JPS61101523A - Sealing resin composition - Google Patents
Sealing resin compositionInfo
- Publication number
- JPS61101523A JPS61101523A JP22305784A JP22305784A JPS61101523A JP S61101523 A JPS61101523 A JP S61101523A JP 22305784 A JP22305784 A JP 22305784A JP 22305784 A JP22305784 A JP 22305784A JP S61101523 A JPS61101523 A JP S61101523A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- boron nitride
- epoxy
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、熱伝導率が大きく、しかも成形性、耐湿性に
優れた特性バランスのよい封止用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a sealing resin composition that has high thermal conductivity, excellent moldability and moisture resistance, and has well-balanced properties.
[発゛明の技術的背景とその問題点]
従来、ダイオード、トランジスタ、集積回路等の゛電子
部品を熱硬化性樹脂を用いて樹脂封止する方法が行われ
てきた。 この樹脂封止は、ガラス、金属、セラミック
を用い・たハーメチックシール、方式に比較して経済的
に有利なため、広く実用化されている。 封止用樹脂と
しては、熱硬化性樹脂の中でも信頼性、13よび価格の
点力日らエポキシ樹脂が最も一般的に用いられている。[Technical background of the invention and its problems] Hitherto, a method has been used in which electronic components such as diodes, transistors, and integrated circuits are sealed with a thermosetting resin. This resin sealing is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. As the sealing resin, epoxy resin is most commonly used among thermosetting resins due to its reliability, quality, and price.
エポキシ樹脂には、酸無水物、芳香族アミン、ノボラ
ック型フェノール樹脂等の硬化剤が用いられている。
これらの中でノボラック型フェノール樹脂を硬化剤とし
たエポキシ樹脂は、他の硬化剤を使用したものに比べて
、成形性、耐湿性に1つれ、iη性がなく、かつ、安価
であるため半導体対l[用樹脂として広く使用されてい
る。 また充填剤としては溶融シリカ粉末や結晶性シリ
カ粉末が前述の硬化剤と共に最も一般的に使用されてい
る。 近年、半導体部品の高密度化、大電力化に伴ない
熱放散性のより良い半導体封止用樹脂が要望されてきた
。For epoxy resins, curing agents such as acid anhydrides, aromatic amines, and novolac-type phenolic resins are used.
Among these, epoxy resins using novolac-type phenolic resin as a curing agent have better moldability and moisture resistance than those using other curing agents, have no iη properties, and are inexpensive, so they are suitable for semiconductors. It is widely used as a resin for Further, as a filler, fused silica powder or crystalline silica powder is most commonly used together with the above-mentioned curing agent. In recent years, as the density of semiconductor components has increased and power consumption has increased, there has been a demand for semiconductor encapsulation resins with better heat dissipation properties.
しかしながら、ノボラック型フェノール樹脂を硬化剤と
したエポキシ樹脂と溶融シリカ粉末とからなる樹脂組成
物は、熱膨張係数が小さく、耐湿性がよく、温寒tナイ
クル試験によるボンディングワイヤのオーブン、樹脂ク
ラック、ベレットクラック等に優れているという特徴を
有するものの、熱伝8!2率が小さいため熱放散が悪く
、消9電力の大きいパワー半導体では、その改能が果ゼ
なくなる欠点がある。 一方ノボラック型フェノール樹
脂を硬化剤としたエポキシ樹脂と、結晶性シリカ粉末と
からなる樹脂組成物は、結晶性シリカ粉末の配合割合を
上げると熱伝導率が大きくなって、熱放散も良好となる
が、耐湿性に対する信頼性が悪くなる欠点がある。 更
にこの樹脂組成物から得られる成形品は、機械的特性や
成形性が低下する傾向がある。 従って、シリカ粉末を
用いる封止用樹脂組成物の高熱伝導化にはJ3のずから
限界があった。However, a resin composition consisting of an epoxy resin and fused silica powder using a novolac-type phenol resin as a curing agent has a small coefficient of thermal expansion, good moisture resistance, and a bonding wire oven, resin cracks, and cracks in the hot and cold t-Nikle test. Although it has the characteristic of being excellent in preventing bullet cracks, etc., it has a drawback that its heat dissipation is poor due to its low heat transfer rate, and its performance cannot be improved in power semiconductors with large power consumption. On the other hand, in a resin composition consisting of an epoxy resin using a novolak type phenol resin as a curing agent and crystalline silica powder, increasing the blending ratio of crystalline silica powder increases the thermal conductivity and improves heat dissipation. However, it has the disadvantage of poor reliability in moisture resistance. Furthermore, molded articles obtained from this resin composition tend to have poor mechanical properties and moldability. Therefore, J3 naturally had a limit in increasing the thermal conductivity of a sealing resin composition using silica powder.
