JPS5273959A - Polyamide compositions - Google Patents
Polyamide compositionsInfo
- Publication number
- JPS5273959A JPS5273959A JP50149459A JP14945975A JPS5273959A JP S5273959 A JPS5273959 A JP S5273959A JP 50149459 A JP50149459 A JP 50149459A JP 14945975 A JP14945975 A JP 14945975A JP S5273959 A JPS5273959 A JP S5273959A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide compositions
- oil
- containing clay
- polyamide
- polyalkylenepolyamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004952 Polyamide Substances 0.000 title abstract 2
- 229920002647 polyamide Polymers 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title 1
- 239000004927 clay Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
Landscapes
- Processing Of Solid Wastes (AREA)
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To effectively reuse an oil-containing clay which has been discarded by forming a polyamide useful as a curing agent for epoxy resins by reacting the oil-containing clay with a polyalkylenepolyamine under heating.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50149459A JPS5273959A (en) | 1975-12-17 | 1975-12-17 | Polyamide compositions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50149459A JPS5273959A (en) | 1975-12-17 | 1975-12-17 | Polyamide compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5273959A true JPS5273959A (en) | 1977-06-21 |
JPS5523576B2 JPS5523576B2 (en) | 1980-06-24 |
Family
ID=15475573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50149459A Granted JPS5273959A (en) | 1975-12-17 | 1975-12-17 | Polyamide compositions |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5273959A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10157937A1 (en) * | 2001-08-09 | 2003-02-27 | Ind Tech Res Inst | Epoxy / clay nanocomposite for the production of printed circuits |
-
1975
- 1975-12-17 JP JP50149459A patent/JPS5273959A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10157937A1 (en) * | 2001-08-09 | 2003-02-27 | Ind Tech Res Inst | Epoxy / clay nanocomposite for the production of printed circuits |
DE10157937C2 (en) * | 2001-08-09 | 2003-12-24 | Ind Tech Res Inst | Epoxy resin / clay nanocomposite and its use for the production of printed circuits |
Also Published As
Publication number | Publication date |
---|---|
JPS5523576B2 (en) | 1980-06-24 |
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