JPS62112622A - Sealing resin composition - Google Patents

Abstract

PURPOSE:To obtain a sealing resin composition excellent in moisture resistance, thermal cycling resistance and stress resistance, by mixing an epoxy resin with a novolak phenolic resin, a polyarylate resin and an inorganic filler at a specified ratio. CONSTITUTION:A resin composition prepared by mixing an epoxy resin (A) with a novolak phenolic resin (B), a polyarylate resin (C) and an inorganic filler (D) so that 0.1-10wt% component (C) and 25-90wt% component (D) are present in the resin composition. The mixing proportion of the novolak phenolic resin is preferably such that the equivalent ratio of the epoxy groups (a) of the epoxy resin to the phenolic hydroxyl groups (b) of the novolak phenolic resin [(a)/(b)] is in the range of 0.1-10.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention 1] The present invention relates to a resin composition for sealing electrical parts, etc., which has excellent moisture resistance and base cycle properties, and has low stress.

[Technical weight of the invention and its problems] Conventionally, there has been a method of fabricating electronic components such as diodes, transistors, and integrated circuits using thermosetting resin.
did it. This resin sealing method is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. Thermosetting resins are used as sealing resins, and among them, epoxy resins are most commonly used. By the way, acid anhydrides, aromatic amines, novolak type phenolic resins, and the like are used as curing agents for epoxy resins.

Among these, epoxy resins that use novolac type phenolic resin as a curing agent are preferred as semiconductor encapsulation materials because they have better moldability, moisture resistance, are not oriented, and are less expensive than those that use other curing agents. It is widely used as

However, an epoxy resin composition using a novolac type phenol resin as a curing agent has the disadvantage that it shrinks during molding and curing, applying stress to the semiconductor element, and deteriorating the reliability of the semiconductor element. In other words, when a base cycle test is performed on molded products using these resin compositions, problems such as bonding wire ovens, resin cracks, passivation cracks, pellet cracks, etc. occur, and the product loses its functionality as an electronic component. there were. These problems have become even more serious as semiconductor devices have recently become more highly integrated and larger. For these reasons, it has been desired to develop a sealing resin composition that maintains the advantages of the conventional epoxy resin compositions and has low stress.

[Object of the Invention] The object of the present invention has been made to solve the above-mentioned drawbacks and problems.
The present invention also aims to provide a resin composition for sealing that has low stress and high reliability.

[Summary of the Invention g5] As a result of intensive research aimed at achieving the above object, the present inventors have found that, as described below, by blending a polyarylate resin, the conventional The present invention has been completed based on the discovery that a sealing resin composition exhibiting excellent moisture resistance, high temperature and cold cycle properties, and low stress can be produced compared to the present invention. (A> Epoxy resin, (B) Novolac type phenolic resin, (C) Boaryaryl 1 resin represented by the following formula, and (D) an inorganic filler, and the above (C) polyarylate resin is added to the resin composition. This is a sealing resin composition characterized by containing 0.1 to 10% by weight of the inorganic filler (D) and 25 to 90% by weight of the inorganic filler (D). The equivalent ratio [(a)/(b)] between a) and the phenolic hydroxy acid u<b) of the novolac type phenolic resin is 0.1 to
It is a sealing resin composition within the range of 10.

The (△) epoxy resin used in the present invention is not limited to its molecular structure, molecule m, etc., as long as it is a compound having at least 2 g of epoxy groups in its molecule. Can be broadly encompassed. Examples include aromatic resins such as bisphenol type, alicyclic resins such as cyclohexane-derived (A), and epoxy novolak resins represented by the following general formula. These epoxy resins may be used singly or in combination of two or more. It is used as

(B) novolak type used in the present invention Phenol resins include novolac type phenol resins, which are produced by reacting phenols such as phenol and alkylphenols with formaldehyde or paraformaldehyde to produce 1q;
and modified resins thereof, such as epoxidized or butylated novolak type phenolic resins, which may be used alone or in combination of two or more. The blending ratio of the novolac type phenolic resin is determined by the equivalent ratio of the epoxy 13(a) of the (A) epoxy resin and the phenolic water M1b) of the (B) novolac type phenolic resin.
a>/(b)] is preferably in the range of 0.1 to 10. If the equivalent ratio is less than 0.1 or more than 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate;
Either case is not preferable. Therefore, it is preferable to limit it within the above range.

The polyarylate resin (C) used in the present invention may be any resin represented by the following formula consisting of an aromatic dicarboxylic acid and a dihydric phenol, and its ratio and molecular weight are not particularly limited.

A specific example is U polymer (Unideca 1 Sumitomo Chemical U-100).

