JPS57123248A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57123248A JPS57123248A JP518481A JP518481A JPS57123248A JP S57123248 A JPS57123248 A JP S57123248A JP 518481 A JP518481 A JP 518481A JP 518481 A JP518481 A JP 518481A JP S57123248 A JPS57123248 A JP S57123248A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- epoxy resin
- organophosphine
- contg
- novolak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: An epoxy resin coposition with excellent high-temp. electrical characteristics, moisture resistance and latent curability, prepd. by incorporating a specified curing agent, and organophosphine compd, a metal chelate compd. and an organosilicon compd.
CONSTITUTION: An epoxy resin such as a novolak-type one of epoxy eq. about 170W300 is compounded with an epoxy resin curing agent such as a novolak- type phenol resin of softening temp. about 60W100°C having at least two phenolic hydroxy groups, an organophosphine compd. such as triphenylphosphine, a metal chelate compd. such as tris (acetylacetonato) aluminum, a silanol group-contg. organosilicon compd. such as a silanol group-contg. organosilane, and if necessary, an inorg. filler such as a quartz glass powder.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518481A JPS57123248A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518481A JPS57123248A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57123248A true JPS57123248A (en) | 1982-07-31 |
Family
ID=11604140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP518481A Pending JPS57123248A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57123248A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61254654A (en) * | 1985-05-08 | 1986-11-12 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS61268719A (en) * | 1985-05-22 | 1986-11-28 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS61285246A (en) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JP2014129475A (en) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | Thermal cationic polymerizable composition |
-
1981
- 1981-01-19 JP JP518481A patent/JPS57123248A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61254654A (en) * | 1985-05-08 | 1986-11-12 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS61268719A (en) * | 1985-05-22 | 1986-11-28 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS61285246A (en) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JP2014129475A (en) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | Thermal cationic polymerizable composition |
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