JPS56157426A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS56157426A
JPS56157426A JP5963280A JP5963280A JPS56157426A JP S56157426 A JPS56157426 A JP S56157426A JP 5963280 A JP5963280 A JP 5963280A JP 5963280 A JP5963280 A JP 5963280A JP S56157426 A JPS56157426 A JP S56157426A
Authority
JP
Japan
Prior art keywords
resin composition
prepared
acid ester
resin
cyanic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5963280A
Other languages
Japanese (ja)
Other versions
JPS5740179B2 (en
Inventor
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP5963280A priority Critical patent/JPS56157426A/en
Publication of JPS56157426A publication Critical patent/JPS56157426A/en
Publication of JPS5740179B2 publication Critical patent/JPS5740179B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE: A curable resin composition having excellent heat resistance and good adhesion to metals, prepared by adding a polyvinyl acetal resin to a cyanic acid ester type resin composition.
CONSTITUTION: A cyanic acid ester type resin composition is prepared by mixing or prereacting (i) a polyfunctional cyanic acid ester, e.g., 1,3-dicyanatobenzene, (ii) a polyfunctional maleimide, e.g., bis(4-maleimidophenyl) ether and (iii) an epoxy resin. Then, a curable resin composition is prepared by blending said resin composition with a polyvinyl acetal resin (in addition, a normally liquid diene type rubber having hydroxyl groups and carboxyl groups can be added). This composition can crosslink and cure into a heat-resistant resin composition by heating it as such, but it is preferred to cure the resin by adding thereto a catalyst, e.g., 2-methylimidazole, to promote crosslinking into a three-dimensional network.
COPYRIGHT: (C)1981,JPO&Japio
JP5963280A 1980-05-06 1980-05-06 Curable resin composition Granted JPS56157426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5963280A JPS56157426A (en) 1980-05-06 1980-05-06 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5963280A JPS56157426A (en) 1980-05-06 1980-05-06 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS56157426A true JPS56157426A (en) 1981-12-04
JPS5740179B2 JPS5740179B2 (en) 1982-08-25

Family

ID=13118794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5963280A Granted JPS56157426A (en) 1980-05-06 1980-05-06 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS56157426A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0386358A2 (en) * 1989-03-10 1990-09-12 Somar Corporation Thermosetting powder composition
JP2018203928A (en) * 2017-06-07 2018-12-27 積水化学工業株式会社 Curable resin composition
JP2018203929A (en) * 2017-06-07 2018-12-27 積水化学工業株式会社 Curable resin composition
WO2024154715A1 (en) * 2023-01-16 2024-07-25 三菱瓦斯化学株式会社 Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149300A (en) * 1977-06-01 1978-12-26 Ciba Geigy Ag Thermal setting composite material and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149300A (en) * 1977-06-01 1978-12-26 Ciba Geigy Ag Thermal setting composite material and its manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0386358A2 (en) * 1989-03-10 1990-09-12 Somar Corporation Thermosetting powder composition
US5089555A (en) * 1989-03-10 1992-02-18 Somar Corporation Thermosetting powder composition
JP2018203928A (en) * 2017-06-07 2018-12-27 積水化学工業株式会社 Curable resin composition
JP2018203929A (en) * 2017-06-07 2018-12-27 積水化学工業株式会社 Curable resin composition
WO2024154715A1 (en) * 2023-01-16 2024-07-25 三菱瓦斯化学株式会社 Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board

Also Published As

Publication number Publication date
JPS5740179B2 (en) 1982-08-25

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