JPH0468345B2 - - Google Patents
Info
- Publication number
- JPH0468345B2 JPH0468345B2 JP669285A JP669285A JPH0468345B2 JP H0468345 B2 JPH0468345 B2 JP H0468345B2 JP 669285 A JP669285 A JP 669285A JP 669285 A JP669285 A JP 669285A JP H0468345 B2 JPH0468345 B2 JP H0468345B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- epoxy
- resins
- silica powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 20
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 239000000843 powder Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 229920003986 novolac Polymers 0.000 description 13
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 12
- 229910002026 crystalline silica Inorganic materials 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 239000005350 fused silica glass Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229930003836 cresol Natural products 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000004843 novolac epoxy resin Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
Description
［発明の技術分野］
本発明は、特性バランスの優れた封止用樹脂組
成物に関する。
［発明の技術的背景とその問題点］
従来、ダイオード、トランジスタ、集積回路等
の電子部品を、熱硬化性樹脂を用いて封止する方
法が行われてきた。この樹脂封止は、ガラス、金
属、セラミツクを用いたハーメチツクシール方式
に比較して経済的に有利なため、広く実用化され
ている。封止用樹脂としては、熱硬化性樹脂の中
でも信頼性および価格の点から、エポキシ樹脂が
最も一般的に用いられている。エポキシ樹脂に
は、酸無水物、芳香族アミン、ノボラツク型フエ
ノール樹脂等の硬化剤が用いられている。硬化剤
の中でも、ノボラツク型フエノール樹脂を硬化剤
としたエポキシ樹脂は、他の硬化剤を使用したも
のに比べて、成形性、耐湿性に優れ、毒性がな
く、かつ、安価であるため半導体封止用樹脂とし
て広く使用されている。また充填剤としては、溶
融シリカ粉末や結晶性シリカ粉末が前記の硬化剤
と共に、最も一般的に使用されている。近年、半
導体部品の高密度化、大電力化に伴ない熱放散性
のより優れた半導体封止用樹脂が要望されてき
た。
ところがノボラツク型フエノール樹脂を硬化剤
としたエポキシ樹脂と溶融シリカ粉末とからなる
樹脂組成物は、熱膨脹係数が小さく、耐湿性が良
く、温寒サイクル試験によるボンデイングワイヤ
のオープン、樹脂クラツク、ペレツトクラツク等
に優れているという特徴を有するものの、熱伝導
率が小さいため熱放散が悪く、消費電力の大きい
電力用半導体装置では、その機能が果せなくなる
欠点がある。一方、ノボラツク型フエノール樹脂
を硬化剤としたエポキシ樹脂と結晶性シリカ粉末
とからなる樹脂組成物は、熱伝導率が大きくなつ
て、熱放散も良好であるが、熱膨脹係数が大き
く、また耐湿性に対する信頼性が悪いという欠点
がある。そしてこの樹脂組成物から得られる成形
品は、機械的特性や成形性が低下する傾向があ
る。また溶融シリカや結晶性シリカ粉末の配合割
合を上げると、熱伝導率、熱放散性が良好とな
り、しかも熱膨脹係数も小さくなるが、溶融シリ
カ粉末や結晶性シリカ粉末の分散性が低下し、ま
たコンパウンドの粘度が増加し成形性が悪くなつ
て実用に適さない欠点があり、従つて封止用樹脂
組成物の高熱伝導化にはおのずから限界があつ
た。
［発明の目的］
本発明は、前記の欠点を解消するためになされ
たもので、その目的は、熱伝導率が大きく熱放散
性に優れ、熱膨脹係数が小さく、耐湿性に対する
信頼性も高く、かつ、成形性のよい特性バランス
のよい封止用樹脂組成物を提供しようとするもの
である。
［発明の概要］
本発明者らは、上記の目的を達成しようと鋭意
検討を重ねた結果、９，10−ジハイドロ−９−オ
キサ−10−ホスフアフエナントレン−10−オキサ
イドを配合すれば、熱伝導率が大きく、熱膨脹係
数が小さく、耐湿信頼性、成形性に優れるなど、
上記目的を満足させることを見いだし、本発明に
至つたものである。
即ち、本発明は、
(A) エポキシ樹脂、
(B) ノボラツク型フエノール樹脂、
(C) ９，10−ジハイドロ−９−オキサ−10−ホス
フアフエナントレン−10−オキサイドおよび
(D) 無機質充填材
を必須成分とし、(C)の９，10−ジハイドロ−９−
オキサ−10−ホスフアフエナントレン−10−オキ
サイドを、樹脂組成物に対して0.02〜5.0重量％
含有することを特徴とする封止用樹脂組成物で、
無機質充填材を樹脂組成物に対して30〜90重量％
含有することが望ましいものである。
本発明に用いる(A)エポキシ樹脂は、その分子中
にエポキシ基を少なくとも２個有する化合物であ
る限り、分子構造、分子量等に特に制限はなく、
一般に使用されているものを広く含むことができ
る。例えば、ビスフエノールＡ型エポキシ樹脂、
フエノールノボラツク型エポキシ樹脂、クレゾー
ルノボラツク型エポキシ樹脂などのグリシジルエ
ーテル型エポキシ樹脂が挙げられ、またグリシジ
ルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族エポキシ樹脂、脂環式
エポキシ樹脂、複素環型エポキシ樹脂、ハロゲン
化エポキシ樹脂、更に次の一般式で示されるエポ
キシノボラツク系樹脂が挙げられる。
（但し、式中R1は水素原子、ハロゲン原子又
はアルキル基を、R2は水素原子又はアルキル基
を、ｎは１以上の整数をそれぞれ表す）
これらのエポキシ樹脂は１種もしくは２種以上
混合して使用する。
本発明に用いる(B)ノボラツク型フエノール樹脂
としては、フエノール、アルキルフエノール等の
フエノール類とホルムアルデヒド或いはパラホル
ムアルデヒドを反応させて得られるノボラツク型
フエノール樹脂およびこれらの変性樹脂、例えば
フエノールノボラツク樹脂、クレゾールノボラツ
ク樹脂、tert−ブチルフエノールノボラツク樹
