JPH0258525A - Resin composition for sealing use - Google Patents
Resin composition for sealing useInfo
- Publication number
- JPH0258525A JPH0258525A JP21145388A JP21145388A JPH0258525A JP H0258525 A JPH0258525 A JP H0258525A JP 21145388 A JP21145388 A JP 21145388A JP 21145388 A JP21145388 A JP 21145388A JP H0258525 A JPH0258525 A JP H0258525A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- inorganic filler
- resin composition
- acid anhydride
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 13
- 238000007789 sealing Methods 0.000 title claims description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 150000008065 acid anhydrides Chemical group 0.000 claims abstract description 15
- 125000003827 glycol group Chemical group 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000843 powder Substances 0.000 abstract description 6
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- 229920001515 polyalkylene glycol Polymers 0.000 abstract 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000010680 novolac-type phenolic resin Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、高熱伝導性、成形性に優れた封止用樹脂組成
物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a sealing resin composition having high thermal conductivity and excellent moldability.
（従来の技術）
従来、ダイオード、トランジスタ、集積回路などの電子
部品では、熱硬化性樹脂を用いてそれを封止する方法か
行われてきた。 この樹脂封止は、ガラス、金属、セラ
ミックを用いたハーメチックシール方式に比較して、経
済的に有利なために広く実用化されている。 封止用樹
脂として熱硬化性樹脂が使われ、中でもエポキシ樹脂組
成物が最も一般的に用いられている。 エポキシ樹脂組
成物は、酸無水物、芳香族アミン、ノボラック型フエノ
ール樹脂等の硬化剤が用いられている。 これらの中で
もノボランク型フェノール樹脂を硬化剤としたエポキシ
樹脂組成物は、他の硬化剤を使用したものに比べて、成
形性、！１（湿性に優れ、毒性がなく、かつ安価である
ため半導体封止材料として広く用いられている。(Prior Art) Conventionally, electronic components such as diodes, transistors, and integrated circuits have been sealed using thermosetting resin. This resin sealing is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. Thermosetting resins are used as sealing resins, and epoxy resin compositions are most commonly used. Epoxy resin compositions use curing agents such as acid anhydrides, aromatic amines, and novolak-type phenol resins. Among these, epoxy resin compositions using novolanc type phenolic resin as a curing agent have better moldability than those using other curing agents! 1 (It is widely used as a semiconductor encapsulation material because it has excellent moisture properties, is non-toxic, and is inexpensive.
しかしながら、ノボラック型フェノール樹脂を硬化剤と
したエポキシ樹脂組成物は、成形硬化時に収縮して半導
体素子に応力がかかり、信頼性に劣るという欠点がある
。 こうした樹脂組成物を使用した成形品の錫基サイク
ルテストを行うと、ポジデインクワイヤのオープン、樹
脂クラック、ペレットクラックが発生し、電子部品とし
ての機能が東ぜなくなるという問題があった。 こうし
た場合、低応力の組成物にするため、無機質充填剤を大
量に加えて熱膨脹１系数を下げる方法がとられるが、無
機質充填剤を大量に加えると成形流動性が著しく悪くな
り、フラットパッケージやＳＯ、Ｊ （５ｎａｉｌ ０
ｕｔｌｉｎｅ Ｊ−１，ｅａｄ Ｐａｃｋａｇｅ）タイ
プ等の薄肉パッケージでは十分充填できない等の間趙が
あった。 また、高熱伝導性樹脂の場合も無機質充填剤
を大量に加えて熱伝導率を上げるため、上記と同様に成
形性に劣る欠点があった。However, epoxy resin compositions using a novolac type phenolic resin as a curing agent have the disadvantage that they shrink during molding and curing, applying stress to semiconductor elements, resulting in poor reliability. When a molded article using such a resin composition is subjected to a tin-based cycle test, positive ink wire opens, resin cracks, and pellet cracks occur, resulting in a loss of functionality as an electronic component. In such cases, in order to create a composition with low stress, a large amount of inorganic filler is added to lower the coefficient of thermal expansion. SO, J (5nail 0
There was a problem that thin packages such as Utline J-1 (ead package) could not be filled sufficiently. Furthermore, in the case of highly thermally conductive resins, a large amount of inorganic filler is added to increase the thermal conductivity, which has the same drawback of poor moldability.
（発明が解決しようとする課題）
本発明は、上記の欠点、問題点に鑑みてなされたもので
、低応力で高熱伝導性、成形性に優れ、かつ従来のエポ
キシ樹脂４１１成物の利点を保持した、信頼性のある封
止用樹脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made in view of the above-mentioned drawbacks and problems. It is an object of the present invention to provide a reliable sealing resin composition that maintains its properties.
