JPS56157426A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS56157426A JPS56157426A JP5963280A JP5963280A JPS56157426A JP S56157426 A JPS56157426 A JP S56157426A JP 5963280 A JP5963280 A JP 5963280A JP 5963280 A JP5963280 A JP 5963280A JP S56157426 A JPS56157426 A JP S56157426A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- prepared
- acid ester
- resin
- cyanic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
PURPOSE: A curable resin composition having excellent heat resistance and good adhesion to metals, prepared by adding a polyvinyl acetal resin to a cyanic acid ester type resin composition.
CONSTITUTION: A cyanic acid ester type resin composition is prepared by mixing or prereacting (i) a polyfunctional cyanic acid ester, e.g., 1,3-dicyanatobenzene, (ii) a polyfunctional maleimide, e.g., bis(4-maleimidophenyl) ether and (iii) an epoxy resin. Then, a curable resin composition is prepared by blending said resin composition with a polyvinyl acetal resin (in addition, a normally liquid diene type rubber having hydroxyl groups and carboxyl groups can be added). This composition can crosslink and cure into a heat-resistant resin composition by heating it as such, but it is preferred to cure the resin by adding thereto a catalyst, e.g., 2-methylimidazole, to promote crosslinking into a three-dimensional network.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5963280A JPS56157426A (en) | 1980-05-06 | 1980-05-06 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5963280A JPS56157426A (en) | 1980-05-06 | 1980-05-06 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56157426A true JPS56157426A (en) | 1981-12-04 |
JPS5740179B2 JPS5740179B2 (en) | 1982-08-25 |
Family
ID=13118794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5963280A Granted JPS56157426A (en) | 1980-05-06 | 1980-05-06 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56157426A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0386358A2 (en) * | 1989-03-10 | 1990-09-12 | Somar Corporation | Thermosetting powder composition |
JP2018203928A (en) * | 2017-06-07 | 2018-12-27 | 積水化学工業株式会社 | Curable resin composition |
JP2018203929A (en) * | 2017-06-07 | 2018-12-27 | 積水化学工業株式会社 | Curable resin composition |
WO2024154715A1 (en) * | 2023-01-16 | 2024-07-25 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149300A (en) * | 1977-06-01 | 1978-12-26 | Ciba Geigy Ag | Thermal setting composite material and its manufacture |
-
1980
- 1980-05-06 JP JP5963280A patent/JPS56157426A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149300A (en) * | 1977-06-01 | 1978-12-26 | Ciba Geigy Ag | Thermal setting composite material and its manufacture |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0386358A2 (en) * | 1989-03-10 | 1990-09-12 | Somar Corporation | Thermosetting powder composition |
US5089555A (en) * | 1989-03-10 | 1992-02-18 | Somar Corporation | Thermosetting powder composition |
JP2018203928A (en) * | 2017-06-07 | 2018-12-27 | 積水化学工業株式会社 | Curable resin composition |
JP2018203929A (en) * | 2017-06-07 | 2018-12-27 | 積水化学工業株式会社 | Curable resin composition |
WO2024154715A1 (en) * | 2023-01-16 | 2024-07-25 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPS5740179B2 (en) | 1982-08-25 |
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