JPH0528243B2 - - Google Patents
Info
- Publication number
- JPH0528243B2 JPH0528243B2 JP16305285A JP16305285A JPH0528243B2 JP H0528243 B2 JPH0528243 B2 JP H0528243B2 JP 16305285 A JP16305285 A JP 16305285A JP 16305285 A JP16305285 A JP 16305285A JP H0528243 B2 JPH0528243 B2 JP H0528243B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- epoxy
- type phenolic
- diamino
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 14
- 229920003986 novolac Polymers 0.000 claims description 13
- 229920001568 phenolic resin Polymers 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 10
- ZXLYUNPVVODNRE-UHFFFAOYSA-N 6-ethenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=C)=N1 ZXLYUNPVVODNRE-UHFFFAOYSA-N 0.000 claims description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000012778 molding material Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
- 239000010680 novolac-type phenolic resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、耐湿性に優れた電子・電気部品の封
止用樹脂組成物に関する。
［発明の技術的背景とその問題点］
従来ダイオード、トランジスタ、IC、LSIなど
の電子部品を熱硬化性樹脂を用いて封止する方法
が行われてきた。この樹脂封止方法は、ガラス、
金属、セラミツクを用いたハーメチツクシール方
式に比較して経済的に有利なために広く実用化さ
れている。封時用樹脂組成物としては、熱硬化性
樹脂組成物の中でも、信頼性および価格の点から
エポキシ樹脂組成物が最も一般的に用いられてい
る。エポキシ樹脂組成物は、酸無水物、芳香族ア
ミン、ノボラツク型フエノール樹脂等の硬化剤が
用いられている。これらの中でもノボラツク型フ
エノール樹脂を硬化剤としたエポキシ樹脂組成物
は、他の硬化剤を使用したものに比べて、成形
性、耐湿性に優れ、毒性がなく、かつ安価である
ため半導体封止材料として広く用いられている。
しかし、エポキシ樹脂組成物は、エポキシ樹脂
製造工程中に発生するイオン性の塩素や加水分解
性の塩素が不純物として残り、耐湿試験でのアル
ミ配線の腐食の原因となり、耐湿性に劣るという
欠点がある。こうしたことから耐湿性に優れた封
止用樹脂組成物の開発が望まれていた。
［発明の目的］
本発明は、前記の欠点を解消するためにさなれ
たもので、その目的は、金属のイオン移動やイオ
ン性のハロゲンによる電蝕を防止し、耐湿性に優
れた、かつ従来組成物のメリツトを保持した封止
用樹脂組成物を提供しようとするものである。
［発明の概要］
本発明者らは、上記の目的を達成しようと鋭意
研究を重ねた結果、２−ビニル−４，６−ジアミ
ノ−ｓ−トリアジンの所定量を配合すれば、電食
を防止し、耐湿性に優れた封止用樹脂組成物が得
られることを見いだし、本発明を完成するに至つ
たものである。即ち、本発明は、
(A) エポキシ樹脂、
(B) ノボラツク型フエノール樹脂、
(C) ２−ビニル−４，６−ジアミノ−ｓ−トリア
ジンおよび
(D) 無機質充填剤
を含み、前記(C)の２−ビニル−４，６−ジアミノ
−ｓ−トリアジンを、樹脂組成物に対して0.001
〜20重量％、また前記(D)の無機質充填剤を樹脂組
成物に対して25〜90重量％含有することを特徴と
する封止用樹脂組成物である。そしてエポキシ樹
脂のエポキシ基(a)とノボラツク型フエノール樹脂
のフエノール性水酸基(b)とのモル比［(a)／(b)］が
0.1〜10の範囲内にある封止用樹脂組成物である。
本発明に用いる(A)エポキシ樹脂としては、その
分子中にエポキシ基を少なくとも２個有する化合
物である限り、分子構造、分子量など特に制限は
なく、一般に封止用材料に使用されているものを
広く包含することができる。例えばビスフエノー
ル型の芳香族系、シクロヘキサン誘導体等の脂環
族系、さらに次の一般式で示されるエポキシノボ
ラツク系等の樹脂が挙げられる。
（式中、R1は、水素原子、ハロゲン原子又はア
ルキル基を、R2は、水素原子又はアルキル基を、
ｎは１以上の整数を表す）
これらのエポキシ樹脂は１種又は２種以上混合
して用いられる。
本発明に使用する(B)ノボラツク型フエノール樹
脂としては、フエノール、アルキルフエノール等