［発明の構成］
（課題を解決するための手段）
本発明者らは、上記の目的を達成しようと説法研究を重
ねた結果、ポリオキシアルキレングリコール構造と酸無
水物構造を有する化合物を配合することによって、上記
の目的を達成できることを見いだし、本発明を完成した
ものである。[Structure of the Invention] (Means for Solving the Problem) As a result of repeated research in an attempt to achieve the above object, the present inventors have formulated a compound having a polyoxyalkylene glycol structure and an acid anhydride structure. The present invention has been completed by discovering that the above object can be achieved by doing so.
すなわち、本発明は、
（Ａ）エポキシ樹脂、
（Ｂ）ノボラック型フェノール樹脂、
（Ｃ）次の一般式で示されるポリオキシアルキレンクリ
コール構造と、酸無水物構造を有する化合物
限はなく、一般に封止用材料に使用されているものを広
く包含することができる。 例えばビスフェノール型の
芳香族系、シクロヘキサン誘導体等の脂環族系、さらに
次の一般式で示されるエポキシノボランク系等の樹脂が
挙けられる。That is, the present invention is not limited to compounds having (A) epoxy resin, (B) novolac type phenol resin, (C) polyoxyalkylene glycol structure represented by the following general formula and acid anhydride structure, but generally A wide range of materials used for sealing materials can be included. Examples include aromatic resins such as bisphenol type, alicyclic resins such as cyclohexane derivatives, and epoxy novolanic resins represented by the following general formula.
（ｆｎ Ｌ、式中、Ａはエチレン基又はプロピレン基を
、Ｒはアルキル基を、Ｘは水素原子又はメチル基を、翔
は２〜３０の整数を、ｎは５〜１０００の整数をそれぞ
れ表す）
（Ｉ））無機質充填剤
を必須成分とし、全体の樹脂組成物に対して、前記（Ｃ
）のポリオキシアルキレングリコール構造と酸無水物を
有する化合物を ０．１〜３０重量％、また（Ｄ）の無
機質充填剤を２５〜９０重量％含有することを特徴とす
る封止用樹脂組成物である。(fn L, where A represents an ethylene group or a propylene group, R represents an alkyl group, X represents a hydrogen atom or a methyl group, Sho represents an integer of 2 to 30, and n represents an integer of 5 to 1000. ) (I)) Inorganic filler is an essential component, and the above (C
) A sealing resin composition characterized by containing 0.1 to 30% by weight of a compound having a polyoxyalkylene glycol structure and an acid anhydride, and 25 to 90% by weight of an inorganic filler (D). It is.
本発明に用いる（Ａ）エポキシ樹脂としては、その分子
中にエポキシ基を少なくと（Ｊ２個有する化合物である
限り、分子構造、分子量など特に制但し一式中Ｒ１は水
素原子、ハロゲン原子又はアルキル基を、Ｒ２は水素原
子又はアルキル基を、口は１以上の整数を表す）
これらのエポキシ樹脂は羊独又は２種以上混合して使用
することができる。As long as the epoxy resin (A) used in the present invention is a compound having at least J2 epoxy groups in its molecule, the molecular structure, molecular weight, etc. are particularly limited. , R2 represents a hydrogen atom or an alkyl group, and ``input'' represents an integer of 1 or more.) These epoxy resins can be used individually or in a mixture of two or more.
本発明に用いる（Ｂ）ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノール
類と、ホルムアルデヒドあるいはバラホルムアルデヒド
を反応させて得られるノボラック型フェノール樹脂およ
びこれらの変性樹脂、例えばエポキシ化もしくはブチル
化ノボラック型フェノール樹脂等が挙げられ、これらは
単独もしくは２種以上混合して使用することができる。The (B) novolak type phenolic resin used in the present invention includes novolak type phenol resins obtained by reacting phenols such as phenol and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as epoxidized or butylated novolaks. type phenolic resins, etc., and these can be used alone or in a mixture of two or more.
