JPS5718752A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5718752A JPS5718752A JP9178380A JP9178380A JPS5718752A JP S5718752 A JPS5718752 A JP S5718752A JP 9178380 A JP9178380 A JP 9178380A JP 9178380 A JP9178380 A JP 9178380A JP S5718752 A JPS5718752 A JP S5718752A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- component
- vinylphenol polymer
- resin composition
- 5w40pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To prepare a resin composition giving a cured product having low elastic modulus and expansion coefficient and high glass transition point, by compounding a polyfunctional epoxy compound, a diglycidyl ester of a dimer acid, and a (halogenated) p-vinylphenol polymer.
CONSTITUTION: The objective composition is prepared by compunding (A) a pilyfuctional epoxy compound, (B) a diglycidyl ester of a dimer acid, and (C) p-vinylphenol polymer and /or halogenated p-vinylphenol polymer, and then adding (D) 40W75vol%, based on (A)+(B)+(C)+(D), of an inorganic filler. The component (A) which is a mixture of 20W90pts.wt. of an epoxy-novolak resin and 5W40pts. wt. of a bisphenol-A epoxy resin, is mixed with 5W40pts.wt. of the component (B) provided that the amount of the component (A) is larger than that of (B). The molar ratio of the epoxy group in the epoxy component to the OH group is pref. stoichiometrically 1 to 1.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9178380A JPS5718752A (en) | 1980-07-07 | 1980-07-07 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9178380A JPS5718752A (en) | 1980-07-07 | 1980-07-07 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5718752A true JPS5718752A (en) | 1982-01-30 |
JPS6136844B2 JPS6136844B2 (en) | 1986-08-20 |
Family
ID=14036186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9178380A Granted JPS5718752A (en) | 1980-07-07 | 1980-07-07 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5718752A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62288625A (en) * | 1986-06-05 | 1987-12-15 | Somar Corp | Epoxy resin composition |
US20100190916A1 (en) * | 2007-01-05 | 2010-07-29 | Nihon Tokushu Toryo Co., Ltd. | Coatings composition having vibration-damping of two-components type and coating type which can be cured at normal temperature |
-
1980
- 1980-07-07 JP JP9178380A patent/JPS5718752A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62288625A (en) * | 1986-06-05 | 1987-12-15 | Somar Corp | Epoxy resin composition |
JPH0556770B2 (en) * | 1986-06-05 | 1993-08-20 | Somar Corp | |
US20100190916A1 (en) * | 2007-01-05 | 2010-07-29 | Nihon Tokushu Toryo Co., Ltd. | Coatings composition having vibration-damping of two-components type and coating type which can be cured at normal temperature |
KR101423804B1 (en) * | 2007-01-05 | 2014-07-25 | 도요타 지도샤(주) | A coatings composition having vibration-damping of two-components type and coating type which can be cured at normal temperature |
Also Published As
Publication number | Publication date |
---|---|
JPS6136844B2 (en) | 1986-08-20 |
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