JPH0621154B2 - Sealing resin composition - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a resin composition for sealing a semiconductor device or the like, which is excellent in moisture resistance and does not cause cracks or wire open.

[Technical Background of the Invention and Problems Thereof] Conventionally, a method of sealing an electronic component of a diode, a transistor, or an integrated circuit with a thermosetting resin has been performed.
This resin encapsulation is economically advantageous compared to the hermetic sealing method using glass, metal, or ceramic,
Widely used in practice. As the sealing resin, a thermosetting resin is used, and among them, an epoxy resin is most commonly used in terms of reliability and price. Epoxy resins are used with hardeners such as acid anhydrides, aromatic amines, and novolac type phenolic resins, but those with novolac type phenolic resins are harder than those with other hardeners. It is widely used as a semiconductor encapsulating material because it has excellent moldability and moisture resistance, is nontoxic, and is inexpensive.

However, the epoxy resin using a novolac-type phenol resin as a curing agent has a drawback in that it is inferior in reliability with respect to severe moisture resistance and heat resistance due to high density of electronic parts. Molded products using such resins will not function as electronic parts due to bonding wire open, resin cracks and pellet cracks when subjected to a hot and cold cycle test, and when subjected to a moisture resistance test, the same as above However, there is a drawback that such a phenomenon occurs and the function cannot be fulfilled.

[Object of the Invention] The present invention has been made in order to solve the above-mentioned drawbacks, and its purpose is to have excellent moisture resistance, no opening or cracking of bonding wires, and good mechanical properties and heat resistance. It is intended to provide a resin composition for sealing.

[Summary of the Invention] As a result of intensive studies to achieve the above object, the present inventors have found that by incorporating diglycidyl isocyanurate, a sealing material having excellent moisture resistance, mechanical properties and heat resistance can be obtained. Found that a stopping resin composition can be obtained,
The present invention has been completed. That is, the present invention comprises (A) an epoxy resin, (B) a novolac type phenolic resin, (C) diglycidyl isocyanurate and (D) an inorganic filler as essential components, and the (D) inorganic filler to the resin composition. The encapsulating resin composition contains 25 to 90% by weight.

The (A) epoxy resin used in the present invention is not particularly limited in molecular structure, molecular weight, etc. as long as it is a compound having at least two epoxy groups in its molecule, and widely used resins can be widely used. it can. For example,
Examples thereof include bisphenol type aromatic resins, alicyclic resins such as cyclohexane derivatives, and epoxy novolac resins represented by the following general formula.

(In the formula, R ¹ represents a hydrogen atom, a halogen atom or an alkyl group, R ² represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more.) These epoxy resins may be used alone or in combination of two or more. To use.

The novolak type phenolic resin (B) used in the present invention is a novolak type phenolic resin obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, and modified resins thereof such as epoxidized or butyl. Novolak type phenolic resins are listed. These resins can be used alone or in admixture of two or more.

The diglycidyl isocyanurate (C) used in the present invention is an ester of isocyanuric acid, and the two ester groups are glycidyl groups. Specific examples thereof include XB-3085 = (trade name, manufactured by Ciba-Geigy Co., Ltd.) and the like, and these are used alone or in combination of two or more kinds.

The mixing ratio of (A) epoxy resin, (B) novolac type phenol resin and (C) diglycidyl isocyanurate is such that the epoxy group (a) of the epoxy resin and the epoxy group (c) of diglycidyl isocyanurate and the novolak type phenol The equivalent ratio [(a) + (c) / (b)] of the resin to the phenolic hydroxyl group (b) is preferably in the range of 0.1 to 10. If the equivalent ratio is less than 0.1 or more than 10, the moisture resistance, the molding workability, and the electrical properties of the cured product deteriorate, which is not preferable in any case.

