JPS5375246A - High heat-conductive resin composition - Google Patents

High heat-conductive resin composition

Info

Publication number
JPS5375246A
JPS5375246A JP15161476A JP15161476A JPS5375246A JP S5375246 A JPS5375246 A JP S5375246A JP 15161476 A JP15161476 A JP 15161476A JP 15161476 A JP15161476 A JP 15161476A JP S5375246 A JPS5375246 A JP S5375246A
Authority
JP
Japan
Prior art keywords
resin composition
high heat
conductive resin
raised
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15161476A
Other languages
Japanese (ja)
Other versions
JPS544985B2 (en
Inventor
Tadaharu Yoshiga
Kazuo Iko
Makoto Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP15161476A priority Critical patent/JPS5375246A/en
Publication of JPS5375246A publication Critical patent/JPS5375246A/en
Publication of JPS544985B2 publication Critical patent/JPS544985B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: By mixing an inorganic filler having specified particle size distribution, closest packing structure is readily formed and the heat conductivity of resin molded products is raised.
COPYRIGHT: (C)1978,JPO&Japio
JP15161476A 1976-12-16 1976-12-16 High heat-conductive resin composition Granted JPS5375246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15161476A JPS5375246A (en) 1976-12-16 1976-12-16 High heat-conductive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15161476A JPS5375246A (en) 1976-12-16 1976-12-16 High heat-conductive resin composition

Publications (2)

Publication Number Publication Date
JPS5375246A true JPS5375246A (en) 1978-07-04
JPS544985B2 JPS544985B2 (en) 1979-03-12

Family

ID=15522376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15161476A Granted JPS5375246A (en) 1976-12-16 1976-12-16 High heat-conductive resin composition

Country Status (1)

Country Link
JP (1) JPS5375246A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580461A (en) * 1978-12-13 1980-06-17 Shin Etsu Chem Co Ltd Thermal conductive silicone rubber composition
JPS5815260A (en) * 1981-07-21 1983-01-28 Denki Kagaku Kogyo Kk Sealing agent for semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56175260U (en) * 1980-05-29 1981-12-24

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177638A (en) * 1974-12-27 1976-07-06 Vn Itsusureedowacherusukii I H Taishokusei tainetsuseioyobinetsudendoseiojusuru seikeihinyonososeibutsu dososeibutsuoyobiseikeihinnoseizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177638A (en) * 1974-12-27 1976-07-06 Vn Itsusureedowacherusukii I H Taishokusei tainetsuseioyobinetsudendoseiojusuru seikeihinyonososeibutsu dososeibutsuoyobiseikeihinnoseizohoho

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580461A (en) * 1978-12-13 1980-06-17 Shin Etsu Chem Co Ltd Thermal conductive silicone rubber composition
JPS614417B2 (en) * 1978-12-13 1986-02-10 Shinetsu Chem Ind Co
JPS5815260A (en) * 1981-07-21 1983-01-28 Denki Kagaku Kogyo Kk Sealing agent for semiconductor package
JPS623983B2 (en) * 1981-07-21 1987-01-28 Denki Kagaku Kogyo Kk

Also Published As

Publication number Publication date
JPS544985B2 (en) 1979-03-12

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