JPS57180624A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS57180624A
JPS57180624A JP6549881A JP6549881A JPS57180624A JP S57180624 A JPS57180624 A JP S57180624A JP 6549881 A JP6549881 A JP 6549881A JP 6549881 A JP6549881 A JP 6549881A JP S57180624 A JPS57180624 A JP S57180624A
Authority
JP
Japan
Prior art keywords
adduct
composition
prepolymer
filler
halogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6549881A
Other languages
Japanese (ja)
Inventor
Kiyoji Makino
Kazuyuki Tomonaga
Tsutomu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP6549881A priority Critical patent/JPS57180624A/en
Publication of JPS57180624A publication Critical patent/JPS57180624A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition having good heat resistance and excellent processability and being useful as a powder material, prepared by adding a filler to a resin composition prepared by adding an epoxy compound to a bismaleimide compound/aminophenol adduct.
CONSTITUTION: A prepolymer is obtained by reacting an epoxy resin with an adduct between a bismaleimide compound of formulaI, wherein R1 is H or an alkyl, R2 is a bivalent organic group selected from a group consisting of O, CH2, SO2 and -S-S-, R3 is H or a halogen, and an aminophenol of formula II, wherein R4 is a monovalent atom or group selected from the class consisting of H, halogen and alkyl, said adduct, solftening point 80W120°C, being obtained by heating the components at an equivalent ratio at 130W140°C under agitation. Then, the purpose composition is obtained by mixing 80W30wt% this prepolymer with 20W70wt% filler (e.g., graphite powder). This composition itself shows moderate flexibility in the cured state and, when formed into a film, can prevent formation of cracks and shows an effect of retarding degradation even at a temperature of 200°C.
COPYRIGHT: (C)1982,JPO&Japio
JP6549881A 1981-04-30 1981-04-30 Thermosetting resin composition Pending JPS57180624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6549881A JPS57180624A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6549881A JPS57180624A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS57180624A true JPS57180624A (en) 1982-11-06

Family

ID=13288808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6549881A Pending JPS57180624A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57180624A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254798A (en) * 1975-10-31 1977-05-04 Hitachi Ltd Thermosetting resin compositions
JPS531226A (en) * 1976-06-25 1978-01-09 Toshiba Chem Corp Resin compositions for powder coating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254798A (en) * 1975-10-31 1977-05-04 Hitachi Ltd Thermosetting resin compositions
JPS531226A (en) * 1976-06-25 1978-01-09 Toshiba Chem Corp Resin compositions for powder coating

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