脂、ノニルフエノールノボラツク樹脂等が挙げら
れる。これらは単独もしくは２種以上混合して使
用する。これらのノボラツク型フエノール樹脂は
エポキシ樹脂の硬化剤として使用するものである
からその配合比が著しくアンバランスにならない
ようにすることが望ましい。
本発明に用いる(C)９，10−ジハイドロ−９−オ
キサ−10−ホスフアフエナントレン−10−オキサ
イドとしては、次の構造式を有するもので本発明
の最も重要な成分をなすものである。
この９，10−ジハイドロ−９−オキサ−10−ホ
スフアフエナントレン−10−オキサイドの配合量
は、樹脂組成物に対して0.02〜5.0重量％含有す
ることが好ましい。その理由は、0.02重量％未満
であると無機質充填材の分散性に効果なくまた粘
度が増加し好ましくない。また5.0重量％を超え
ると効果がそれ以上あがらずまたコスト高となり
好ましくない。従つて、上記の範囲であれば、無
機質充填材の分散性がよく、熱伝導率が大きく、
熱膨脹係数が小さい、耐湿性も良い組成物とな
る。
本発明に用いる(D)無機質充填材としては、シリ
カ粉末、アルミナ粉末、三酸化アンチモン、タル
ク、炭酸カルシウム、チタンホワイト、クレー、
マイカ、ベンガラ、ガラス繊維、炭素繊維等が挙
げられ、これらは単独もしくは２種以上混合して
用いる。無機質充填材の配合量は、用途、樹脂分
によつても異なるが、樹脂組成物に対して30〜90
重量％含有することが望ましい。30重量％未満あ
るいは90重量％を超えると成形性が悪く実用に適
さない。
本発明の封止用樹脂組成物は、(A)エポキシ樹
脂、(B)ノボラツク型フエノール樹脂、(C)９，10−
ジハイドロ−９−オキサ−10−ホスフアフエナン
トレン−10−オキサイドおよび(D)無機質充填材を
必須成分とするが、必要に応じて、例えば天然ワ
ツクス類、合成ワツクス類、直鎖脂肪酸の金属
塩、酸アミドもしくはエステル類、パラフイン類
等の離型剤、塩素化パラフイン、ブロムトルエ
ン、ヘキサブロムベンゼン、三酸化アンチモン等
の難燃剤、カーボンブラツク、ベンガラ等の着色
剤、シランカツプリング剤、種々の硬化促進剤な
どを適宜添加配合することができる。
本発明の封止用樹脂組成物を成形材料として調
製する場合の一般的な方法としては、前述のエポ
キシ樹脂、ノボラツク型フエノール樹脂、９，10
−ジハイドロ−９−オキサ−10−ホスフアフエナ
ントレン−10−オキサイドおよび無機質充填材そ
の他を配合し、ミキサー等によつて十分均一に混
合した後、更に熱ロールによる溶融混合処理、又
はニーダ等による混合処理を行い、次いで冷却固
化させ適当な大きさに粉砕して成形材料とするこ
とができる。そしてこの成形材料を電子部品ある
いは電気部品の封止、被覆、絶縁等に適用し、優
れた特性と信頼性を付与させることができる。
［発明の実施例］
次に本発明を実施例により具体的に説明する
が、本発明は以下の実施例に限定されるものでは
ない。実施例および比較例において「％」とある
のは「重量％」を意味する。
実施例 １
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）18％に、ノボラツク型フエノール樹脂
（フエノール当量107）９％、結晶性シリカ粉末
69.5％、９，10−ジハイドロ−９−オキサ−10−
ホスフアフエナントレン−10−オキサイド0.5％、
離型剤等３％を常温で混合し、更に90〜95℃で混
練して封止用樹脂組成物を製造した。
実施例 ２
実施例１における結晶性シリカ粉末69.5％の代
わりに、六方晶型窒化ケイ素粉末30％と結晶性シ
リカ粉末40％を用いた以外はすべて実施例１と同
一にして封止用樹脂組成物を製造した。
実施例 ３
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）10％に、ノボラツク型フエノール樹脂
（フエノール当量107）５％、結晶性シリカ粉末
81.5％、９，10−ジハイドロ−９−オキサ−10−
ホスフアフエナントレン−10−オキサイド0.5％、
離型剤等３％を常温で混合し、更に90〜95℃で混
練して封止用樹脂組成物を製造した。
比較例 １
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）18％に、ノボラツク型フエノール樹脂
（フエノール当量107）９％、溶融シリカ粉末70
％、離型剤等３％を実施例１と同様に操作処理し
て封止用樹脂組成物を製造した。
比較例 ２
比較例１における溶融シリカ粉末70％の代わり
に結晶性シリカ粉末70％を用いた以外はすべて比
較例１と同一にして封止用樹脂組成物を製造し
た。
比較例 ３
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）10％に、ノボラツク型フエノール樹脂
（フエノール当量107）５％、結晶性シリカ粉末85
％、離型剤等３％を比較例１と同様にして封止用
樹脂組成物を製造した。
上記の実施例および比較例で製造した６種の封
止用樹脂組成物をそれぞれ粉砕して成形材料と
し、この成形材料をタブレツト化し、予熱してト
ランスフアー成形で、170℃に加熱した金型内に
注入硬化させて成形品を得た。得られた成形品に
ついて熱伝導率、熱膨脹係数を試験したので、第
１表に示した。同表の結果から本発明の組成物は
比較例に比べて同等又は優れていることが判る。
また成形性、耐湿性も試験したので第１表に示し
たが本発明の組成物が成形性・耐湿性に優れてい
ることが判る。
[Technical Field of the Invention] The present invention relates to a sealing resin composition with excellent balance of properties. [Technical Background of the Invention and Problems thereof] Conventionally, methods have been used to seal electronic components such as diodes, transistors, and integrated circuits using thermosetting resins. This resin sealing is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. Among thermosetting resins, epoxy resin is most commonly used as the sealing resin in terms of reliability and cost. For epoxy resins, curing agents such as acid anhydrides, aromatic amines, and novolac type phenolic resins are used. Among hardeners, epoxy resins