のフエノール類とホルムアルデヒトあるいはパラ
ホルムアルデヒドを反応させて得られるノボラツ
ク型フエノール樹脂、およびこれらの変性樹脂例
えばエポキシ化もしくはブチル化ノボラツク型フ
エノール樹脂等が挙げられる。ノボラツク型フエ
ノール樹脂の配合割合は、前記(A)エポキシ樹脂の
エポキシ基(a)と(B)ノボラツク型フエノール樹脂の
フエノール性水酸基(b)とのモル比［(a)／(b)］が
0.1〜10の範囲内にあることが望ましい。このモ
ル比が0.1未満もしくは10を超えると、耐湿性、
成形作業性および硬化物の電気特性が悪くなり、
いずれの場合も好ましくない。従つて上記の範囲
内に限定するのがよい。
本発明に用いる(C)２−ビニル−４，６−ジアミ
ノ−ｓ−トリアジンは、次の構造式で示される。
２−ビニル−４，６−ジアミノ−ｓ−トリアジ
ンの配合割合は、樹脂組成物に対して、0.001〜
20重量％含有することが望ましい。この割合が
0.001重量％未満では、耐湿性に効果がなく、ま
た20重量％を超えると成形性が悪くなり実用に適
さない。よつて上記の範囲内に限定される。
本発明に用いる(D)無機質充填剤としては、シリ
カ粉末、アルミナ、三酸化アンチモン、タルク、
炭酸カルシウム、チタンホワイト、クレー、アス
ベスト、マイカ、ベンガラ、ガラス繊維、炭素繊
維等が挙げられ、特にシリカ粉末およびアルミナ
が好ましい。無機質充填剤の配合割合は、樹脂組
成物の25〜90重量％配合することが必要である。
この配合量が25重量％未満では耐湿性、耐熱性、
機械的特性および成形性に効果なく、90重量％を
超えるとかさばりが大きくなり成形性が悪く実用
に適さない。
本発明の封止用樹脂組成物は、エポキシ樹脂、
ノボラツク型フエノール樹脂、２−ビニル−４，
６−ジアミノ−ｓ−トリアジン、無機質充填剤を
必須成分とするが、必要に応じて例えば天然ワツ
クス類、合成ワツクス類、直鎖脂肪酸の金属塩、
酸アミド、エステル類、パラフイン類などの離型
剤、塩素化パラフイン、ブロムトルエン、ヘキサ
ブロムベンゼン、三酸化アンチモンなどの難燃
剤、カーボンブラツク、ベンガラなどの着色剤、
シランカツプリング剤、種々の硬化促進剤等を適
宜添加配合することもできる。
本発明の封止用樹脂組成物を成形材料として製
造する場合の一般的な方法としては、エポキシ樹
脂、ノボラツク型フエノール樹脂、２−ビニル−
４，６−ジアミノ−ｓ−トリアジン、無機質充填
剤、その他を所定の組成比に選んだ原料組成分を
ミキサー等によつて十分均一に混合した後、更に
熱ロールによる溶融混合処理、またはニーダ等に
よる混合処理を行い、次いで冷却固化させ、適当
な大きさに粉砕して成形材料とすることができ
る。
本発明に係る封止用樹脂組成物からなる成形材
料は、電子部品或いは電気部品の封止、被覆、絶
縁等に適用することができる。
［発明の効果］
本発明の封止用樹脂組成物は、２−ビニル−
４，６−ジアミノ−ｓ−トリアジンを配合したこ
とによつて耐湿性に優れているため、金属のイオ
ン移動やイオン性のハロゲンによる電蝕も防止で
き、かつ成形作業性、耐熱性、機械的特性、電気
的特性のよい組成物であるので、電子・電気部品
の封止用、被覆用等に用いた場合、十分信頼性の
高い製品を得ることができる。
［発明の実施例］
本発明を実施例により具体的に説明するが、本
発明は以下の実施例に限定されるものではない。
以下実施例および比較例において「％」とあるの
は「重量％」を意味する。
実施例 １
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）18％、ノボラツク型フエノール樹脂
（フエノール当量107）12％、２−ビニル−４，６
−ジアミノ−ｓ−トリアジン１％、および溶融シ
リカ粉末69％を常温で混合しさらに90〜95℃で混
練して冷却した後、粉砕して成形材料を得た。得
られた成形材料をタブレツト化し、170℃に加熱
した金型内のトランスフアー注入し硬化させて成
形品を得た。この成形品について耐湿試験を行つ
た。
その結果を第１表に示したが、本発明の優れた
効果が認められた。
実施例 ２
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）16％に、ノボラツク型フエノール樹脂
（フエノール当量107）８％、２−ビニル−４，６
−ジアミノ−ｓ−トリアジン２％、および溶融シ
リカ粉末70％を実施例１と同様に混合混練粉砕し
て成形材料を得た。次いで同様にして成形品を得
て、これらの成形品について実施例１と同様にし
て耐湿試験を行つた。その結果を第１表に示した
が、本発明の優れた効果が認められた。
比較例
クレゾールノボラツクエポキシ樹脂（エポキシ
当量215）20％に、ノボラツク型フエノール樹脂
（フエノール当量107）10％、およびシリカ粉末70
％を実施例と同様にして成形材料を得た。この成
形材料を用いて成形品とし、実施例と同様に耐湿
試験を行つた。その結果を第１表に示した。