ノボラック型フェノール樹脂の配合割合は、前述の（Ａ
）エポキシ樹脂のエポキシ基（ａ ）と（Ｂ）のノボ
ラック型フェノール樹脂のフェノール性水酸基（ｂ）と
のモル比［（ａｍ／（ｂ）３が０．１〜１０の範囲内で
あることが好ましい、 このモル比が０．１末；ｒ４も
しくは１０を超えると、耐湿性、成形作業性および硬化
物の電気特性が悪くなり、いずれの場合ら好ましくない
。The blending ratio of the novolac type phenolic resin is as described above (A
) The molar ratio of the epoxy group (a) of the epoxy resin to the phenolic hydroxyl group (b) of the novolac type phenolic resin (B) [(am/(b)3 is preferably within the range of 0.1 to 10) Preferably, if this molar ratio exceeds 0.1; r4 or 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, which is undesirable in either case.
本発明に用いる（Ｃ）ポリオキシアルキレングリコール
構造と酸無水物構造を有する化合物は、次の一般式を有
するらのである。The compound (C) having a polyoxyalkylene glycol structure and an acid anhydride structure used in the present invention has the following general formula.
（但し、式中、Ａはエチレン基又はプロピレン基を、Ｒ
はアルキル基を、Ｘは水素原子又はメチル基を、ｔは２
〜３０の整数を、ｎは５〜１０００の整数をそれぞれ表
す）
ポリオキシアルキレングリコール構造と酸無水物構造を
有する化合物の配合割合は、全体の組成物に対して０．
１〜３０重量％含有することが望ましい。(However, in the formula, A represents an ethylene group or a propylene group, and R
is an alkyl group, X is a hydrogen atom or a methyl group, t is 2
n represents an integer of 5 to 1000, respectively) The compounding ratio of the compound having a polyoxyalkylene glycol structure and an acid anhydride structure is 0.0 to 30, and n represents an integer of 5 to 1000.
It is desirable to contain 1 to 30% by weight.
その割合が０．１重量％未満では成形流動性が劣り、ま
た３０重量％を超えると耐湿性が低丁し好ましくない。If the proportion is less than 0.1% by weight, the molding fluidity will be poor, and if it exceeds 30% by weight, the moisture resistance will be low, which is not preferable.
本発明に用いる（Ｄ）無機質充填剤としては、シリカ粉
末、アルミナ、三酸化アンチモン、タルク、炭酸カルシ
ウム、チタンホワイト、クレーマイカ、ベンガラ、ガラ
ス繊維、炭素繊維等が挙げられ、これらのなかでもシリ
カ粉末およびアルミナが特に好ましく使用される。 無
機質充填剤の配合割合は、全体の樹脂組成物に対して２
５〜９０重量％含有することが望ましい、 その割合が
２５重重量未満では耐湿性、耐熱性、８Ｉ械的特性およ
び成形性に効果なく、また９０重量％を超えるとかさば
りが大きく成形性が悪く実用に適さない。Examples of the inorganic filler (D) used in the present invention include silica powder, alumina, antimony trioxide, talc, calcium carbonate, titanium white, clay mica, red iron oxide, glass fiber, carbon fiber, etc. Among these, silica powder and alumina are particularly preferably used. The blending ratio of the inorganic filler is 2% to the entire resin composition.
It is desirable to contain 5 to 90% by weight. If the proportion is less than 25% by weight, it will have no effect on moisture resistance, heat resistance, 8I mechanical properties and moldability, and if it exceeds 90% by weight, it will be bulky and have poor moldability. Not suitable for practical use.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、ポリオキシアルキレングリコール
構造と酸無水物構造を有する化合物、無機質充填剤を必
須成分とするが、必要に応じて本発明の目的に反しない
範囲において、例えば天然ワ・ｌクス類、合成ワックス
類、直鎖脂肪酸の金属塩、酸アミド、エステル類、パラ
フィン類などの＾を型剤、塩素化パラフィン、ブロムト
ルエン、ヘキサブロムベンゼン 三酸（ヒアンチモンな
どの芦燃甲１、カーボンブラ・Ｉり、ペンカラなどの＠
色剤、シランカンプリング剤、種々の硬化促進剤等を適
宜添加配合することができる。The sealing resin composition of the present invention contains an epoxy resin, a novolac type phenol resin, a compound having a polyoxyalkylene glycol structure and an acid anhydride structure, and an inorganic filler as essential components, but the sealing resin composition of the present invention may optionally contain For example, natural waxes, synthetic waxes, metal salts of straight chain fatty acids, acid amides, esters, paraffins, etc. may be used as molding agents, chlorinated paraffin, bromotoluene, hexabromide, etc., to the extent that it does not contradict the purpose. Benzene Triacid (Ashibenko 1 such as Hyantimony, Carbonbura, Iri, Penkara, etc.)
Colorants, silane camping agents, various curing accelerators, etc. can be added and blended as appropriate.