using novolac type phenolic resins are popular for semiconductor encapsulation because they have excellent moldability and moisture resistance, are non-toxic, and are inexpensive compared to those using other hardeners. Widely used as a stopper resin. Further, as the filler, fused silica powder and crystalline silica powder are most commonly used together with the above-mentioned curing agent. BACKGROUND ART In recent years, with the increase in the density and power consumption of semiconductor components, there has been a demand for semiconductor encapsulation resins with better heat dissipation properties. However, a resin composition made of epoxy resin and fused silica powder using a novolak type phenolic resin as a curing agent has a small coefficient of thermal expansion, good moisture resistance, and is resistant to bonding wire opens, resin cracks, pellet cracks, etc. in hot and cold cycle tests. Although it has excellent characteristics, it has a drawback that it has poor heat dissipation due to its low thermal conductivity, and cannot perform its function in a power semiconductor device that consumes a large amount of power. On the other hand, a resin composition consisting of an epoxy resin using a novolak type phenolic resin as a curing agent and crystalline silica powder has a high thermal conductivity and good heat dissipation, but has a large coefficient of thermal expansion and is not moisture resistant. It has the disadvantage of poor reliability. Molded articles obtained from this resin composition tend to have poor mechanical properties and moldability. In addition, increasing the blending ratio of fused silica and crystalline silica powder improves thermal conductivity and heat dissipation, and also reduces the coefficient of thermal expansion, but the dispersibility of fused silica powder and crystalline silica powder decreases, and The viscosity of the compound increases and the moldability deteriorates, making it unsuitable for practical use.Therefore, there is a natural limit to the ability to increase the thermal conductivity of a sealing resin composition. [Object of the Invention] The present invention has been made in order to eliminate the above-mentioned drawbacks, and its objects are to have a high thermal conductivity, excellent heat dissipation, a small coefficient of thermal expansion, and high reliability in moisture resistance. In addition, the present invention aims to provide a sealing resin composition with good moldability and well-balanced properties. [Summary of the Invention] As a result of intensive studies to achieve the above object, the present inventors found that by blending 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, It has high thermal conductivity, low coefficient of thermal expansion, excellent moisture resistance and moldability, etc.
It has been discovered that the above object is satisfied, and the present invention has been achieved. That is, the present invention comprises (A) an epoxy resin, (B) a novolak type phenolic resin, (C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and (D) an inorganic filler. is an essential component, and 9,10-dihydro-9- of (C)