[発明の目的]
本発明は、前記の欠点を解消するためになされたもので
、その目的は、熱伝導率が大きく、熱放散性、成形性に
優れ、かつ、耐湿性に対する信頼性の高い、特性バラン
スのよいIJ止用樹脂組成物を提供しようとするもので
ある。[Object of the Invention] The present invention has been made in order to eliminate the above-mentioned drawbacks, and its purpose is to provide a material having high thermal conductivity, excellent heat dissipation properties, excellent moldability, and high reliability in moisture resistance. The present invention aims to provide a resin composition for IJ stopping with well-balanced properties.
[発明の概要]
本発明者らは、上記の目的を達成すべく鋭意研究を重ね
た結果、ボロンナイトライド粉末を配合することによっ
て、熱伝導率が大きく、成形性に浸れる等上記目的を満
たすことができることを見いだしたものである。[Summary of the Invention] As a result of intensive research to achieve the above objects, the present inventors have found that by blending boron nitride powder, the above objects can be achieved, such as having high thermal conductivity and excellent moldability. I have found that it can be fulfilled.
即ち、本発明は、
(Δ)エポキシ樹脂
(B)ノボラック型フェノール樹脂および(C)ボロン
ナイトライド粉末
を必須成分とし、かつ、前記(C)ボロンナイトライド
粉末を樹脂組成物に対して25〜90重量%含有させる
ことを特徴とする封止用樹脂組成物である。That is, the present invention includes (Δ) an epoxy resin, (B) a novolak type phenol resin, and (C) a boron nitride powder as essential components, and the (C) boron nitride powder is added to the resin composition in a ratio of 25 to 25%. This is a sealing resin composition characterized by containing 90% by weight.
本発明に用いる(A)エポキシ樹脂は、そ9分子中にエ
ポキシ基<a )を少なくとも2個有する化合物である
かぎり、分子構造、分子m等に特に制限はなく、一般に
使用されているものを広く包含することができる。 例
えばビスフェノール型の芳香族系、シクロヘキサン誘導
体等の脂環族系、さらに次の一般式で示されるエポキシ
ノボラック系等のエポキシ樹脂が挙げられる。The epoxy resin (A) used in the present invention is not particularly limited in molecular structure, molecule m, etc., as long as it is a compound having at least two epoxy groups <a) in its 9 molecules, and commonly used epoxy resins can be used. Can be broadly encompassed. Examples include aromatic resins such as bisphenol type, alicyclic resins such as cyclohexane derivatives, and epoxy resins such as epoxy novolak resins represented by the following general formula.
〈式中、R1は水素原子、ハロゲン原子又はアルキル基
を、R2は水素原子又はアルキル基を、nは1以上の整
数をそれぞれ表す)。 これらのエポキシ樹脂は単独又
は2種以上混合して用いる。(In the formula, R1 represents a hydrogen atom, a halogen atom, or an alkyl group, R2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more). These epoxy resins may be used alone or in combination of two or more.