本発明の封止用樹脂組成物を成形材料として製造する場
合の一般的な方法は、エポキシ樹脂、ノボラック型フェ
ノール樹脂、ポリオキシアルキレングリコール構造と酸
無水！！ｌｌｌ］槽遣を有する化合物、無機質充填剤、
その他を所定の組成比に泗んだ原料組成分をミキサー等
によって十分均一に混合した後、更に熱ロールによる浴
融混合処理、またはニーダ等による混合処理を行い、次
いで冷却固（ヒさせ、適当な大きさに粉砕して成形材料
とすることができる。 こうして製造された成形材料は
、電子部品或いは電気部品の封止、被覆、絶縁等に適用
することができる。The general method for manufacturing the sealing resin composition of the present invention as a molding material is to use an epoxy resin, a novolac type phenol resin, a polyoxyalkylene glycol structure, and an acid anhydride! ! lll] compound having a tank structure, an inorganic filler,
After the raw material composition with other ingredients adjusted to a predetermined composition ratio is mixed sufficiently uniformly using a mixer, etc., it is further subjected to bath melt mixing treatment using hot rolls or mixing treatment using a kneader, etc., and then cooled and solidified (heated, etc.). The molding material thus produced can be applied to sealing, covering, insulating, etc. electronic or electrical components.
（作用）
本発明の封止用樹脂組成物は、ポリオキシアルキレング
リコール構造と酸無水才勿横遣を有する化合物を用いた
ことによって その成熟７ト掬構造がエポキシ耐脂の硬
化に開り−し、ポリオキシアルキレングリコール構造が
低応力に寄り−する。 その結果、高熱伝導性、成形流
動性に優れ、かつ低応力、耐湿性のよい封止用樹脂組成
１勿が得られるものである。(Function) The encapsulating resin composition of the present invention uses a compound having a polyoxyalkylene glycol structure and an acid anhydride, so that its mature structure is open to hardening of epoxy and grease-resistant. However, the polyoxyalkylene glycol structure tends to have low stress. As a result, a sealing resin composition 1 having high thermal conductivity, excellent molding fluidity, low stress, and good moisture resistance can be obtained.
（実施例）
本発明を実施例によって説明するが、本発明は以下の実
施例に限定されるものではない。 Ｖｊ、下の実施例お
よび比較例において「％」とあるのは「重量％ｊを意味
する。(Examples) The present invention will be explained by examples, but the present invention is not limited to the following examples. Vj, in the Examples and Comparative Examples below, "%" means "% by weight j".
実施例 １
クレゾールノボラックエポキシ樹脂（エポキシ当ｊｉ
２１５） １５％に、ノボラック型フェノール樹脂（フ
ェノール当ｆｆｉ １０７） ７％、ポリオキシアル
キレングリコール構造と酸無水物構造を有する化合物３
％、および溶融シリカ粉末７５％を常温で混合し、さら
に９０〜９５°Ｃで混練して冷却した後、粉砕して成形
材料（Ａ）を製造した。Example 1 Cresol novolac epoxy resin (epoxy
215) 15%, novolac type phenolic resin (phenol ffi 107) 7%, compound 3 having a polyoxyalkylene glycol structure and an acid anhydride structure
% and 75% of fused silica powder were mixed at room temperature, further kneaded at 90 to 95°C, cooled, and pulverized to produce a molding material (A).
実施例 ２
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １０％に、ノボラック型フェノール樹脂（フェノ
ール当量１０７） ５％、ポリオキシアルキレングリ
コール構造と酸無水物構造を有する化合物１％、結晶性
シリカ粉末８２％、その池の成分２％を常温で混合し、
さらに９０〜９５°Ｃで混練して冷却した後、粉砕して
成形材ｆ４（Ｂ）を製造した。Example 2 Cresol novolac epoxy resin (epoxy equivalent weight 21
5) To 10%, add 5% novolac type phenol resin (phenol equivalent: 107), 1% compound having a polyoxyalkylene glycol structure and acid anhydride structure, 82% crystalline silica powder, and 2% of the components at room temperature. mix,
The mixture was further kneaded at 90 to 95°C, cooled, and then crushed to produce molded material f4 (B).
比較例 １
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １５％に、ノボラック型フェノール樹脂（フェノ
ール当量１０７） ７％、シリカ粉末７５％、その曲
の成分３％を実施例１と同様に混練して成形材料（Ｃ）
を製造した。Comparative Example 1 Cresol novolak epoxy resin (epoxy equivalent: 21
5) 15%, 7% novolac type phenol resin (phenol equivalent: 107), 75% silica powder, and 3% of the component of the song were kneaded in the same manner as in Example 1 to obtain a molding material (C).
was manufactured.