Oxa-10-phosphaphenanthrene-10-oxide is added in an amount of 0.02 to 5.0% by weight based on the resin composition.
A sealing resin composition characterized by containing:
30 to 90% by weight of inorganic filler based on the resin composition
It is desirable to include it. The epoxy resin (A) used in the present invention is not particularly limited in molecular structure, molecular weight, etc., as long as it is a compound having at least two epoxy groups in its molecule.
A wide range of commonly used items can be included. For example, bisphenol A type epoxy resin,
Examples include glycidyl ether type epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins, as well as glycidyl ester type epoxy resins, glycidylamine type epoxy resins, linear aliphatic epoxy resins, alicyclic epoxy resins, Examples include heterocyclic epoxy resins, halogenated epoxy resins, and epoxy novolak resins represented by the following general formula. (However, in the formula, R 1 represents a hydrogen atom, a halogen atom, or an alkyl group, R 2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more.) These epoxy resins may be used alone or as a mixture of two or more. and use it. The novolak type phenolic resin (B) used in the present invention includes novolak type phenolic resins obtained by reacting phenols such as phenols and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as phenol novolac resins and cresols. Examples include novolak resin, tert-butylphenol novolak resin, and nonylphenol novolak resin. These may be used alone or in combination of two or more. Since these novolac type phenolic resins are used as curing agents for epoxy resins, it is desirable that their blending ratios are not significantly unbalanced. The (C)9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide used in the present invention has the following structural formula and is the most important component of the present invention. . The amount of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide contained is preferably 0.02 to 5.0% by weight based on the resin composition. The reason is that if it is less than 0.02% by weight, it has no effect on the dispersibility of the inorganic filler and increases the viscosity, which is not preferable. Moreover, if it exceeds 5.0% by weight, the effect will not be further improved and the cost will increase, which is not preferable. Therefore, within the above range, the inorganic filler has good dispersibility, high thermal conductivity,
The result is a composition with a low coefficient of thermal expansion and good moisture resistance. Inorganic fillers (D) used in the present invention include silica powder, alumina powder, antimony trioxide, talc, calcium carbonate, titanium white, clay,
Examples include mica, red iron oxide, glass fiber, carbon fiber, etc., and these may be used alone or in combination of two or more. The blending amount of the inorganic filler varies depending on the application and resin content, but it is 30 to 90% of the resin composition.