【表】DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin composition for sealing electronic/electrical parts with excellent moisture resistance. [Technical background of the invention and its problems] Conventionally, electronic components such as diodes, transistors, ICs, and LSIs have been sealed using a thermosetting resin. This resin sealing method is suitable for glass,
It is widely put into practical use because it is economically advantageous compared to hermetic seal systems using metals or ceramics. Among thermosetting resin compositions, epoxy resin compositions are most commonly used as sealing resin compositions in terms of reliability and cost. Epoxy resin compositions use curing agents such as acid anhydrides, aromatic amines, and novolac type phenolic resins. Among these, epoxy resin compositions using novolac-type phenolic resin as a curing agent are suitable for semiconductor encapsulation because they have superior moldability and moisture resistance, are nontoxic, and are inexpensive compared to those using other curing agents. Widely used as a material. However, epoxy resin compositions have the disadvantage that ionic chlorine and hydrolyzable chlorine generated during the epoxy resin manufacturing process remain as impurities, causing corrosion of aluminum wiring in moisture resistance tests, resulting in poor moisture resistance. be. For these reasons, it has been desired to develop a sealing resin composition with excellent moisture resistance. [Object of the Invention] The present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to prevent metal ion migration and electrolytic corrosion caused by ionic halogens, and to have excellent moisture resistance. The present invention aims to provide a sealing resin composition that retains the advantages of conventional compositions. [Summary of the Invention] As a result of intensive research aimed at achieving the above object, the present inventors have found that electrolytic corrosion can be prevented by blending a predetermined amount of 2-vinyl-4,6-diamino-s-triazine. However, it was discovered that a sealing resin composition with excellent moisture resistance can be obtained, and the present invention was completed. That is, the present invention includes (A) an epoxy resin, (B) a novolac type phenolic resin, (C) 2-vinyl-4,6-diamino-s-triazine, and (D) an inorganic filler, and the above-mentioned (C) 0.001 of 2-vinyl-4,6-diamino-s-triazine to the resin composition.
