JPS55102636A - Highly heat-conductive resin composition - Google Patents

Highly heat-conductive resin composition

Info

Publication number
JPS55102636A
JPS55102636A JP1055979A JP1055979A JPS55102636A JP S55102636 A JPS55102636 A JP S55102636A JP 1055979 A JP1055979 A JP 1055979A JP 1055979 A JP1055979 A JP 1055979A JP S55102636 A JPS55102636 A JP S55102636A
Authority
JP
Japan
Prior art keywords
resin
parts
resin composition
conductive resin
highly heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1055979A
Other languages
Japanese (ja)
Other versions
JPS6111262B2 (en
Inventor
Jiro Ogura
Sadao Wakatsuki
Ryoichi Ito
Yukihiko Kajita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP1055979A priority Critical patent/JPS55102636A/en
Publication of JPS55102636A publication Critical patent/JPS55102636A/en
Publication of JPS6111262B2 publication Critical patent/JPS6111262B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: To improve the heat dissipation of an impedance device and an encapsulated IC, etc., and to reduce the size of a device, by adding boron nitride together with sintered alumina, etc. as heat-conductivity-imparting agnets, to an encapsulating resin.
CONSTITUTION: A resin composition for encapsulation of an electrical and electrononic device, composed of (A) 100 parts by weight of a resin such as epoxy resin, unsaturated polyester resin, etc., (B) pref. 1W100 parts of boron nitride, (C) pref. 5W400 parts of sintered or fused alumina, and if necessary, (D) a flame- retardant which does not evolve corrosive gas, e.g. decabromodiphenyl ether.
COPYRIGHT: (C)1980,JPO&Japio
JP1055979A 1979-01-31 1979-01-31 Highly heat-conductive resin composition Granted JPS55102636A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1055979A JPS55102636A (en) 1979-01-31 1979-01-31 Highly heat-conductive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1055979A JPS55102636A (en) 1979-01-31 1979-01-31 Highly heat-conductive resin composition

Publications (2)

Publication Number Publication Date
JPS55102636A true JPS55102636A (en) 1980-08-06
JPS6111262B2 JPS6111262B2 (en) 1986-04-02

Family

ID=11753599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1055979A Granted JPS55102636A (en) 1979-01-31 1979-01-31 Highly heat-conductive resin composition

Country Status (1)

Country Link
JP (1) JPS55102636A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56856A (en) * 1979-06-15 1981-01-07 Showa Denko Kk Heat-resistant rubber composition
JPS594630A (en) * 1982-06-30 1984-01-11 Matsushita Electric Works Ltd Resin composition
JPS61101523A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS62223246A (en) * 1986-03-25 1987-10-01 Mitsubishi Electric Corp Highly thermally conductive resin composition for use in sealing semiconductor
JPH03126765A (en) * 1989-10-02 1991-05-29 Siemens Ag Composite material resistant to high temperature
JPH05202277A (en) * 1991-09-11 1993-08-10 Mitsubishi Electric Corp Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom
WO2012002505A1 (en) * 2010-07-02 2012-01-05 昭和電工株式会社 Ceramic mixture, and ceramic-containing thermally-conductive resin sheet using same
WO2020213348A1 (en) * 2019-04-18 2020-10-22 信越化学工業株式会社 Thermally conductive resin composition and thermally conductive resin cured product

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56856A (en) * 1979-06-15 1981-01-07 Showa Denko Kk Heat-resistant rubber composition
JPS5822056B2 (en) * 1979-06-15 1983-05-06 昭和電工株式会社 Heat resistant rubber composition
JPS594630A (en) * 1982-06-30 1984-01-11 Matsushita Electric Works Ltd Resin composition
JPS61101523A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS62223246A (en) * 1986-03-25 1987-10-01 Mitsubishi Electric Corp Highly thermally conductive resin composition for use in sealing semiconductor
JPH03126765A (en) * 1989-10-02 1991-05-29 Siemens Ag Composite material resistant to high temperature
JPH05202277A (en) * 1991-09-11 1993-08-10 Mitsubishi Electric Corp Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom
WO2012002505A1 (en) * 2010-07-02 2012-01-05 昭和電工株式会社 Ceramic mixture, and ceramic-containing thermally-conductive resin sheet using same
WO2020213348A1 (en) * 2019-04-18 2020-10-22 信越化学工業株式会社 Thermally conductive resin composition and thermally conductive resin cured product
JP2020176201A (en) * 2019-04-18 2020-10-29 信越化学工業株式会社 Heat-conductive resin composition and heat-conductive resin cured product

Also Published As

Publication number Publication date
JPS6111262B2 (en) 1986-04-02

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