JPS57190018A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57190018A
JPS57190018A JP7618781A JP7618781A JPS57190018A JP S57190018 A JPS57190018 A JP S57190018A JP 7618781 A JP7618781 A JP 7618781A JP 7618781 A JP7618781 A JP 7618781A JP S57190018 A JPS57190018 A JP S57190018A
Authority
JP
Japan
Prior art keywords
component
epoxy resin
resin composition
imidazole
derivative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7618781A
Other languages
Japanese (ja)
Other versions
JPS6136850B2 (en
Inventor
Takeshi Nakahara
Hiroshi Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7618781A priority Critical patent/JPS57190018A/en
Publication of JPS57190018A publication Critical patent/JPS57190018A/en
Publication of JPS6136850B2 publication Critical patent/JPS6136850B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare an epoxy resin composition having long pot-life and excellent stability and curability in a moistened state, and useful as an electrical insulating material, by using the 2-ethylhexanoic acid salt of imidazole and its derivative as a cure accelerator.
CONSTITUTION: The objective composition can be prepared by compounding (A) an epoxy resin having two or more epoxy groups in one molecule (e.g. bisphenol A diglycidyl ether) with (B) a polycarboxylic acid anhydride (e.g. phthalic anhydride) and (C) 2-ethylhexanoic acid salt of imidazole or its derivative (e.g. 2- methylimidazole). The ratio of the acid anhydride in the component (B) (mol) to the epoxy group in the component (A) (equivalent) is preferably 0.85W0.95, and the amount of the component (C) is preferably 0.05W3pts.wt. per 100pts. of the component (A).
COPYRIGHT: (C)1982,JPO&Japio
JP7618781A 1981-05-19 1981-05-19 Epoxy resin composition Granted JPS57190018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7618781A JPS57190018A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7618781A JPS57190018A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57190018A true JPS57190018A (en) 1982-11-22
JPS6136850B2 JPS6136850B2 (en) 1986-08-20

Family

ID=13598116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7618781A Granted JPS57190018A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57190018A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308970B2 (en) 2003-07-11 2012-11-13 Ube Industries, Ltd. Acid-base mixture and ion conductor comprising the same
JP2019524967A (en) * 2016-08-15 2019-09-05 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Acid anhydride epoxy curing agent containing imidazole salt additive for epoxy resin system
JP2020501000A (en) * 2016-12-12 2020-01-16 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ A novel low temperature acid anhydride epoxy curing system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308970B2 (en) 2003-07-11 2012-11-13 Ube Industries, Ltd. Acid-base mixture and ion conductor comprising the same
JP2019524967A (en) * 2016-08-15 2019-09-05 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Acid anhydride epoxy curing agent containing imidazole salt additive for epoxy resin system
JP2020501000A (en) * 2016-12-12 2020-01-16 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ A novel low temperature acid anhydride epoxy curing system
US11286336B2 (en) 2016-12-12 2022-03-29 Evonik Operations Gmbh Low temperature anhydride epoxy cured systems

Also Published As

Publication number Publication date
JPS6136850B2 (en) 1986-08-20

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