It is desirable that the content be % by weight. If it is less than 30% by weight or more than 90% by weight, moldability is poor and it is not suitable for practical use. The sealing resin composition of the present invention comprises (A) an epoxy resin, (B) a novolac type phenolic resin, and (C) a 9,10-
Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and (D) inorganic filler are essential components, but if necessary, natural waxes, synthetic waxes, metal salts of straight chain fatty acids, etc. , acid amides or esters, mold release agents such as paraffins, chlorinated paraffins, flame retardants such as bromotoluene, hexabromobenzene, antimony trioxide, colorants such as carbon black and red iron, silane coupling agents, various A curing accelerator and the like can be added and blended as appropriate. A general method for preparing the sealing resin composition of the present invention as a molding material includes the above-mentioned epoxy resin, novolac type phenolic resin, 9,10
-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, inorganic filler, and other ingredients are blended and mixed sufficiently uniformly using a mixer, etc., and then melt-mixed using hot rolls or kneader, etc. A molding material can be obtained by performing a mixing treatment, then cooling and solidifying the mixture and pulverizing it into an appropriate size. This molding material can be applied to sealing, covering, insulating, etc. electronic or electrical components to impart excellent properties and reliability. [Examples of the Invention] Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples. In Examples and Comparative Examples, "%" means "% by weight". Example 1 Cresol novolac epoxy resin (epoxy equivalent: 215) 18%, novolac type phenolic resin (phenol equivalent: 107) 9%, crystalline silica powder
69.5%, 9,10-dihydro-9-oxa-10-
phosphaphenanthrene-10-oxide 0.5%,
3% of a mold release agent and the like were mixed at room temperature and further kneaded at 90 to 95°C to produce a sealing resin composition. Example 2 The sealing resin composition was the same as in Example 1 except that 30% hexagonal silicon nitride powder and 40% crystalline silica powder were used instead of 69.5% crystalline silica powder in Example 1. manufactured something. Example 3 10% cresol novolac epoxy resin (epoxy equivalent 215), 5% novolac type phenolic resin (phenol equivalent 107), crystalline silica powder
81.5%, 9,10-dihydro-9-oxa-10-
phosphaphenanthrene-10-oxide 0.5%,
3% of a mold release agent and the like were mixed at room temperature and further kneaded at 90 to 95°C to produce a sealing resin composition. Comparative Example 1 Cresol novolac epoxy resin (epoxy equivalent: 215) 18%, novolac type phenolic resin (phenol equivalent: 107) 9%, fused silica powder 70%
%, mold release agent, etc. in the same manner as in Example 1 to produce a sealing resin composition. Comparative Example 2 A sealing resin composition was produced in the same manner as in Comparative Example 1 except that 70% crystalline silica powder was used instead of 70% fused silica powder in Comparative Example 1. Comparative Example 3 10% cresol novolac epoxy resin (epoxy equivalent 215), 5% novolac type phenol resin (phenol equivalent 107), crystalline silica powder 85
%, mold release agent, etc. in the same manner as in Comparative Example 1 to produce a sealing resin composition. The six types of sealing resin compositions produced in the above Examples and Comparative Examples were each pulverized to form a molding material, and this molding material was made into a tablet, which was preheated and transferred into a mold heated to 170°C. A molded product was obtained by injecting and curing the molded product. The resulting molded articles were tested for thermal conductivity and thermal expansion coefficient, which are shown in Table 1. From the results in the same table, it can be seen that the compositions of the present invention are equivalent or superior to the comparative examples.
In addition, moldability and moisture resistance were also tested, which are shown in Table 1, and it can be seen that the composition of the present invention is excellent in moldability and moisture resistance.