This is a resin composition for sealing, characterized in that it contains the inorganic filler of (D) in an amount of 25 to 90% by weight based on the resin composition. The molar ratio [(a)/(b)] between the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolak type phenolic resin is
It is a sealing resin composition within the range of 0.1 to 10. The epoxy resin (A) used in the present invention is not particularly limited in terms of molecular structure and molecular weight, as long as it is a compound that has at least two epoxy groups in its molecule. Can be broadly encompassed. Examples include aromatic resins such as bisphenol, alicyclic resins such as cyclohexane derivatives, and epoxy novolac resins represented by the following general formula. (In the formula, R 1 is a hydrogen atom, a halogen atom, or an alkyl group, R 2 is a hydrogen atom or an alkyl group,
(n represents an integer of 1 or more) These epoxy resins may be used alone or in combination of two or more. The novolak type phenolic resin (B) used in the present invention includes novolak type phenolic resins obtained by reacting phenols such as phenols and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof such as epoxidized or butylated resins. Examples include novolak type phenolic resins. The blending ratio of the novolak type phenolic resin is such that the molar ratio [(a)/(b)] between the epoxy group (a) of the epoxy resin (A) and the phenolic hydroxyl group (b) of the novolak type phenolic resin (B) is
It is desirable that it be within the range of 0.1 to 10. When this molar ratio is less than 0.1 or more than 10, moisture resistance,
Molding workability and electrical properties of the cured product deteriorate,
Either case is not preferable. Therefore, it is better to limit it within the above range. (C)2-vinyl-4,6-diamino-s-triazine used in the present invention is represented by the following structural formula. The blending ratio of 2-vinyl-4,6-diamino-s-triazine is from 0.001 to the resin composition.
It is desirable to contain 20% by weight. This percentage
If it is less than 0.001% by weight, it has no effect on moisture resistance, and if it exceeds 20% by weight, moldability deteriorates and is not suitable for practical use. Therefore, it is limited within the above range. Inorganic fillers (D) used in the present invention include silica powder, alumina, antimony trioxide, talc,
Examples include calcium carbonate, titanium white, clay, asbestos, mica, red iron oxide, glass fiber, and carbon fiber, with silica powder and alumina being particularly preferred. The blending ratio of the inorganic filler needs to be 25 to 90% by weight of the resin composition.
If this amount is less than 25% by weight, moisture resistance, heat resistance,
It has no effect on mechanical properties and moldability, and if it exceeds 90% by weight, it becomes bulky and has poor moldability, making it unsuitable for practical use. The sealing resin composition of the present invention includes an epoxy resin,
Novolac type phenolic resin, 2-vinyl-4,
6-diamino-s-triazine and an inorganic filler are essential components, but if necessary, natural waxes, synthetic waxes, metal salts of straight chain fatty acids,
Mold release agents such as acid amides, esters, and paraffins; flame retardants such as chlorinated paraffins, bromotoluene, hexabromobenzene, and antimony trioxide; colorants such as carbon black and red iron;
A silane coupling agent, various curing accelerators, etc. can also be added and blended as appropriate. General methods for producing the sealing resin composition of the present invention as a molding material include epoxy resin, novolac type phenolic resin, 2-vinyl-
After sufficiently uniformly mixing the raw material composition in which 4,6-diamino-s-triazine, inorganic filler, and others are selected in a predetermined composition ratio using a mixer, etc., the mixture is further melt-mixed using hot rolls, or by a kneader, etc. A molding material can be obtained by performing a mixing treatment by , followed by cooling and solidifying, and pulverizing into an appropriate size. The molding material made of the encapsulating resin composition according to the present invention can be applied to encapsulating, covering, insulating, etc. electronic or electrical components. [Effect of the invention] The sealing resin composition of the present invention has 2-vinyl-
The combination of 4,6-diamino-s-triazine provides excellent moisture resistance, which prevents metal ion migration and electrolytic corrosion caused by ionic halogens, and improves molding workability, heat resistance, and mechanical properties. Since the composition has good properties and electrical properties, a sufficiently reliable product can be obtained when used for sealing, coating, etc. of electronic/electrical parts. [Examples of the Invention] The present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.
