JPS57153454A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS57153454A
JPS57153454A JP56037831A JP3783181A JPS57153454A JP S57153454 A JPS57153454 A JP S57153454A JP 56037831 A JP56037831 A JP 56037831A JP 3783181 A JP3783181 A JP 3783181A JP S57153454 A JPS57153454 A JP S57153454A
Authority
JP
Japan
Prior art keywords
resin
hardener
epoxy
novolac type
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56037831A
Other languages
Japanese (ja)
Other versions
JPS6137789B2 (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56037831A priority Critical patent/JPS57153454A/en
Priority to DE8181104126T priority patent/DE3163054D1/en
Priority to EP19810104126 priority patent/EP0041662B1/en
Publication of JPS57153454A publication Critical patent/JPS57153454A/en
Publication of JPS6137789B2 publication Critical patent/JPS6137789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To seal with high reliability by adding the fixed quantities of an organic phosphine compound, a metallic chelate compound and an organic silicon compound having a silanolic hydroxyl group to the novolac type epoxy resin of 170-300 epoxy equivalent and a novolac type phenol resin hardener. CONSTITUTION:The phenol novolac resin as the hardener is compounded to the resin such as the phenol novolac type epoxy resin of 170-300 epoxy equivalent at 0.5-1.5 in the number of the phenolic hydroxyl groups/the number of the epoxy groups of the epoxy resin. Triphenyl phosphine is added by the 0.01- 20wt% of resin+the hardener to promote curing, the metallic chelate compound, the central metal thereof is Al, etc. and ligands thereof are acetyl acetone, etc., is added by a 1-100pts.wt./100pts.wt. accelerating agent, and (CH3)3SiOH, etc. are further added by a 0.05-10wt.pt. to a resin component. Accordingly to such composition, the resin sealing device having excellent wetproof property and also excellent electrical characteristics at a high temperature is obtained in superior formability and working property.
JP56037831A 1980-06-05 1981-03-18 Resin molded type semiconductor device Granted JPS57153454A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56037831A JPS57153454A (en) 1981-03-18 1981-03-18 Resin molded type semiconductor device
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
EP19810104126 EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56037831A JPS57153454A (en) 1981-03-18 1981-03-18 Resin molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57153454A true JPS57153454A (en) 1982-09-22
JPS6137789B2 JPS6137789B2 (en) 1986-08-26

Family

ID=12508467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56037831A Granted JPS57153454A (en) 1980-06-05 1981-03-18 Resin molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57153454A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JP2001288338A (en) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2003003044A (en) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd Semiconductor-sealing resin composition and semiconductor device
JP2016183309A (en) * 2015-03-27 2016-10-20 アイカＳｄｋフェノール株式会社 Epoxy resin and thermosetting resin composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
JP2001288338A (en) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2003003044A (en) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd Semiconductor-sealing resin composition and semiconductor device
JP2016183309A (en) * 2015-03-27 2016-10-20 アイカＳｄｋフェノール株式会社 Epoxy resin and thermosetting resin composition

Also Published As

Publication number Publication date
JPS6137789B2 (en) 1986-08-26

Similar Documents

Publication Publication Date Title
US4328150A (en) Curable epoxy resin compositions
US4376174A (en) Curable epoxy resin compositions
KR870002198A (en) Epoxy Resin Compositions for Sealing Semiconductor Devices
JP2000103939A5 (en)
JPS57153454A (en) Resin molded type semiconductor device
JPS57184242A (en) Molding material for sealing electronic part
KR910014459A (en) Epoxy Resin Compositions and Semiconductor Devices
KR950001316B1 (en) Epoxy resin composition for encapsulating semiconductor
JPH1192550A (en) Liquid epoxy resin composition
JP2691411B2 (en) Epoxy resin composition
EP0589143B1 (en) Epoxy resin composition based on diglycidylether of biphenyldiol
EP0294148A3 (en) Epoxy resin composition
JPS5723625A (en) Epoxy resin composition and resin-sealed semiconductor device
KR880011912A (en) Resin-sealed semiconductor device
JPS5681333A (en) Epoxy resin composition
JPH053269A (en) Resin composite
JPS57119947A (en) Epoxy resin composition
GB1279775A (en) Flexibilized epoxy resins
JPH1192549A (en) Liquid epoxy resin composition
KR880014670A (en) Manufacturing method of low stress modifier and epoxy resin composition for semiconductor encapsulation containing this infectious agent
Matsumoto et al. Phenol novolac/poly (4‐hydroxyphenylmaleimide) blend hardeners for DGEBA‐type epoxy resin
KR930007996A (en) Polyhydric phenols and epoxy resins and epoxy resin compositions derived therefrom
JPH02189330A (en) Epoxy resin molding material for semiconductor sealing
JPS57184241A (en) Resin sealing type semiconductor device
KR890004008B1 (en) Epoxy resin composition for encapsulating semiconductor