JPWO2022118749A1 - - Google Patents

Info

Publication number
JPWO2022118749A1
JPWO2022118749A1 JP2022549774A JP2022549774A JPWO2022118749A1 JP WO2022118749 A1 JPWO2022118749 A1 JP WO2022118749A1 JP 2022549774 A JP2022549774 A JP 2022549774A JP 2022549774 A JP2022549774 A JP 2022549774A JP WO2022118749 A1 JPWO2022118749 A1 JP WO2022118749A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022549774A
Other languages
Japanese (ja)
Other versions
JPWO2022118749A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022118749A1 publication Critical patent/JPWO2022118749A1/ja
Publication of JPWO2022118749A5 publication Critical patent/JPWO2022118749A5/ja
Priority to JP2023091529A priority Critical patent/JP2023116574A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
JP2022549774A 2020-12-03 2021-11-26 Pending JPWO2022118749A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023091529A JP2023116574A (en) 2020-12-03 2023-06-02 Sealing resin composition and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020200901 2020-12-03
PCT/JP2021/043352 WO2022118749A1 (en) 2020-12-03 2021-11-26 Resin composition for sealing and semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023091529A Division JP2023116574A (en) 2020-12-03 2023-06-02 Sealing resin composition and semiconductor device

Publications (2)

Publication Number Publication Date
JPWO2022118749A1 true JPWO2022118749A1 (en) 2022-06-09
JPWO2022118749A5 JPWO2022118749A5 (en) 2022-11-16

Family

ID=81853884

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022549774A Pending JPWO2022118749A1 (en) 2020-12-03 2021-11-26
JP2023091529A Pending JP2023116574A (en) 2020-12-03 2023-06-02 Sealing resin composition and semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023091529A Pending JP2023116574A (en) 2020-12-03 2023-06-02 Sealing resin composition and semiconductor device

Country Status (5)

Country Link
JP (2) JPWO2022118749A1 (en)
KR (1) KR20230112671A (en)
CN (1) CN116670821A (en)
TW (1) TW202231767A (en)
WO (1) WO2022118749A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010065160A (en) * 2008-09-11 2010-03-25 Nitto Denko Corp Resin composition for sealing semiconductor and semiconductor device using the same
WO2010150487A1 (en) * 2009-06-22 2010-12-29 住友ベークライト株式会社 Resin composition for sealing semiconductors, and semiconductor device
WO2011048765A1 (en) * 2009-10-20 2011-04-28 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent
WO2011064964A1 (en) * 2009-11-24 2011-06-03 住友ベークライト株式会社 Metal die for measuring flow characteristics, method for measuring flow characteristics, resin composition for sealing semiconductor, and method for manufacturing semiconductor device
JP2012188629A (en) * 2011-03-14 2012-10-04 Nippon Shokubai Co Ltd Curable resin composition and semiconductor device using the same
JP2015067618A (en) * 2013-09-26 2015-04-13 株式会社日本触媒 Curable resin composition and application thereof
JP2017110051A (en) * 2015-12-14 2017-06-22 住友ベークライト株式会社 Resin composition for encapsulation, semiconductor device and on-vehicle electronic control unit
WO2019131379A1 (en) * 2017-12-25 2019-07-04 住友ベークライト株式会社 Method for producing electronic device
CN110437764A (en) * 2019-08-16 2019-11-12 严佳飞 A kind of resin modified amylum adhesive and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225118A (en) 1985-07-25 1987-02-03 Toshiba Chem Corp Sealing resin composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010065160A (en) * 2008-09-11 2010-03-25 Nitto Denko Corp Resin composition for sealing semiconductor and semiconductor device using the same
WO2010150487A1 (en) * 2009-06-22 2010-12-29 住友ベークライト株式会社 Resin composition for sealing semiconductors, and semiconductor device
WO2011048765A1 (en) * 2009-10-20 2011-04-28 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent
WO2011064964A1 (en) * 2009-11-24 2011-06-03 住友ベークライト株式会社 Metal die for measuring flow characteristics, method for measuring flow characteristics, resin composition for sealing semiconductor, and method for manufacturing semiconductor device
JP2012188629A (en) * 2011-03-14 2012-10-04 Nippon Shokubai Co Ltd Curable resin composition and semiconductor device using the same
JP2015067618A (en) * 2013-09-26 2015-04-13 株式会社日本触媒 Curable resin composition and application thereof
JP2017110051A (en) * 2015-12-14 2017-06-22 住友ベークライト株式会社 Resin composition for encapsulation, semiconductor device and on-vehicle electronic control unit
WO2019131379A1 (en) * 2017-12-25 2019-07-04 住友ベークライト株式会社 Method for producing electronic device
CN110437764A (en) * 2019-08-16 2019-11-12 严佳飞 A kind of resin modified amylum adhesive and preparation method thereof

Also Published As

Publication number Publication date
CN116670821A (en) 2023-08-29
TW202231767A (en) 2022-08-16
KR20230112671A (en) 2023-07-27
JP2023116574A (en) 2023-08-22
WO2022118749A1 (en) 2022-06-09

Similar Documents

Publication Publication Date Title
BR112023005462A2 (en)
BR112021014123A2 (en)
BR112023012656A2 (en)
BR112022024743A2 (en)
BR102021018859A2 (en)
BR112022009896A2 (en)
BR102020022030A2 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
BR112023004146A2 (en)
JPWO2022118749A1 (en)
BR112023011539A2 (en)
BR112023011610A2 (en)
BR112023008976A2 (en)
BR112023009656A2 (en)
BR112023006729A2 (en)
BR102021020147A2 (en)
BR102021018926A2 (en)
BR102021018167A2 (en)
BR102021016200A2 (en)
BR102021016176A2 (en)
BR102021015566A2 (en)
BR102021015500A2 (en)
BR102021015220A2 (en)
BR102021015247A2 (en)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220818

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220818

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220818

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221018

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20221214

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230307

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20230602