JPS54148896A - Epoxy resin composition for curing wet surface - Google Patents

Epoxy resin composition for curing wet surface

Info

Publication number
JPS54148896A
JPS54148896A JP5661678A JP5661678A JPS54148896A JP S54148896 A JPS54148896 A JP S54148896A JP 5661678 A JP5661678 A JP 5661678A JP 5661678 A JP5661678 A JP 5661678A JP S54148896 A JPS54148896 A JP S54148896A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
wet surface
hexamethylenediamine
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5661678A
Other languages
Japanese (ja)
Inventor
Yoshimi Sumiya
Hiroshi Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP5661678A priority Critical patent/JPS54148896A/en
Publication of JPS54148896A publication Critical patent/JPS54148896A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A composition capable of forming a cured material of an epoxy resin having high bond strength curable in water or in wet surfaces at low temperatures and in short time, obtained by using a reaction product of hexamethylenediamine and a glycidyl ether as a curing agent.
CONSTITUTION: A composition consisting of A) 100 parts by wt. of an epoxy resin having two or more epoxy groups in a molecule, B) 5W200 parts by wt. of a reaction product of a) one mole of hexamethylenediamine and b) 0.1W2 moles of a glycidyl ether, and, if necessary, C) activated alumina, silica alumina, or its mixture.
EFFECT: The curing agent has low toxicity and gives a cured material having improved flexibility.
COPYRIGHT: (C)1979,JPO&Japio
JP5661678A 1978-05-15 1978-05-15 Epoxy resin composition for curing wet surface Pending JPS54148896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5661678A JPS54148896A (en) 1978-05-15 1978-05-15 Epoxy resin composition for curing wet surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5661678A JPS54148896A (en) 1978-05-15 1978-05-15 Epoxy resin composition for curing wet surface

Publications (1)

Publication Number Publication Date
JPS54148896A true JPS54148896A (en) 1979-11-21

Family

ID=13032189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5661678A Pending JPS54148896A (en) 1978-05-15 1978-05-15 Epoxy resin composition for curing wet surface

Country Status (1)

Country Link
JP (1) JPS54148896A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63189425A (en) * 1987-01-31 1988-08-05 Yuka Shell Epoxy Kk Epoxy resin hardener
EP0870790A1 (en) * 1995-08-04 1998-10-14 Asahi Denka Kogyo Kabushiki Kaisha Curable epoxy resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63189425A (en) * 1987-01-31 1988-08-05 Yuka Shell Epoxy Kk Epoxy resin hardener
EP0870790A1 (en) * 1995-08-04 1998-10-14 Asahi Denka Kogyo Kabushiki Kaisha Curable epoxy resin composition
EP0870790A4 (en) * 1995-08-04 1998-11-04

Similar Documents

Publication Publication Date Title
JPS51119090A (en) Curable resin compositions
JPS52112698A (en) Curable resin compositions
JPS54148896A (en) Epoxy resin composition for curing wet surface
JPS51129498A (en) Thermosetting resin composition
JPS54148898A (en) Novel resin composition
JPS536400A (en) Curable epoxy resin compositions
JPS5390334A (en) Powder coating resin composition
JPS5464597A (en) Heat resistant epoxy resin composition
JPS5236197A (en) Curable compositions based on modified epoxy resins
JPS51144453A (en) Preparation of polyamide resin chips
JPS5236196A (en) Process for preparing cured compositions based on modified epoxy resin s
JPS5749646A (en) Epoxy resin composition
JPS54129098A (en) Thermosetting resin composition
JPS5436390A (en) Resin concrete and resin morter composition
JPS56141316A (en) Epoxy resin composition
DE3462407D1 (en) Polymerizable materials and use of arylamines as curing accelerators therefor
JPS5538836A (en) Epoxy resin curing agent
JPS5258800A (en) Epoxy resin composition
JPS52129000A (en) Primer compositions for room-temperature curing polyurethane resin
JPS51116892A (en) Curable resin compositions having good pefurmances
JPS5228599A (en) Resin compositions
JPS5273959A (en) Polyamide compositions
JPS52124042A (en) Curable resin compositions
JPS5312941A (en) Curable resin composition
JPS5266600A (en) Epoxy resin compositions