In the Examples and Comparative Examples below, "%" means "% by weight". Example 1 Cresol novolak epoxy resin (epoxy equivalent: 215) 18%, novolak type phenolic resin (phenol equivalent: 107) 12%, 2-vinyl-4,6
-Diamino-s-triazine (1%) and fused silica powder (69%) were mixed at room temperature, kneaded at 90-95°C, cooled, and crushed to obtain a molding material. The obtained molding material was made into a tablet, transferred into a mold heated to 170°C, and cured to obtain a molded product. A moisture resistance test was conducted on this molded article. The results are shown in Table 1, and the excellent effects of the present invention were recognized. Example 2 Cresol novolak epoxy resin (epoxy equivalent weight 215) 16%, novolak type phenolic resin (phenol equivalent weight 107) 8%, 2-vinyl-4,6
2% -diamino-s-triazine and 70% fused silica powder were mixed, kneaded and ground in the same manner as in Example 1 to obtain a molding material. Molded articles were then obtained in the same manner, and a moisture resistance test was conducted on these molded articles in the same manner as in Example 1. The results are shown in Table 1, and the excellent effects of the present invention were recognized. Comparative example: 20% cresol novolac epoxy resin (epoxy equivalent 215), 10% novolac type phenolic resin (phenol equivalent 107), and 70% silica powder.
A molding material was obtained using the same percentage as in the example. A molded article was made using this molding material, and a moisture resistance test was conducted in the same manner as in the examples. The results are shown in Table 1. 【table】
Claims (1)
ジンおよび (D) 無機質充填剤 を含み、前記(C)の２−ビニル−４，６−ジアミノ
−ｓ−トリアジンを、樹脂組成物に対して0.001
〜20重量％、また前記(D)の無機質充填剤を樹脂組
成物に対して25〜90重量％含有することを特徴と
する封止用樹脂組成物。 ２ エポキシ樹脂のエポキシ基(a)とノボラツク型
フエノール樹脂のフエノール性水酸基(b)とのモル
比［(a)／(b)］が0.1〜10の範囲内にある特許請求
の範囲第１項記載の封止用樹脂組成物。[Scope of Claims] 1 Contains (A) an epoxy resin, (B) a novolak type phenolic resin, (C) 2-vinyl-4,6-diamino-s-triazine, and (D) an inorganic filler; ) of 2-vinyl-4,6-diamino-s-triazine at 0.001% relative to the resin composition.
20% by weight, and a sealing resin composition characterized by containing the inorganic filler (D) in an amount of 25 to 90% by weight based on the resin composition. 2. Claim 1, wherein the molar ratio [(a)/(b)] between the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolak type phenolic resin is within the range of 0.1 to 10. The sealing resin composition described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16305285A JPS6225118A (en) | 1985-07-25 | 1985-07-25 | Sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16305285A JPS6225118A (en) | 1985-07-25 | 1985-07-25 | Sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6225118A JPS6225118A (en) | 1987-02-03 |
| JPH0528243B2 true JPH0528243B2 (en) | 1993-04-23 |
Family
ID=15766256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16305285A Granted JPS6225118A (en) | 1985-07-25 | 1985-07-25 | Sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225118A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6507506B2 (en) * | 2014-07-16 | 2019-05-08 | 住友ベークライト株式会社 | Resin composition for sealing and semiconductor device |
| DE112020001490T5 (en) | 2019-03-27 | 2021-12-30 | Sumitomo Bakelite Co., Ltd. | RESIN COMPOSITION FOR ENCAPSULATING AND SEMICONDUCTOR DEVICE |
| JPWO2022118749A1 (en) | 2020-12-03 | 2022-06-09 | ||
| CN113683984B (en) * | 2021-09-01 | 2023-11-24 | 苏州福斯特光伏材料有限公司 | Resin composition, master batch containing same and application thereof |
-
1985
- 1985-07-25 JP JP16305285A patent/JPS6225118A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225118A (en) | 1987-02-03 |
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