JPH0314050B2 - - Google Patents
Info
- Publication number
- JPH0314050B2 JPH0314050B2 JP58084947A JP8494783A JPH0314050B2 JP H0314050 B2 JPH0314050 B2 JP H0314050B2 JP 58084947 A JP58084947 A JP 58084947A JP 8494783 A JP8494783 A JP 8494783A JP H0314050 B2 JPH0314050 B2 JP H0314050B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- resin composition
- type phenolic
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 229920003986 novolac Polymers 0.000 claims description 12
- 239000005011 phenolic resin Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 6
- 239000012778 molding material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- -1 Bonding wire open Substances 0.000 description 1
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Description
[発明の技術分野]
本発明は耐湿性、耐熱性、機械的特性に優れた
封止用樹脂組成物に関する。
[発明の技術的背景とその問題点]
従来ダイオード、トランジスタ、集積回路の電
子部品を熱硬化性樹脂を用いて封止する方法が行
われてきた。この樹脂封止はガラス、金属、セラ
ミツクを用いたハーメチツクシール方式に比較し
て経済的に有利なため広く実用化されている。封
止用樹脂組成物としては、熱硬化性樹脂組成物の
中でも信頼性及び価格の点からエポキシ樹脂組成
物が最も一般的に用いられている。エポキシ樹脂
は、酸無水物、芳香族アミン、ノボラツク型フエ
ノール樹脂等の硬化剤が用いられている。
これらの中でノボラツク型フエノール樹脂を硬
化剤としたエポキシ樹脂組成物は、他の硬化剤を
使用したものに比べて、成形性、耐湿性に優れ、
毒性がなく且つ安価であるため半導体封止材料と
して広く用いられている。
しかしながら、ノボラツク型フエノール樹脂を
硬化剤としたエポキシ樹脂組成物は、電子部品の
高密度化に伴う耐湿性及び耐熱性に対する信頼性
に劣るという欠点がある。こうした樹脂組成物を
使用した成形品の温寒サイクルテストを行うと、
ボンデイングワイヤのオープン、樹脂クラツク、
ペレツトクラツクが発生し、電子部品としての機
能が果せず、また耐湿性試験を行うと上記と同じ
ような現象が発生し機能が果せなくなるという問
題があつた。また、同様の樹脂組成物を用いてフ
ラツトパツケージタイプの成形品を作成した場
合、組立工程におけるはんだ浸漬を行うと信頼性
が著しく悪くなる。こうしたことから耐湿性、耐
熱性、機械的特性に優れた封止用樹脂組成物の開
発が望まれていた。
[発明の目的]
本発明は、上記の欠点に鑑みてなされたもの
で、その目的は、耐湿性でしかも耐熱性でかつ優
れた機械的特性を有する封止用樹脂組成物を提供
しようとするものである。
[発明の概要]
本発明者らは、上記の目的を達成すべく鋭意研
究を重ねた結果、後述する封止用樹脂組成物が従
来のものに比べて優れた耐湿性と耐熱性を有し、
機械的特性も優れた封止用樹脂組成物に好適して
いることを見い出した。即ち本発明は、
(A) エポキシ樹脂
(B) ノボラツク型フエノール樹脂
(C) 黒鉛
(D) 無機質充填剤
を必須成分とし、樹脂組成物に対して前記無機質
充填剤を25〜90重量%含有することを特徴とする
封止用樹脂組成物である。
本発明に使用する(A)エポキシ樹脂は、その分子
中にエポキシ基を少なくとも2個有する化合物で
ある限り、分子構造、分子量などに特に制限はな
く、一般に使用されているものを広く包含するこ
とができる。たとえばビスフエノール型の芳香族
系、シクロヘキサン誘導体等の脂環族系、さらに
次の一般式で示されるエポキシノボラツク系等の
樹脂が挙げられる。
(式中、R1は水素原子、ハロゲン原子又はアル
キル基を、R2は水素原子又はアルキル基を、n
は1以上の整数を示す)これらのエポキシ樹脂は
1種又は2種以上混合して用いることもできる。
本発明に使用する(B)ノボラツク型フエノール樹
脂としては、フエノール、アルキルフエノール等
のフエノール類とホルムアルデヒドあるいはパラ
ホルムアルデヒドを反応させて得られるノボラツ
ク型フエノール樹脂およびこれらの変性樹脂例え
ばエポキシ化もしくはブチル化ノボラツク型フエ
ノール樹脂等が挙げられる。ノボラツク型フエノ
ール樹脂の配合割合は、前記(A)エポキシ樹脂のエ
ポキシ基(a)と(B)ノボラツク型フエノール樹脂のフ
エノール性水酸基(b)とのモル比(a/b)が、
0.1〜10の範囲内であることが好ましい。モル比
が0.1未満もしくは10を超えると耐湿性、成形作
業性および硬化物の電気特性が悪くなり、いずれ
の場合も好ましくない。