本発明に用いる(B)ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノ−、
ル類とホルムアルデヒドあるいはパラホルムアルデヒド
を反応させて得られるノボラック型フェノール樹脂およ
びこれらの変性樹脂例えばエポキシ化もしくはブチル化
ノボラック型フェノール樹脂等が挙げられ、これらは単
独又は2種以上混合して用いる。 ノボラック型フェノ
ール樹脂の配合割合は、前記(A)エポキシ樹脂のエポ
キシ基(a )と(B)ノボラック型フェノール樹脂の
フェノール性水酸基(b)とのモル比< a/b )が
0.1〜10の範囲であることが必要である。 モル比
が0.1未満もしくは10を超えると耐湿性、成形作業
性J′3よび硬化物の電気特性が悪くなりいずれの場合
も好ましくない。The novolac type phenolic resin (B) used in the present invention includes phenol, such as phenol and alkylphenol;
Novolak type phenol resins obtained by reacting formaldehyde or paraformaldehyde with formaldehyde or paraformaldehyde, and modified resins thereof such as epoxidized or butylated novolak type phenol resins are mentioned, and these can be used alone or in combination of two or more types. The blending ratio of the novolac type phenolic resin is such that the molar ratio of the epoxy group (a) of the epoxy resin (A) to the phenolic hydroxyl group (b) of the novolac type phenol resin (B) < a/b ) is 0.1 to It needs to be in the range of 10. If the molar ratio is less than 0.1 or more than 10, the moisture resistance, molding workability J'3, and electrical properties of the cured product will deteriorate, which is undesirable.
本発明に用いる<C)ボロンナイトライド粉末としては
特に制限はなく、どのようなものでもよいが、例えば電
気化学工業社製デンカボロンナイトライドGP等が挙げ
られ、これらは単独又は混合して使用される。 ボロン
ナイトライド粉末の配合割合は、樹脂組成物に対して2
5〜901畿%であることが必要である。 配合mが2
5重運気未満では、熱膨張係数が大きくまた熱伝導率が
小さくて好ましくない。 また90重量%を超えるとか
さばりが大きく、かつ成形性が悪く実用に適さない。The <C) boron nitride powder used in the present invention is not particularly limited and may be of any type, but examples include Denka Boron Nitride GP manufactured by Denki Kagaku Kogyo Co., Ltd., which may be used alone or in combination. be done. The blending ratio of boron nitride powder is 2% to the resin composition.
It is necessary that it is 5 to 901%. Mixture m is 2
If it is less than 5 times, the coefficient of thermal expansion is large and the thermal conductivity is low, which is not preferable. Moreover, if it exceeds 90% by weight, the bulk will be large and the moldability will be poor, making it unsuitable for practical use.
従って上記の範囲に限定される。 ボロンナイトライド
粉末の平均粒子径は60メツシユ功上の細径であること
が必要である。 60メプシュ未満の微粒子径の場合は
、成形時にワイヤゲート詰りゃワイヤ流れ、金型摩耗等
が生じて好ましくない。Therefore, it is limited to the above range. The average particle size of the boron nitride powder needs to be as small as 60 mesh. If the particle diameter is less than 60 Mepsch, it is not preferable because wire gate clogging occurs during molding, wire flow, mold wear, etc.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、ボロンナイトライド粉末を必須成
分とするが必要に応じて、例えば天然ワックス類、合成
ワックス類、直鎖脂肪酸の金属塩、酸アミド類、エステ
ル類、パラフィン類等の離型剤、塩化パラフィン、プ0
ムトルエン、ヘキサブロムベンゼン、三酸化アンチモン
等の難燃剤、カーボンブラック、ベンガラ等の着色剤、
シランカップリング剤、種々の硬化促進剤などを適宜添
加配合してもよい。The sealing resin composition of the present invention contains an epoxy resin, a novolak type phenol resin, and a boron nitride powder as essential components, but may optionally contain natural waxes, synthetic waxes, metal salts of straight chain fatty acids, etc. Mold release agents such as acid amides, esters, paraffins, chlorinated paraffin, plastic
Flame retardants such as mutluene, hexabromobenzene and antimony trioxide, colorants such as carbon black and red iron,
A silane coupling agent, various curing accelerators, etc. may be added and blended as appropriate.