The blending ratio of polyarylate resin is 0.1 of the resin composition.
It is desirable to blend it in an amount of ~10%.

If the ratio υj is less than 0°1% by weight, there is no effect of low stress and withstanding greenhouse cycles, and if it exceeds 10% by weight, water absorption and moldability deteriorate, making it unsuitable for practical use. Polyarylate resins have good compatibility with epoxy resins and phenolic resins, and are thought to impart flexibility to resin compositions and relieve stress, resulting in low stress.

Inorganic fillers (D) used in the present invention include silica powder, alumina, antimony trioxide, talc, calcium carbonate, titanium white, clay, asbestos, mica,
Examples include red iron oxide, glass fiber, carbon fiber, etc., and silica powder and alumina are particularly preferred. It is desirable that the solid filler be blended in an amount of 25 to 90% by weight of the resin composition. If the blending amount is less than 25% by weight, there will be no effect on moisture resistance, heat resistance, mechanical properties and moldability;
If it exceeds 0 wt ω%, the bulk becomes large and the moldability is poor, making it unsuitable for practical use.

The sealing resin composition of the present invention contains epoxy a (fat, novolak type phenolic resin, polyarylate resin, and inorganic filler as essential components, but may optionally include natural waxes, 2 synthetic waxes, linear Metal salts of fatty acids, acid amides, esters, mold release agents such as paraffins, chlorinated paraffins, flame retardants such as bromo-1-toluene, 1-bromobenzene, antimony trioxide, carbon black,
Coloring agents such as red iron oxide, silane coupling agents, various curing accelerators, etc. can also be added and blended as appropriate.

A general method for the sealing of the present invention (produced using the side fat composition as a molding material) is to use epoxy resin, novolac type phenol resin, polyarylate resin, non-alcoholic filler, etc. After mixing the raw material compositions selected in the composition ratio sufficiently uniformly using a mixer, etc., the mixture is further melted and mixed using hot rolls, or mixed using a kneader, etc., and then cooled to solidify and pulverized to an appropriate size. It can be a molded monthly interest rate.

The molding material made of the encapsulating resin composition according to the present invention can be applied to encapsulating, covering, insulating, etc. electronic or electrical components.

[Effect of the invention 1] The resin composition for i4 cars of the present invention has excellent moisture resistance, greenhouse cycle resistance, low stress, and good molding workability, and is suitable for sealing and coating electronic and electrical parts. When used for insulation, etc., it is possible to obtain a product with excellent reliability and quality.

[Examples of the Invention] The present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.

In the following Examples and Comparative Examples, "%" means 11
%” means.

Example 1 Cresol novolak epoxy resin (epoxy equivalent 2+
5) Mix 18% with 9% novolac type phenol resin (phenol equivalent: 107), 3% polyarylate resin (manufactured by Unitika), and 70% fused silica powder at normal humidity, and further heat at 90 to 95°C. After kneading and cooling,
It was crushed to obtain a molding material. tn molding material 17
A molded product was obtained by transfer injection into a mold heated to 0° C. and curing. This molded article was tested for durability such as moisture resistance and stress, and the results are shown in Table 1.

Example 2 Cresol novolak epoxy resin (epoxy m2
15) 16%, 8% novolac type phenolic resin (phenolized fi +07), 6% polyarylate resin (manufactured by Unitika), and 70% fused silica powder were mixed, kneaded, and ground in the same manner as in Example 1 to obtain a molding material. I got it.
Next, molded products were obtained in the same manner, and these molded products were tested for various properties such as moisture resistance and stress in the same manner as in Example 1.
The results are shown in Table 1.

Comparative example Cresol novolak epoxy resin (epoxy)i
215) 20%, novolak type phenolic resin (
Phenolized 1107) 10%, and silica powder 7
A molding material was obtained in the same manner as in the example. This molding material was used to make a molded article, and the various properties of the molded article were tested in the same manner as in the Examples, and the results are shown in Table 1.

As is clear from Table 1, the sealing resin composition of the present invention was confirmed to be moisture resistant, iQ cold recycling mixed, and low stress.

Claims (1)

[Claims] 1. (A) Epoxy resin, (B) Novolac type phenolic resin, (C) Polyarylate resin represented by the following formula, and ▲ Numerical formulas, chemical formulas, tables, etc. ▼ (D) Inorganic filling 0.1 to 10% by weight of the polyarylate resin (C) and 25 to 90% by weight of the inorganic filler (D) based on the resin composition. Resin composition. 2. Equivalence ratio of the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolac type phenol resin [
(a)/(b)] is within the range of 0.1 to 10, the sealing resin composition according to claim 1.