimony.If the amount is less than 0.01 parts by weight, there will be no effect on moisture resistance, and if it exceeds 20 parts by weight, mechanical strength will decrease. In either case, it is not preferable. Therefore, it is preferable that it is within the above range. Antimony trioxide treated with an organosilicon compound in such a proportion should be contained in an amount of 0.1 to 10% by weight based on the resin composition. is preferable. If the content is less than 0.1% by weight, there is no effect on moisture resistance, and if it exceeds 10% by weight, moisture resistance deteriorates, which is not preferable in either case. A more preferable blending amount is 0.5 to 5% by weight. Examples of the inorganic filler (D) used in the present invention include silica powder, alumina, talc, calcium carbonate, titanium white, clay, asbestos, mica, red iron, glass fiber, carbon fiber, etc. Alternatively, two or more types of inorganic fillers may be used in combination. Among these inorganic fillers, silica powder and alumina are particularly effective and preferred. The blending ratio of the inorganic fillers must be 25 to 90% by weight of the resin composition. If the amount is less than 25% by weight, it will have no effect on moisture resistance, mechanical properties, and moldability, and if it exceeds 90% by weight, it will be bulky and have poor moldability, making it unsuitable for practical use. The resin composition has an epoxy equivalent
Cresol novolak type epoxy resin below 205,
The essential components are a novolak type phenolic resin, antimony trioxide surface-treated with a specific organosilicon compound, and an inorganic filler, but if necessary, for example, natural waxes, direct Mold release agents such as metal salts of chain fatty acids, acid amides, esters, paraffins, and coloring agents such as carbon black and red iron can be appropriately added and blended. The general method for using the encapsulating resin composition of the present invention as a molding material is to first add an organic silicon compound of the formula () to antimony trioxide, mix thoroughly and uniformly with a mixer, etc., and then apply surface treatment. conduct. The surface-treated antimony trioxide and the inorganic filler are mixed uniformly using a high-speed fluid mixer, and then the epoxy resin, novolac type phenolic resin, and other raw materials are selected at a predetermined composition ratio, and the mixture is sufficiently uniformly mixed using a mixer, etc. After mixing, the mixture can be further melt-mixed using hot rolls or mixed using a kneader, cooled and solidified, and pulverized into an appropriate size to form a molding material. [Examples of the Invention] Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples. In the following Examples and Comparative Examples, "%" means "% by weight". Example Phenyltrimethoxysilane was added to antimony trioxide and mixed uniformly in a high-speed fluid mixer to perform surface treatment of antimony trioxide. This treated antimony trioxide (3%) and silica powder (69%) were mixed for 15 minutes in a high-speed flow mixer, and then cresol novolac type epoxy resin (epoxy equivalent: 190) was mixed.
18% and 10% novolac type phenolic resin (phenol equivalent: 107) were added and mixed at room temperature, and heated to 90-95℃.
A resin composition was prepared by sufficiently kneading the mixture using a roll.
After cooling, this was crushed to obtain a molding material. Comparative example: 20% cresol novolak epoxy resin (epoxy equivalent weight 215), 10% novolak type phenolic resin (phenol equivalent weight 107) and 70% silica powder.
A resin composition and a molding material were obtained in the same manner as in the examples. The molding materials obtained in Examples and Comparative Examples were made into tablets, injected into a mold that had been preheated and heated to 170°C by transfer molding, and cured to form a molded product. These molded products were tested for moisture resistance and hot/cold cycles. The results are shown in Table 1, and the remarkable effects of the present invention were recognized.
【表】【table】
【表】
［発明の効果］
以上の説明から明らかなように、本発明の封止
用樹脂組成物は、耐湿性、温寒サイクル性、耐熱
性に優れ、かつ成形作業性がよく信頼性の高い組
成物であるため、電子・電気部品の封止、被覆絶
縁などに用いた場合、優れた特性および十分な信
頼性を得ることができる。[Table] [Effects of the Invention] As is clear from the above description, the encapsulating resin composition of the present invention has excellent moisture resistance, hot/cold cycling properties, and heat resistance, and has good moldability and reliability. Because of its high composition, it can provide excellent properties and sufficient reliability when used for sealing electronic/electrical parts, coating insulation, etc.
Claims (1)
ラツク型エポキシ樹脂、 (B) ノボラツク型フエノール樹脂、 (C) 一般式（）で示される有機けい素化合物で
表面処理された三酸化アンチモン R′4-a−Si（―OR″）a …（） （式中R′はアルキル基又はフエニル基を、
R″はアルキル基を、ａは１〜４の整数をそれ
ぞれ表す） (D) 無機質充填材 を必須成分とするとともにハロゲン化エポキシ樹
脂を含まず、樹脂組成物に対して前記(C)表面処理
された三酸化アンチモンを0.1〜10重量％、(D)無
機質充填材を25〜90重量％それぞれ含有すること
を特徴とする封止用樹脂組成物。 ２ クレゾールノボラツク型エポキシ樹脂のエポ
キシ基(a)とノボラツク型フエノール樹脂のフエノ
ール性水酸基(b)とのモル比［(a)／(b)）］が0.1〜
10の範囲内である特許請求の範囲第１項記載の封
止用樹脂組成物。[Scope of Claims] 1 (A) a cresol novolac type epoxy resin having an epoxy equivalent of 205 or less, (B) a novolac type phenolic resin, (C) a three-dimensional resin surface-treated with an organosilicon compound represented by the general formula (). Antimony oxide R′ 4-a −Si(—OR″) a … () (In the formula, R′ is an alkyl group or a phenyl group,
(R'' represents an alkyl group, and a represents an integer from 1 to 4.) (D) The resin composition contains an inorganic filler as an essential component and does not contain a halogenated epoxy resin, and the resin composition is subjected to the above (C) surface treatment. A sealing resin composition characterized by containing 0.1 to 10% by weight of antimony trioxide and 25 to 90% by weight of (D) an inorganic filler. 2 Epoxy group of cresol novolak type epoxy resin ( The molar ratio of a) to the phenolic hydroxyl group (b) of the novolak type phenolic resin [(a)/(b))] is 0.1 to
10. The sealing resin composition according to claim 1, which is within the range of 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8904285A JPS61247753A (en) | 1985-04-26 | 1985-04-26 | Sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8904285A JPS61247753A (en) | 1985-04-26 | 1985-04-26 | Sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61247753A JPS61247753A (en) | 1986-11-05 |
| JPH0514726B2 true JPH0514726B2 (en) | 1993-02-25 |
Family
ID=13959835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8904285A Granted JPS61247753A (en) | 1985-04-26 | 1985-04-26 | Sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61247753A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5755921A (en) * | 1980-09-18 | 1982-04-03 | Mitsubishi Gas Chem Co Inc | Water-resistant epoxy resin composition |
| JPS6084337A (en) * | 1983-10-14 | 1985-05-13 | Hitachi Ltd | Flame-retardant resin composition and its use |
| JPS6178823A (en) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | Epoxy resin composition |
-
1985
- 1985-04-26 JP JP8904285A patent/JPS61247753A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5755921A (en) * | 1980-09-18 | 1982-04-03 | Mitsubishi Gas Chem Co Inc | Water-resistant epoxy resin composition |
| JPS6084337A (en) * | 1983-10-14 | 1985-05-13 | Hitachi Ltd | Flame-retardant resin composition and its use |
| JPS6178823A (en) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | Epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61247753A (en) | 1986-11-05 |
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