JPS5477663A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5477663A
JPS5477663A JP14471977A JP14471977A JPS5477663A JP S5477663 A JPS5477663 A JP S5477663A JP 14471977 A JP14471977 A JP 14471977A JP 14471977 A JP14471977 A JP 14471977A JP S5477663 A JPS5477663 A JP S5477663A
Authority
JP
Japan
Prior art keywords
prepolymer
resin composition
curable resin
trismaleimide
bismaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14471977A
Other languages
Japanese (ja)
Other versions
JPS5610940B2 (en
Inventor
Morio Take
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP14471977A priority Critical patent/JPS5477663A/en
Publication of JPS5477663A publication Critical patent/JPS5477663A/en
Publication of JPS5610940B2 publication Critical patent/JPS5610940B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: A curable resin composition keeping intrinisic electricla properties of the resin and having high heat conductivity, that is composed of boron nitride, a cyanic ester and a mixture or reaction product of a bismaleimide with a trismaleimide.
CONSTITUTION: To (A) 10 W 80 wt% of boron nitride with an average particle size of 0.5 W 8 microns is added (B) 90 W 20 wt% of a mixture or reaction product from (a) a polyfunctional cyanic ester or its prepolymer or a coprepolymer from a polyfunctional cyanic ester and an amide, (b) bismaleimide, trismaleimide, maleimide prepolymer or prepolymer from maleimide and an amine, (c) an epoxy compound with 2 or more epoxy groups in the molecule and 700 W 6000 epoxy equivalent value.
COPYRIGHT: (C)1979,JPO&Japio
JP14471977A 1977-12-02 1977-12-02 Curable resin composition Granted JPS5477663A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14471977A JPS5477663A (en) 1977-12-02 1977-12-02 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14471977A JPS5477663A (en) 1977-12-02 1977-12-02 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5477663A true JPS5477663A (en) 1979-06-21
JPS5610940B2 JPS5610940B2 (en) 1981-03-11

Family

ID=15368704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14471977A Granted JPS5477663A (en) 1977-12-02 1977-12-02 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5477663A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726780A (en) * 1980-07-25 1982-02-12 Casio Comput Co Ltd Display device
JPS61101523A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JP2014503029A (en) * 2011-01-21 2014-02-06 ダウ グローバル テクノロジーズ エルエルシー High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications
JPWO2018147053A1 (en) * 2017-02-07 2019-02-14 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
JP2020173945A (en) * 2019-04-10 2020-10-22 信越化学工業株式会社 Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726780A (en) * 1980-07-25 1982-02-12 Casio Comput Co Ltd Display device
JPS61101523A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JP2014503029A (en) * 2011-01-21 2014-02-06 ダウ グローバル テクノロジーズ エルエルシー High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications
JPWO2018147053A1 (en) * 2017-02-07 2019-02-14 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
JP2020173945A (en) * 2019-04-10 2020-10-22 信越化学工業株式会社 Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

Also Published As

Publication number Publication date
JPS5610940B2 (en) 1981-03-11

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