JPS55102636A - Highly heat-conductive resin composition - Google Patents
Highly heat-conductive resin compositionInfo
- Publication number
- JPS55102636A JPS55102636A JP1055979A JP1055979A JPS55102636A JP S55102636 A JPS55102636 A JP S55102636A JP 1055979 A JP1055979 A JP 1055979A JP 1055979 A JP1055979 A JP 1055979A JP S55102636 A JPS55102636 A JP S55102636A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- resin composition
- conductive resin
- highly heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE: To improve the heat dissipation of an impedance device and an encapsulated IC, etc., and to reduce the size of a device, by adding boron nitride together with sintered alumina, etc. as heat-conductivity-imparting agnets, to an encapsulating resin.
CONSTITUTION: A resin composition for encapsulation of an electrical and electrononic device, composed of (A) 100 parts by weight of a resin such as epoxy resin, unsaturated polyester resin, etc., (B) pref. 1W100 parts of boron nitride, (C) pref. 5W400 parts of sintered or fused alumina, and if necessary, (D) a flame- retardant which does not evolve corrosive gas, e.g. decabromodiphenyl ether.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1055979A JPS55102636A (en) | 1979-01-31 | 1979-01-31 | Highly heat-conductive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1055979A JPS55102636A (en) | 1979-01-31 | 1979-01-31 | Highly heat-conductive resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55102636A true JPS55102636A (en) | 1980-08-06 |
JPS6111262B2 JPS6111262B2 (en) | 1986-04-02 |
Family
ID=11753599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1055979A Granted JPS55102636A (en) | 1979-01-31 | 1979-01-31 | Highly heat-conductive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55102636A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56856A (en) * | 1979-06-15 | 1981-01-07 | Showa Denko Kk | Heat-resistant rubber composition |
JPS594630A (en) * | 1982-06-30 | 1984-01-11 | Matsushita Electric Works Ltd | Resin composition |
JPS61101523A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS62223246A (en) * | 1986-03-25 | 1987-10-01 | Mitsubishi Electric Corp | Highly thermally conductive resin composition for use in sealing semiconductor |
JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
JPH05202277A (en) * | 1991-09-11 | 1993-08-10 | Mitsubishi Electric Corp | Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom |
WO2012002505A1 (en) * | 2010-07-02 | 2012-01-05 | 昭和電工株式会社 | Ceramic mixture, and ceramic-containing thermally-conductive resin sheet using same |
WO2020213348A1 (en) * | 2019-04-18 | 2020-10-22 | 信越化学工業株式会社 | Thermally conductive resin composition and thermally conductive resin cured product |
-
1979
- 1979-01-31 JP JP1055979A patent/JPS55102636A/en active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56856A (en) * | 1979-06-15 | 1981-01-07 | Showa Denko Kk | Heat-resistant rubber composition |
JPS5822056B2 (en) * | 1979-06-15 | 1983-05-06 | 昭和電工株式会社 | Heat resistant rubber composition |
JPS594630A (en) * | 1982-06-30 | 1984-01-11 | Matsushita Electric Works Ltd | Resin composition |
JPS61101523A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS62223246A (en) * | 1986-03-25 | 1987-10-01 | Mitsubishi Electric Corp | Highly thermally conductive resin composition for use in sealing semiconductor |
JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
JPH05202277A (en) * | 1991-09-11 | 1993-08-10 | Mitsubishi Electric Corp | Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom |
WO2012002505A1 (en) * | 2010-07-02 | 2012-01-05 | 昭和電工株式会社 | Ceramic mixture, and ceramic-containing thermally-conductive resin sheet using same |
WO2020213348A1 (en) * | 2019-04-18 | 2020-10-22 | 信越化学工業株式会社 | Thermally conductive resin composition and thermally conductive resin cured product |
JP2020176201A (en) * | 2019-04-18 | 2020-10-29 | 信越化学工業株式会社 | Heat-conductive resin composition and heat-conductive resin cured product |
Also Published As
Publication number | Publication date |
---|---|
JPS6111262B2 (en) | 1986-04-02 |
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