As the inorganic filler (D) used in the present invention, those generally widely used are included. For example, silica, alumina, antimony trioxide, talc, calcium carbonate,
Titanium white, clay, mica, red iron oxide, glass fiber, carbon fiber and the like can be mentioned, and silica and alumina are particularly preferably used. These inorganic fillers may be used alone or in combination of two or more. The blending ratio of the inorganic filler is preferably 25 to 90% by weight based on the resin composition. If the content is less than 25% by weight, moisture resistance,
It has no effect on heat resistance, mechanical properties and moldability, and when it exceeds 90% by weight, it causes a large dryness, resulting in poor moldability and is not suitable for practical use. Therefore, it is limited to the above range.

The encapsulating resin composition of the present invention contains an epoxy resin, a novolac type phenolic resin, diglycidyl isocyanurate and an inorganic filler as essential components, but if necessary,
For example, natural waxes, synthetic waxes, metal salts of straight chain fatty acids, mold release agents such as acid amides, esters and paraffins, chlorinated paraffin, bromtoluene, hexabromobenzene, flame retardants such as antimony trioxide, carbon Coloring agents such as black and red iron oxide, silane coupling agents, various curing accelerators and the like can be appropriately added and blended.

As a general method for producing the encapsulating resin composition of the present invention as a molding material, the above-mentioned epoxy resin, novolac type phenolic resin, diglycidyl isocyanurate, inorganic filler, other, in a predetermined composition ratio After thoroughly mixing the selected raw material composition components with a mixer or the like, melt-mixing treatment with a hot roll or mixing treatment with a kneader or the like is performed to cool and solidify, followed by pulverizing to an appropriate size to obtain a molding material. When the encapsulating resin composition according to the present invention is applied to encapsulation coating, insulation, etc. of electronic parts or electric parts, excellent characteristics and high reliability can be imparted.

[Effects of the Invention] The encapsulating resin composition of the present invention is excellent in moisture resistance and therefore does not cause wire opening or cracks even when subjected to a hot and cold cycle test, and also has good heat resistance and mechanical properties, Further, it is excellent in molding workability, and can be sufficiently reliable when used for sealing electronic and electric parts.

[Examples of the Invention] Next, the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples. In Examples and Comparative Examples, "%" means "% by weight".

Example 1 Cresol novolac epoxy resin (epoxy equivalent 21
5) 16%, novolac type phenolic resin (phenol equivalent 107) 8%, diglycidyl isocyanurate 3%,
And 73% silica powder at room temperature, then 90 ~ 95 ℃
After kneading and cooling with, the mixture was pulverized to produce a molding material. This molding material was tabletized, preheated, poured into a mold heated to 170 ° C. by transfer molding, and cured to obtain a molded product (sealed part). The molded product was tested for various properties such as moisture resistance and is shown in Table 1. The remarkable effects of the present invention were confirmed.

Example 2 Cresol novolac epoxy resin (epoxy equivalent 21
5) 12%, novolac type phenol resin (phenol equivalent 107) 10%, diglycidyl isocyanurate 6%,
And 72% of silica powder were mixed and kneaded in the same manner as in Example 1 to produce a molding material.

Then, similarly, a molding product was obtained using the molding material, and various properties of this molding product were also tested. The results are shown in Table 1, and the remarkable effect of the present invention was confirmed.

Comparative Example 1 Cresol novolac epoxy resin (epoxy equivalent 21
5) 20%, novolac type phenol resin (phenol equivalent 107) 10%, and silica powder 70% were treated in the same manner as in Example 1 to produce a molding material, thereby obtaining a molded product. Further, various properties of the obtained molded product were tested, and the results are shown in Table 1.

As is clear from Table 1, the encapsulating resin composition of the present invention is excellent in moisture resistance, crack resistance and heat resistance.

Claims (2)

[Claims] 1. An epoxy resin (A), a novolac type phenolic resin (B), a diglycidyl isocyanurate (C) and an inorganic filler (D) as essential components, and the inorganic filler (D) to the resin composition. A sealing resin composition, which is contained in a proportion of 25 to 90% by weight. 2. An epoxy group (a) of an epoxy resin and an epoxy group (c) of diglycidyl isocyanurate and a phenolic hydroxyl group (b) of a novolac type phenol resin.
The encapsulating resin composition according to claim 1, wherein the equivalent ratio [(a) + (c) / (b)] with is within the range of 0.1 to 10.