従つて上記範囲が好ましい。
本発明に使用する(C)黒鉛は、鱗状黒鉛、土状黒
鉛等の天然黒鉛および人造黒鉛等が挙げられる。
また本発明に使用する(D)無機質充填剤として
は、シリカ粉末、アルミナ、三酸化アンチモン、
タルク、炭酸カルシウム、チタンホワイト、クレ
ー、アスベストマイカ、ベンガラ、ガラス繊維、
炭素繊維等が挙げられ、特にシリカ粉末およびア
ルミナが好ましい。無機質充填剤の配合割合は、
樹脂組成物の25〜90重量%であることが好まし
い。25重量%未満では、耐湿性、耐熱性および機
械的特性、更に成形性に効果なく、90重量%を超
えるとかさばりが大きくなり、成形性が悪く実用
に適さない。
本発明の封止用樹脂組成物はエポキシ樹脂、ノ
ボラツク型フエノール樹脂、黒鉛、無機質充填剤
を必須成分とするが必要に応じて、例えば天然ワ
ツクス類、直鎖脂肪酸の金属塩、酸アミド類、エ
ステル類、もしくはパラフイン類などの離形剤、
塩素化パラフイン、ブロムトルエン、ヘキサブロ
ムベンゼン、三酸化アンチモン等の難燃剤、カー
ボンブラツク、ベンガラなどの着色剤、シランカ
ツプリング剤などを適宜添加配合しても差しつか
えない。
本発明の封止用樹脂組成物を成形材料として調
製する場合の一般的な方法としては、エポキシ樹
脂、ノボラツク型フエノール樹脂、黒鉛、無機質
充填剤、その他を所定の組成比に選んだ原料組成
分をミキサー等によつて十分均一に混合した後、
更に熱ロールによる溶融混合処理、またはニーダ
などによる混合処理を行い、次いで冷却固化させ
適当な大きさに粉砕して成形材料を得ることがで
きる。
本発明に係る封止用樹脂組成物を電子部品、電
気部品の封止、被覆、絶縁などに適用した場合に
優れた特性および信頼性を付与することができ
る。
[発明の効果]
本発明の封止用樹脂組成物は、耐湿性がよく、
耐熱性が高く、機械的特性に優れ、かつ成形作業
性のよい封止用樹脂組成物であるため電子、電気
部品の封止用等に用いた場合、十分な信頼性を得
ることができる。
[発明の実施例]
本発明を実施例により具体的に説明するが、本
発明は以下の実施例に限定されるものではない。
以下実施例において「%」とあるのは「重量%」
を意味する。
実施例 1
クレゾールノボラツクエポキシ樹脂(エポキシ
当量215)18%にノボラツク型フエノール樹脂
(フエノール当量107)12%、鱗状黒鉛1%、シリ
カ粉末69%を常温で混合し90〜95℃で混練して冷
却した後、粉砕して成形材料を得た。得られた成
形材料をタブレツト化し予熱してトランスフアー
成形で170℃に加熱した金型内に注入し硬化させ
て成形品を得た。この成形品について諸特性を測
定したので、その結果を第1表に示した。
実施例 2
クレゾールノボラツクエポキシ樹脂(エポキシ
当量215)16%にノボラツク型フエノール樹脂
(フエノール当量107)8%、土状黒鉛6%、シリ
カ粉末70%を実施例1と同様に操作処理して成形
材料とし、次いでその成形材料を用いて成形品を
得た。得られた成形品について諸特性を測定した
のでその結果を第1表に示した。
比較例 1
クレゾールノボラツクエポキシ樹脂(エポキシ
当量215)20%にノボラツク型フエノール樹脂
(フエノール当量107)10%、シリカ粉末70%を実
施例1と同様に操作処理して成形材料を得て、そ
れを用いて成形品を得た。得られた成形品につい
て諸特性を測定し結果を得たので第1表に示し
た。
[Technical Field of the Invention] The present invention relates to a sealing resin composition having excellent moisture resistance, heat resistance, and mechanical properties. [Technical Background of the Invention and Problems thereof] Conventionally, electronic components such as diodes, transistors, and integrated circuits have been sealed using thermosetting resins. This resin sealing is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. Among thermosetting resin compositions, epoxy resin compositions are most commonly used as sealing resin compositions in terms of reliability and cost. For epoxy resins, curing agents such as acid anhydrides, aromatic amines, and novolac type phenolic resins are used. Among these, epoxy resin compositions using novolak type phenolic resin as a curing agent have superior moldability and moisture resistance compared to those using other curing agents.