本発明の封止用樹脂組成物を成形材料として調製する場
合の一般的な方法としては、エポキシ樹脂、ノボラック
型フェノール樹脂、ボロンナイトライド粉末、その他を
所定の組成比に選択した原料組成分をミキサー等によ゛
つて十分均一に混合した後、更に熱ロールによる溶融混
合処理、又はニーダ等による混合処理を行い、次いで冷
却固化させ、適当な大きさに粉砕して成形材料とするこ
とができる。 こうして得た成形材料は、電子部品或い
は電気部品の封止、被覆、絶縁等に適用すれば優れた特
性と信頼性を付与することができる。A general method for preparing the sealing resin composition of the present invention as a molding material is to use raw material compositions of epoxy resin, novolac type phenol resin, boron nitride powder, and others selected in a predetermined composition ratio. After sufficiently uniformly mixing using a mixer, etc., it can be further melted and mixed using hot rolls, or mixed using a kneader, etc., then cooled and solidified, and pulverized to an appropriate size to be used as a molding material. . The molding material thus obtained can provide excellent properties and reliability when applied to sealing, covering, insulating, etc. electronic or electrical components.
[発明の効果]
本発明の封止用樹脂組成物は、熱伝導率が大きく、熱放
散性、成形性に優れており、また耐湿性がよく、温寒サ
イクル試験のボンディングワイヤのオープン、樹脂クラ
ック、ベレットクラック等がなく、消費電力等のパワー
半尋体等の様器に使用して効果がある。 本発明の樹脂
組成物は、特性バランスがよく電子・電気部品の封止用
とじて優れた信頼性を付与することができる。[Effects of the Invention] The sealing resin composition of the present invention has high thermal conductivity, excellent heat dissipation properties, and moldability, and also has good moisture resistance, and has excellent resistance to open bonding wires and resin in hot and cold cycle tests. There are no cracks, pellet cracks, etc., and it is effective when used in power-consumption devices such as power half-body bodies. The resin composition of the present invention has well-balanced properties and can provide excellent reliability when used for sealing electronic and electrical components.
[発明の実施例1
本発明を実施例により具体的に説明するが、本発明は以
下の実施例に限定されるものではない。[Example 1 of the Invention The present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.
実施例および比較例において「%」とあるのは11%」
を意味する。In Examples and Comparative Examples, "%" means 11%.
means.
実施例 1
タレゾールノボラックエポキシ樹脂(エポキシ当121
5) 18%に、ノボラック型フェノール樹脂(フェノ
ール当al 107) 9%、ボロンナイトライド粉
末(平均粒径5μ−) 70%、離型剤等3%を常温で
混合し、更に90〜95℃で混練して封止用樹脂組成物
を製造した。 これを冷却した後粉砕して成形材料とし
、成形材料をタブレット化し、予熱してトランスファー
成形で110℃に加熱した金型内に注入し硬化させて成
形品を得た。 得られた成形品について、熱伝導率、成
形性等の諸特性を試験した。 その結果を第1表に示し
た。Example 1 Talesol novolak epoxy resin (epoxy 121
5) Mix 18% with 9% novolac type phenol resin (phenol equivalent al 107), 70% boron nitride powder (average particle size 5 μ-), 3% release agent etc. at room temperature, and further heat to 90-95°C. A sealing resin composition was produced by kneading the mixture. After cooling, this was crushed to obtain a molding material. The molding material was made into a tablet, and the molded product was injected into a mold that had been preheated and heated to 110° C. by transfer molding and hardened. The obtained molded product was tested for various properties such as thermal conductivity and moldability. The results are shown in Table 1.
実施例 2
実施例1におけるボロンナイトライド粉゛末単体の代わ
りに、ボロンナイトライド粉末(平均粒径5μ1)30
%と結晶性シリカ粉末(平均粒径28μ−)40%を用
いた以外はすべて実施(lillと同一にして樹脂組成
物、成形材料、成形品を得、成形品の諸特性を試験した
。 その結果を第1表に示した。Example 2 Instead of the single boron nitride powder in Example 1, 30 boron nitride powders (average particle size 5μ1) were used.
% and crystalline silica powder (average particle size 28μ) except that 40% was used (all procedures were carried out in the same manner as in lill) to obtain a resin composition, molding material, and molded article, and test various properties of the molded article. The results are shown in Table 1.
