JPS57119947A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57119947A JPS57119947A JP517381A JP517381A JPS57119947A JP S57119947 A JPS57119947 A JP S57119947A JP 517381 A JP517381 A JP 517381A JP 517381 A JP517381 A JP 517381A JP S57119947 A JPS57119947 A JP S57119947A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- epoxy resin
- phosphine
- epoxy
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The title composition with excellent high-temp. electrical characteristics, moisture resistance and potential curability useful as an electrical insulating material, which is prepd. by compounding an epoxy resin with a curing agent having a phenolic hydroxy group, an org. phosphine compd. and a metal chelate compd.
CONSTITUTION: 100pts.wt. resin consisting of an epoxy resin such as a novolak type one of epoxy eq. 170W300 and a curing agent having at least two phenolic hydroxy groups in one molecule in a ratio of hydroxy group/epoxy group of 0.5W1.5, is compounded with 0.01W20pts.wt. org. phosphine compd. such as triphenyl phosphine, a metal chelate compd. such as tris(acetylacetonato)alumi- num and if necessary, 150W400pts.wt. inorg. filler such as quartz glass or crystalline silica to obtain the title composition.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517381A JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517381A JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57119947A true JPS57119947A (en) | 1982-07-26 |
JPH0150249B2 JPH0150249B2 (en) | 1989-10-27 |
Family
ID=11603841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP517381A Granted JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57119947A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59227146A (en) * | 1983-06-07 | 1984-12-20 | Sharp Corp | Resin-molded semiconductor device |
JPS6086790A (en) * | 1983-10-18 | 1985-05-16 | 松下電器産業株式会社 | Flexible heating wire |
JPS63130621A (en) * | 1986-11-21 | 1988-06-02 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
JP2014129475A (en) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | Thermal cationic polymerizable composition |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56130953A (en) * | 1980-03-17 | 1981-10-14 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor device |
-
1981
- 1981-01-19 JP JP517381A patent/JPS57119947A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56130953A (en) * | 1980-03-17 | 1981-10-14 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59227146A (en) * | 1983-06-07 | 1984-12-20 | Sharp Corp | Resin-molded semiconductor device |
JPH0136984B2 (en) * | 1983-06-07 | 1989-08-03 | Sharp Kk | |
JPS6086790A (en) * | 1983-10-18 | 1985-05-16 | 松下電器産業株式会社 | Flexible heating wire |
JPH0479479B2 (en) * | 1983-10-18 | 1992-12-16 | Matsushita Electric Ind Co Ltd | |
JPS63130621A (en) * | 1986-11-21 | 1988-06-02 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
JP2014129475A (en) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | Thermal cationic polymerizable composition |
Also Published As
Publication number | Publication date |
---|---|
JPH0150249B2 (en) | 1989-10-27 |
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