Since it is non-toxic and inexpensive, it is widely used as a semiconductor encapsulation material. However, epoxy resin compositions using novolak type phenolic resin as a curing agent have a drawback in that they are inferior in reliability with respect to moisture resistance and heat resistance, which is associated with the increasing density of electronic parts. When performing hot and cold cycle tests on molded products using such resin compositions,
Bonding wire open, resin crack,
Pellet cracks occurred, making it impossible to function as an electronic component, and when a moisture resistance test was conducted, the same phenomenon as above occurred and the product could no longer function. Furthermore, when a flat package type molded product is made using a similar resin composition, reliability will be significantly degraded if it is dipped in solder during the assembly process. For these reasons, it has been desired to develop a sealing resin composition with excellent moisture resistance, heat resistance, and mechanical properties. [Object of the Invention] The present invention was made in view of the above-mentioned drawbacks, and its purpose is to provide a sealing resin composition that is moisture resistant, heat resistant, and has excellent mechanical properties. It is something. [Summary of the Invention] As a result of intensive research aimed at achieving the above object, the present inventors have discovered that the sealing resin composition described below has superior moisture resistance and heat resistance compared to conventional compositions. ,
It has been found that the present invention is suitable for a sealing resin composition that also has excellent mechanical properties. That is, the present invention includes (A) an epoxy resin, (B) a novolac-type phenolic resin, (C) graphite, and (D) an inorganic filler as essential components, and the inorganic filler is contained in an amount of 25 to 90% by weight based on the resin composition. This is a sealing resin composition characterized by the following. The epoxy resin (A) used in the present invention is not particularly limited in molecular structure, molecular weight, etc., as long as it is a compound having at least two epoxy groups in its molecule, and may broadly include commonly used epoxy resins. Can be done. Examples include aromatic resins such as bisphenol, alicyclic resins such as cyclohexane derivatives, and epoxy novolac resins represented by the following general formula. (In the formula, R 1 is a hydrogen atom, a halogen atom, or an alkyl group, R 2 is a hydrogen atom or an alkyl group, n
represents an integer of 1 or more) These epoxy resins can be used alone or in combination of two or more. The novolak type phenolic resin (B) used in the present invention includes novolak type phenolic resins obtained by reacting phenols such as phenols and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof such as epoxidized or butylated novolaks. Examples include type phenolic resins. The blending ratio of the novolac type phenolic resin is such that the molar ratio (a/b) of the epoxy group (a) of the epoxy resin (A) and the phenolic hydroxyl group (b) of the novolac type phenolic resin (B) is as follows:
It is preferably within the range of 0.1 to 10. If the molar ratio is less than 0.1 or more than 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, and either case is unfavorable. Therefore, the above range is preferable. Examples of graphite (C) used in the present invention include natural graphite such as scale graphite and earthy graphite, and artificial graphite. In addition, the inorganic filler (D) used in the present invention includes silica powder, alumina, antimony trioxide,
Talc, calcium carbonate, titanium white, clay, asbestos mica, red iron, glass fiber,
Examples include carbon fiber, and silica powder and alumina are particularly preferred. The blending ratio of inorganic filler is
It is preferably 25 to 90% by weight of the resin composition. If it is less than 25% by weight, it has no effect on moisture resistance, heat resistance, mechanical properties, or moldability, and if it exceeds 90% by weight, it becomes bulky and has poor moldability, making it unsuitable for practical use. The sealing resin composition of the present invention contains an epoxy resin, a novolak type phenolic resin, graphite, and an inorganic filler as essential components, but may also include natural waxes, metal salts of straight chain fatty acids, acid amides, etc. as necessary. Mold release agents such as esters or paraffins,
Flame retardants such as chlorinated paraffin, bromotoluene, hexabromobenzene, and antimony trioxide, colorants such as carbon black and red iron oxide, and silane coupling agents may be appropriately added and blended. A general method for preparing the sealing resin composition of the present invention as a molding material is to use a raw material composition in which epoxy resin, novolak type phenolic resin, graphite, inorganic filler, and others are selected in a predetermined composition ratio. After mixing thoroughly and uniformly with a mixer etc.,
Furthermore, a molding material can be obtained by melting and mixing using hot rolls or mixing using a kneader, followed by cooling, solidifying, and pulverizing into an appropriate size. When the encapsulating resin composition according to the present invention is applied to encapsulating, coating, insulating, etc. electronic components and electrical components, excellent characteristics and reliability can be imparted. [Effect of the invention] The sealing resin composition of the present invention has good moisture resistance,
Since it is a sealing resin composition that has high heat resistance, excellent mechanical properties, and good moldability, sufficient reliability can be obtained when it is used for sealing electronic and electrical parts. [Examples of the Invention] The present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.