比較例 1
クレゾールノボラックエポキシ樹脂(エポキシ当121
5) 18%に、ノボラック型フェノール樹脂(フェノ
ール5吊107) 9%、溶融シリカ粉末70%、離
型剤等3%を実施例1と同様に操作処理して樹脂組成物
、成形材料、成形品を得た。 得られた成形品について
諸特性を試験したのでその結果を第1表に示した。Comparative Example 1 Cresol novolac epoxy resin (121% per epoxy
5) 18%, 9% novolac type phenol resin (phenol 5 suspension 107), 70% fused silica powder, 3% mold release agent, etc. were added in the same manner as in Example 1 to obtain a resin composition, molding material, and molding. I got the item. The obtained molded product was tested for various properties, and the results are shown in Table 1.
比較例 2
比較例1における溶融シリカわ)末の代わりに結晶性シ
リカ粉末(平均粒径28μm)を用いた以外はすべて比
較例1と同一にして樹脂組成物、成形材料、成形品を得
た。 成形品について諸特性を試験したのでその結果を
第1表に示した。Comparative Example 2 A resin composition, molding material, and molded article were obtained in the same manner as in Comparative Example 1 except that crystalline silica powder (average particle size 28 μm) was used instead of the fused silica powder in Comparative Example 1. . The molded products were tested for various properties and the results are shown in Table 1.
1ヒ較例 3
クレゾールノボラックエポキシ樹脂(エポキシ当φ 2
15> 10%に、ノボラック型フェノール樹脂(フェ
ノール当71107) 5%、結晶性シリカ粉末(平
均粒(¥28μm)85%を用いた以外はすべて比較例
1と同一にして樹脂組成物、成形材料、成形品を得た。1 Comparative Example 3 Cresol novolak epoxy resin (φ2 per epoxy
15> The resin composition and molding material were all the same as in Comparative Example 1 except that 5% of novolak type phenol resin (phenol 71107) and 85% of crystalline silica powder (average grain (¥28 μm) were used for 10%). , a molded article was obtained.
成形品について品持性を試験したのでその結果を第1
表に示した。We tested the quality of the molded product, and the results are shown in the first section.
Shown in the table.
第1表
*2 : 120キャビティ取り16ビンDIP金型
を用いて、170℃で3分間トランスファー成形し充填
性を試験したTable 1 *2: Using a 120-cavity, 16-bin DIP mold, transfer molding was performed at 170°C for 3 minutes to test filling properties.
Claims (1)
粉末を樹脂組成物に対して25〜90重量%含有させる
ことを特徴とする封止用樹脂組成物。 2 エポキシ樹脂のエポキシ基(a)と、ノボラック型
フェノール樹脂のフェノール性水酸基(b)のモル比(
a/b)が、0.1〜10の範囲であることを特徴とす
る特許請求の範囲第1項記載の封止用樹脂組成物。 3 ボロンナイトライド粉末の平均粒子径が、60メッ
シュ以上の細径であることを特徴とする特許請求の範囲
第1項又は第2項記載の封止用樹脂組成物。[Scope of Claims] 1 (A) an epoxy resin, (B) a novolac type phenol resin, and (C) boron nitride powder are essential components, and the (C) boron nitride powder is added to the resin composition in an amount of 25%. A sealing resin composition characterized by containing up to 90% by weight. 2 The molar ratio of the epoxy group (a) of the epoxy resin to the phenolic hydroxyl group (b) of the novolac type phenolic resin (
The sealing resin composition according to claim 1, wherein a/b) is in the range of 0.1 to 10. 3. The sealing resin composition according to claim 1 or 2, wherein the boron nitride powder has an average particle size of 60 mesh or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22305784A JPS61101523A (en) | 1984-10-25 | 1984-10-25 | Sealing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22305784A JPS61101523A (en) | 1984-10-25 | 1984-10-25 | Sealing resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61101523A true JPS61101523A (en) | 1986-05-20 |
Family
ID=16792155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22305784A Pending JPS61101523A (en) | 1984-10-25 | 1984-10-25 | Sealing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61101523A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62223246A (en) * | 1986-03-25 | 1987-10-01 | Mitsubishi Electric Corp | Highly thermally conductive resin composition for use in sealing semiconductor |