比較例 ２
実施例２において、ポリオキシアルキレングリコール構
造と酸無水物構造を有する化合物を除き、その他の成分
を３％を加えた以外、すべて実施例２と同一にして成形
材料（Ｄ）を製造した。Comparative Example 2 A molding material (D) was produced in the same manner as in Example 2 except for the compound having a polyoxyalkylene glycol structure and an acid anhydride structure and the addition of 3% of other components. did.
実施例１〜２および比較例１〜２で製造した成形材ｆ４
（Ａ）〜（Ｄ）を、１７０’（ｊニア１［１ｆｉ Ｌ７
’、：金型内にトランスファー注入し硬化させて、成形
品（封止品）を得た。 この成形品について諸試１稜を
行い、結果を得なので第１表に示しな。Molded material f4 manufactured in Examples 1-2 and Comparative Examples 1-2
(A) to (D), 170' (j near 1[1fi L7
',: A molded product (sealed product) was obtained by transfer injection into a mold and curing. Various tests were conducted on this molded product, and the results are shown in Table 1.
第１表 （単位） 保持した、信頼性の高いものである。Table 1 (unit) It is highly reliable.
［発明の効果］[Effect of the invention]
Claims (1)
０００の整数をそれぞれ表す） （Ｄ）無機質充填剤 を必須成分とし、全体の樹脂組成物に対して前記（Ｃ）
のポリオキシアルキレングリコール構造と酸無水物を有
する化合物を０．１〜３０重量％、また（Ｄ）の無機質
充填剤を２５〜９０重量％含有することを特徴とする封
止用樹脂組成物。[Scope of Claims] 1 (A) Epoxy resin, (B) Novolac type phenol resin, (C) A compound having a polyoxyalkylene glycol structure represented by the following general formula and an acid anhydride structure ▲ Numerical formula, chemical formula, There are tables, etc. ▼ (However, in the formula, A is an ethylene group or a propylene group, R is an alkyl group, X is a hydrogen atom or a methyl group, m is an integer from 2 to 30, and n is an integer from 5 to 1.
(Each represents an integer of 000) (D) Inorganic filler is an essential component, and (C) is added to the entire resin composition.
A sealing resin composition characterized by containing 0.1 to 30% by weight of a compound having a polyoxyalkylene glycol structure and an acid anhydride, and 25 to 90% by weight of an inorganic filler (D).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21145388A JP2641183B2 (en) | 1988-08-25 | 1988-08-25 | Resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21145388A JP2641183B2 (en) | 1988-08-25 | 1988-08-25 | Resin composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258525A true JPH0258525A (en) | 1990-02-27 |
| JP2641183B2 JP2641183B2 (en) | 1997-08-13 |
Family
ID=16606198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21145388A Expired - Lifetime JP2641183B2 (en) | 1988-08-25 | 1988-08-25 | Resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2641183B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285591A (en) * | 2007-05-17 | 2008-11-27 | Nitto Denko Corp | Epoxy resin composition for sealing optical semiconductor element, cured product thereof and optical semiconductor device using the same |
| JP2010116515A (en) * | 2008-11-14 | 2010-05-27 | Denki Kagaku Kogyo Kk | Epoxy resin composition and sheet |
| CN109679278A (en) * | 2018-12-04 | 2019-04-26 | 长春安旨科技有限公司 | A kind of high water absorption high abrasion water lubrication sealing material and preparation method thereof |
-
1988
- 1988-08-25 JP JP21145388A patent/JP2641183B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285591A (en) * | 2007-05-17 | 2008-11-27 | Nitto Denko Corp | Epoxy resin composition for sealing optical semiconductor element, cured product thereof and optical semiconductor device using the same |
| JP2010116515A (en) * | 2008-11-14 | 2010-05-27 | Denki Kagaku Kogyo Kk | Epoxy resin composition and sheet |
| CN109679278A (en) * | 2018-12-04 | 2019-04-26 | 长春安旨科技有限公司 | A kind of high water absorption high abrasion water lubrication sealing material and preparation method thereof |
| CN109679278B (en) * | 2018-12-04 | 2021-08-10 | 长春安旨科技有限公司 | High-water-absorption high-wear-resistance water-lubricating sealing material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2641183B2 (en) | 1997-08-13 |
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