In the examples below, "%" means "% by weight"
means. Example 1 18% cresol novolac epoxy resin (epoxy equivalent 215), 12% novolac type phenolic resin (phenol equivalent 107), 1% scaly graphite, and 69% silica powder were mixed at room temperature and kneaded at 90 to 95°C. After cooling, it was crushed to obtain a molding material. The obtained molding material was made into a tablet, injected into a mold that had been preheated and heated to 170°C by transfer molding, and cured to obtain a molded product. Various properties of this molded article were measured and the results are shown in Table 1. Example 2 16% cresol novolac epoxy resin (epoxy equivalent 215), 8% novolac type phenol resin (phenol equivalent 107), 6% earthy graphite, and 70% silica powder were processed and molded in the same manner as in Example 1. A molded article was then obtained using the molding material. Various properties of the obtained molded article were measured and the results are shown in Table 1. Comparative Example 1 A molding material was obtained by treating 20% of cresol novolak epoxy resin (epoxy equivalent: 215), 10% of novolak type phenol resin (phenol equivalent: 107), and 70% of silica powder in the same manner as in Example 1. A molded article was obtained using the following method. Various properties of the obtained molded product were measured and the results are shown in Table 1.
【表】
本発明の実施例は比較例にくらべて耐湿性、耐
熱性および耐クラツク性において優れかつ機械的
特性についてはそれほど劣つていないことがわか
る。[Table] It can be seen that the examples of the present invention are superior to the comparative examples in moisture resistance, heat resistance, and crack resistance, and are not significantly inferior in mechanical properties.
Claims (1)
充填剤を25〜90重量%含有することを特徴とする
封止用樹脂組成物。 2 エポキシ樹脂のエポキシ基(a)とノボラツク型
フエノール樹脂のフエノール性水酸基(b)とのモル
比(a/b)が、0.1〜10の範囲内であることを
特徴とする特許請求の範囲第1項記載の封止用樹
脂組成物。[Scope of Claims] 1 (A) Epoxy resin (B) Novolak type phenolic resin (C) Graphite (D) An inorganic filler is an essential component, and the amount of the inorganic filler is 25 to 90% by weight based on the resin composition. A sealing resin composition comprising: 2. Claim No. 2 characterized in that the molar ratio (a/b) between the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolac type phenolic resin is within the range of 0.1 to 10. The sealing resin composition according to item 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8494783A JPS59210932A (en) | 1983-05-17 | 1983-05-17 | Sealing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8494783A JPS59210932A (en) | 1983-05-17 | 1983-05-17 | Sealing resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59210932A JPS59210932A (en) | 1984-11-29 |
JPH0314050B2 true JPH0314050B2 (en) | 1991-02-25 |
Family
ID=13844832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8494783A Granted JPS59210932A (en) | 1983-05-17 | 1983-05-17 | Sealing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59210932A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2232764A1 (en) * | 1998-03-13 | 1999-09-13 | Steven D. Johnson | Abrasion resistant graphite-containing epoxy powder coatings |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53127540A (en) * | 1977-04-13 | 1978-11-07 | Hitachi Ltd | Adhesive composition |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
-
1983
- 1983-05-17 JP JP8494783A patent/JPS59210932A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53127540A (en) * | 1977-04-13 | 1978-11-07 | Hitachi Ltd | Adhesive composition |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
Also Published As
Publication number | Publication date |
---|---|
JPS59210932A (en) | 1984-11-29 |
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