WO1999024377A1 (en) * | 1997-11-12 | 1999-05-20 | Robert Bosch Gmbh | Boron nitride sealing element |
WO2000025122A1 (en) * | 1998-10-23 | 2000-05-04 | Robert Bosch Gmbh | Method for producing boron nitride sealing discs from a boron nitride block |
JP2008179724A (en) * | 2007-01-25 | 2008-08-07 | Nitto Denko Corp | Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5477663A (en) * | 1977-12-02 | 1979-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
JPS55102636A (en) * | 1979-01-31 | 1980-08-06 | Hitachi Cable Ltd | Highly heat-conductive resin composition |
JPS57115853A (en) * | 1981-01-12 | 1982-07-19 | Hitachi Ltd | Resin-sealed semiconductor device |
JPS6084362A (en) * | 1983-10-15 | 1985-05-13 | Matsushita Electric Works Ltd | Resin composition |
JPS60219222A (en) * | 1984-03-28 | 1985-11-01 | シーメンス、アクチエンゲゼルシヤフト | Forming and coating material |
-
1984
- 1984-10-25 JP JP22305784A patent/JPS61101523A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5477663A (en) * | 1977-12-02 | 1979-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
JPS55102636A (en) * | 1979-01-31 | 1980-08-06 | Hitachi Cable Ltd | Highly heat-conductive resin composition |
JPS57115853A (en) * | 1981-01-12 | 1982-07-19 | Hitachi Ltd | Resin-sealed semiconductor device |
JPS6084362A (en) * | 1983-10-15 | 1985-05-13 | Matsushita Electric Works Ltd | Resin composition |
JPS60219222A (en) * | 1984-03-28 | 1985-11-01 | シーメンス、アクチエンゲゼルシヤフト | Forming and coating material |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62223246A (en) * | 1986-03-25 | 1987-10-01 | Mitsubishi Electric Corp | Highly thermally conductive resin composition for use in sealing semiconductor |
WO1999024377A1 (en) * | 1997-11-12 | 1999-05-20 | Robert Bosch Gmbh | Boron nitride sealing element |
WO2000025122A1 (en) * | 1998-10-23 | 2000-05-04 | Robert Bosch Gmbh | Method for producing boron nitride sealing discs from a boron nitride block |
JP2008179724A (en) * | 2007-01-25 | 2008-08-07 | Nitto Denko Corp | Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH05239321A (en) | Epoxy resin composition and semiconductor-sealing arrangement | |
JPS61101522A (en) | Sealing resin composition | |
JPH0468345B2 (en) | ||
JPS61101523A (en) | Sealing resin composition | |
JPH05247181A (en) | Epoxy resin composition and semiconductor sealing device | |
JPS6222825A (en) | Sealing resin composition | |
JPH0249329B2 (en) | ||
JPS61101524A (en) | Sealing resin composition | |
JP2862928B2 (en) | Sealing resin composition and semiconductor sealing device | |
JPS60161423A (en) | Resin composition for sealing | |
JP2857441B2 (en) | Sealing resin composition and semiconductor sealing device | |
JPH0258525A (en) | Resin composition for sealing use | |
JPH06239976A (en) | Epoxy resin composition and sealed semiconductor device | |
JPS62112622A (en) | Sealing resin composition | |
JPS63286423A (en) | Resin composition for sealing | |
JPH03142956A (en) | Resin sealed type semiconductor device | |
JPH0562612B2 (en) | ||
JPH06329765A (en) | Preparation of epoxy resin composition, and sealed semiconductor device | |
JPS6031522A (en) | Sealing resin composition | |
JPS60152522A (en) | Sealing resin composition | |
JPH0739471B2 (en) | Sealing resin composition | |
JPH0314050B2 (en) | ||
JPH01144439A (en) | Sealing resin composition and production thereof | |
JPS63142024A (en) | Resin composition for sealing use | |
JPH0747681B2 (en) | Sealing resin composition |