【表】
［発明の効果］
本発明の封止用樹脂組成物は、熱伝導率が大き
く熱放散性がよく、また熱膨脹係数が小さく、耐
湿性、成形性に優れているため温寒サイクル試験
のボンデイングワイヤのオープン、樹脂クラツ
ク、ペレツトクラツクがなく消費電力の大きい電
力用半導体装置等の機器に好適である。更にこの
樹脂組成物は特性バランスに優れており、電子・
電気部品の封止用にすれば、十分な信頼性を付与
することができる。[Table] [Effects of the Invention] The encapsulating resin composition of the present invention has a high thermal conductivity, good heat dissipation, a small coefficient of thermal expansion, and excellent moisture resistance and moldability, so it was tested in hot and cold cycle tests. There are no open bonding wires, resin cracks, or pellet cracks, making it suitable for devices such as power semiconductor devices that consume large amounts of power. Furthermore, this resin composition has an excellent balance of properties and is suitable for electronic and
If used for sealing electrical parts, sufficient reliability can be provided.
Claims (1)
フアフエナントレン−10−オキサイドおよび (D) 無機質充填材 を必須成分とし、(C)の９，10−ジハイドロ−９−
オキサ−10−ホスフアフエナントレン−10−オキ
サイドを、樹脂組成物に対して0.02〜5.0重量％
含有することを特徴とする封止用樹脂組成物。 ２ 無機質充填材を樹脂組成物に対して30〜90重
量％含有する特許請求の範囲第１項記載の封止用
樹脂組成物。[Claims] 1 (A) epoxy resin, (B) novolac type phenolic resin, (C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and (D) inorganic filler (C) 9,10-dihydro-9-
Oxa-10-phosphaphenanthrene-10-oxide is added in an amount of 0.02 to 5.0% by weight based on the resin composition.
A sealing resin composition comprising: 2. The sealing resin composition according to claim 1, which contains an inorganic filler in an amount of 30 to 90% by weight based on the resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP669285A JPS61166822A (en) | 1985-01-19 | 1985-01-19 | Resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP669285A JPS61166822A (en) | 1985-01-19 | 1985-01-19 | Resin composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166822A JPS61166822A (en) | 1986-07-28 |
| JPH0468345B2 true JPH0468345B2 (en) | 1992-11-02 |
Family
ID=11645397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP669285A Granted JPS61166822A (en) | 1985-01-19 | 1985-01-19 | Resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166822A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10330596A (en) * | 1997-05-30 | 1998-12-15 | Sumitomo Bakelite Co Ltd | Flare-retardant resin composition and semiconductor sealing material prepared therefrom |
| JP3611435B2 (en) * | 1997-10-22 | 2005-01-19 | 住友ベークライト株式会社 | Flame retardant resin composition, prepreg and laminate using the same |
| US6486242B1 (en) * | 1999-04-20 | 2002-11-26 | Sumitomo Bakelite Company Limited | Flame-retardant resin composition and prepreg and laminate using the same |
| CN1423678B (en) * | 1999-12-13 | 2010-11-10 | 陶氏环球技术公司 | Flame retardant phosphorus element-containing epoxy resin compositions |
| JP4972247B2 (en) * | 1999-12-28 | 2012-07-11 | 日立化成工業株式会社 | Flame retardant thermosetting resin composition, prepreg using the same, and laminate for electric wiring board |
| JP4714970B2 (en) * | 2000-08-03 | 2011-07-06 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg, and copper-clad laminate using the same |
| JP2002060468A (en) * | 2000-08-16 | 2002-02-26 | Sumitomo Bakelite Co Ltd | Epoxy resin composition, prepreg, and copper-clad laminate using the prepreg |
| JP4729778B2 (en) * | 2000-09-13 | 2011-07-20 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg, and copper-clad laminate using the same |
| JP4729777B2 (en) * | 2000-09-13 | 2011-07-20 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg, and copper-clad laminate using the same |
| KR101141305B1 (en) * | 2009-03-31 | 2012-05-04 | 코오롱인더스트리 주식회사 | Phosphorus containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
-
1985
- 1985-01-19 JP JP669285A patent/JPS61166822A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166822A (en) | 1986-07-28 |
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