JPS57119947A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57119947A
JPS57119947A JP517381A JP517381A JPS57119947A JP S57119947 A JPS57119947 A JP S57119947A JP 517381 A JP517381 A JP 517381A JP 517381 A JP517381 A JP 517381A JP S57119947 A JPS57119947 A JP S57119947A
Authority
JP
Japan
Prior art keywords
compd
epoxy resin
phosphine
epoxy
org
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP517381A
Other languages
Japanese (ja)
Other versions
JPH0150249B2 (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP517381A priority Critical patent/JPS57119947A/en
Publication of JPS57119947A publication Critical patent/JPS57119947A/en
Publication of JPH0150249B2 publication Critical patent/JPH0150249B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: The title composition with excellent high-temp. electrical characteristics, moisture resistance and potential curability useful as an electrical insulating material, which is prepd. by compounding an epoxy resin with a curing agent having a phenolic hydroxy group, an org. phosphine compd. and a metal chelate compd.
CONSTITUTION: 100pts.wt. resin consisting of an epoxy resin such as a novolak type one of epoxy eq. 170W300 and a curing agent having at least two phenolic hydroxy groups in one molecule in a ratio of hydroxy group/epoxy group of 0.5W1.5, is compounded with 0.01W20pts.wt. org. phosphine compd. such as triphenyl phosphine, a metal chelate compd. such as tris(acetylacetonato)alumi- num and if necessary, 150W400pts.wt. inorg. filler such as quartz glass or crystalline silica to obtain the title composition.
COPYRIGHT: (C)1982,JPO&Japio
JP517381A 1981-01-19 1981-01-19 Epoxy resin composition Granted JPS57119947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP517381A JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP517381A JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57119947A true JPS57119947A (en) 1982-07-26
JPH0150249B2 JPH0150249B2 (en) 1989-10-27

Family

ID=11603841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP517381A Granted JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57119947A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPS6086790A (en) * 1983-10-18 1985-05-16 松下電器産業株式会社 Flexible heating wire
JPS63130621A (en) * 1986-11-21 1988-06-02 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JP2014129475A (en) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk Thermal cationic polymerizable composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPH0136984B2 (en) * 1983-06-07 1989-08-03 Sharp Kk
JPS6086790A (en) * 1983-10-18 1985-05-16 松下電器産業株式会社 Flexible heating wire
JPH0479479B2 (en) * 1983-10-18 1992-12-16 Matsushita Electric Ind Co Ltd
JPS63130621A (en) * 1986-11-21 1988-06-02 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JP2014129475A (en) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk Thermal cationic polymerizable composition

Also Published As

Publication number Publication date
JPH0150249B2 (en) 1989-10-27

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