JPS57133122A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS57133122A
JPS57133122A JP1801181A JP1801181A JPS57133122A JP S57133122 A JPS57133122 A JP S57133122A JP 1801181 A JP1801181 A JP 1801181A JP 1801181 A JP1801181 A JP 1801181A JP S57133122 A JPS57133122 A JP S57133122A
Authority
JP
Japan
Prior art keywords
epoxy resin
compounding
curable resin
resin composition
acid anhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1801181A
Other languages
Japanese (ja)
Inventor
Shuji Hayase
Shiyuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1801181A priority Critical patent/JPS57133122A/en
Publication of JPS57133122A publication Critical patent/JPS57133122A/en
Pending legal-status Critical Current

Links

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare a curable resin composition having excellent workability and useful as an electrical insulating material, by compounding an acid anhydride, an epoxy resin, a curing catalyst comprising a specific aluminum complex, and a cure accelerator comprising a specific organic silicon compound.
CONSTITUTION: The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (e.g. bisphenol A-type epoxy resin) with (B) 10W 90pts. of an acid anhydride (e.g. phthalic anhydride), (C) 0.0001W5pts. of an aluminum complex having at least one β-keto ester as a ligand (e.g. trisethylacetoacetato-aluminum) and (D) 0.0001W5pts. of an organic silicon compound having at least one hydrolyzable group bonded directly to silicon atom[e.g. triphenyl(methoxy)-silane].
EFFECT: It has excellent electrical properties and crack resistance, and high storage stability.
COPYRIGHT: (C)1982,JPO&Japio
JP1801181A 1981-02-12 1981-02-12 Curable resin composition Pending JPS57133122A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1801181A JPS57133122A (en) 1981-02-12 1981-02-12 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1801181A JPS57133122A (en) 1981-02-12 1981-02-12 Curable resin composition

Publications (1)

Publication Number Publication Date
JPS57133122A true JPS57133122A (en) 1982-08-17

Family

ID=11959728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1801181A Pending JPS57133122A (en) 1981-02-12 1981-02-12 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS57133122A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012224869A (en) * 2005-07-11 2012-11-15 Sony Chemical & Information Device Corp Thermosetting epoxy resin composition
CN103773300A (en) * 2013-12-23 2014-05-07 东莞市亚聚电子材料有限公司 Repairable underfill and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733291A (en) * 1980-08-01 1982-02-23 Hitachi Construction Machinery Damper for oil pressure pulsation
JPS5790012A (en) * 1980-11-25 1982-06-04 Toshiba Corp Heat-resistant resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733291A (en) * 1980-08-01 1982-02-23 Hitachi Construction Machinery Damper for oil pressure pulsation
JPS5790012A (en) * 1980-11-25 1982-06-04 Toshiba Corp Heat-resistant resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012224869A (en) * 2005-07-11 2012-11-15 Sony Chemical & Information Device Corp Thermosetting epoxy resin composition
JP5360348B2 (en) * 2005-07-11 2013-12-04 デクセリアルズ株式会社 Thermosetting epoxy resin composition
CN103773300A (en) * 2013-12-23 2014-05-07 东莞市亚聚电子材料有限公司 Repairable underfill and preparation method thereof
CN103773300B (en) * 2013-12-23 2015-07-01 东莞市亚聚电子材料有限公司 Repairable underfill and preparation method thereof

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