JPS5534483A - Resin for sealing semiconductor element - Google Patents

Resin for sealing semiconductor element

Info

Publication number
JPS5534483A
JPS5534483A JP10785378A JP10785378A JPS5534483A JP S5534483 A JPS5534483 A JP S5534483A JP 10785378 A JP10785378 A JP 10785378A JP 10785378 A JP10785378 A JP 10785378A JP S5534483 A JPS5534483 A JP S5534483A
Authority
JP
Japan
Prior art keywords
resin
semiconductor element
filler
electric power
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10785378A
Other languages
Japanese (ja)
Inventor
Yutaka Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10785378A priority Critical patent/JPS5534483A/en
Publication of JPS5534483A publication Critical patent/JPS5534483A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To heighten heat radiation effect of semiconductor device for electric power by employing specific resin containing beryllia porcelain material as filler.
CONSTITUTION: Resin 10 for sealing purpose of semiconductor element consists of epoxy resin or silicon resin, into which hardening agent and mold releasing agent containing 30W70wt% beryllia porcelain material as filler is mixed. Because it unnecessitates the use of copper-base material, thinning of package is feasible, and also facilitate the shortening the distance between the radiation plate 8 made of Al and the like and the pellet 1 which heightens the radiation effectiveness. Thus, the above invention helps greatly the increment of heat radiation effectiveness in the semiconductor device for electric power.
COPYRIGHT: (C)1980,JPO&Japio
JP10785378A 1978-09-01 1978-09-01 Resin for sealing semiconductor element Pending JPS5534483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10785378A JPS5534483A (en) 1978-09-01 1978-09-01 Resin for sealing semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10785378A JPS5534483A (en) 1978-09-01 1978-09-01 Resin for sealing semiconductor element

Publications (1)

Publication Number Publication Date
JPS5534483A true JPS5534483A (en) 1980-03-11

Family

ID=14469711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10785378A Pending JPS5534483A (en) 1978-09-01 1978-09-01 Resin for sealing semiconductor element

Country Status (1)

Country Link
JP (1) JPS5534483A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208640A (en) * 1981-06-16 1982-12-21 Toshiba Corp Optical information recorder
CN102683299A (en) * 2011-01-07 2012-09-19 新电元工业株式会社 Semiconductor device, resin sealing mould, device manufacturing method and lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208640A (en) * 1981-06-16 1982-12-21 Toshiba Corp Optical information recorder
CN102683299A (en) * 2011-01-07 2012-09-19 新电元工业株式会社 Semiconductor device, resin sealing mould, device manufacturing method and lead frame

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