JPS57123248A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57123248A
JPS57123248A JP518481A JP518481A JPS57123248A JP S57123248 A JPS57123248 A JP S57123248A JP 518481 A JP518481 A JP 518481A JP 518481 A JP518481 A JP 518481A JP S57123248 A JPS57123248 A JP S57123248A
Authority
JP
Japan
Prior art keywords
compd
epoxy resin
organophosphine
contg
novolak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP518481A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP518481A priority Critical patent/JPS57123248A/en
Publication of JPS57123248A publication Critical patent/JPS57123248A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: An epoxy resin coposition with excellent high-temp. electrical characteristics, moisture resistance and latent curability, prepd. by incorporating a specified curing agent, and organophosphine compd, a metal chelate compd. and an organosilicon compd.
CONSTITUTION: An epoxy resin such as a novolak-type one of epoxy eq. about 170W300 is compounded with an epoxy resin curing agent such as a novolak- type phenol resin of softening temp. about 60W100°C having at least two phenolic hydroxy groups, an organophosphine compd. such as triphenylphosphine, a metal chelate compd. such as tris (acetylacetonato) aluminum, a silanol group-contg. organosilicon compd. such as a silanol group-contg. organosilane, and if necessary, an inorg. filler such as a quartz glass powder.
COPYRIGHT: (C)1982,JPO&Japio
JP518481A 1981-01-19 1981-01-19 Epoxy resin composition Pending JPS57123248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP518481A JPS57123248A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP518481A JPS57123248A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57123248A true JPS57123248A (en) 1982-07-31

Family

ID=11604140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP518481A Pending JPS57123248A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57123248A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254654A (en) * 1985-05-08 1986-11-12 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61268719A (en) * 1985-05-22 1986-11-28 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61285246A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Epoxy resin molding material
JP2014129475A (en) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk Thermal cationic polymerizable composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254654A (en) * 1985-05-08 1986-11-12 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61268719A (en) * 1985-05-22 1986-11-28 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61285246A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Epoxy resin molding material
JP2014129475A (en) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk Thermal cationic polymerizable composition

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