JPS5967660A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS5967660A
JPS5967660A JP57177613A JP17761382A JPS5967660A JP S5967660 A JPS5967660 A JP S5967660A JP 57177613 A JP57177613 A JP 57177613A JP 17761382 A JP17761382 A JP 17761382A JP S5967660 A JPS5967660 A JP S5967660A
Authority
JP
Japan
Prior art keywords
resin
type semiconductor
epoxy resin
sealed type
resin sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57177613A
Other languages
Japanese (ja)
Other versions
JPH0379370B2 (en
Inventor
Michiya Azuma
Hirotoshi Iketani
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57177613A priority Critical patent/JPH0379370B2/ja
Publication of JPS5967660A publication Critical patent/JPS5967660A/en
Publication of JPH0379370B2 publication Critical patent/JPH0379370B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To contrive to improve the moisture resistance and high temperature electrical characteristics by using epoxy resin, phenol aralkyl resin, and a sealer containing organic phosphine compound as the main material. CONSTITUTION:As the resin sealer for a semiconductor device, the epoxy resin, the phenol aralkyl resin, and the material containing organic phosphine compound are used. The epoxy resin is usually known and not particularly restricted. The phenol aralkyl resin is used as a hardener for the epoxy resin. The organic phosphine compound is used as a hardening promotor, and the moisture resistance or high temperature electrical characteristics can be improved by using it.
JP57177613A 1982-10-12 1982-10-12 Expired - Lifetime JPH0379370B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57177613A JPH0379370B2 (en) 1982-10-12 1982-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177613A JPH0379370B2 (en) 1982-10-12 1982-10-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7180550A Division JP2654376B2 (en) 1995-06-26 1995-06-26 Epoxy resin composition for encapsulation and resin-encapsulated semiconductor device using the same

Publications (2)

Publication Number Publication Date
JPS5967660A true JPS5967660A (en) 1984-04-17
JPH0379370B2 JPH0379370B2 (en) 1991-12-18

Family

ID=16034063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177613A Expired - Lifetime JPH0379370B2 (en) 1982-10-12 1982-10-12

Country Status (1)

Country Link
JP (1) JPH0379370B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105019A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPS59105018A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPH01168781A (en) * 1987-12-25 1989-07-04 Nok Corp Vulcanizing adhesive composition
JPH04300914A (en) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
US7637336B2 (en) 2005-03-22 2009-12-29 Aisin Aw Co., Ltd. Hydraulic circuit device and hybrid drive system using that hydraulic circuit device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123800A (en) * 1974-03-08 1975-09-29
JPS51132267A (en) * 1975-04-18 1976-11-17 Hitachi Chem Co Ltd An epoxy resin composition for sealing semi-conductor elements
JPS52132100A (en) * 1976-04-28 1977-11-05 Hitachi Chem Co Ltd Epoxy resin molding materials for sealing semiconductors
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Chem Co Ltd Preparation of curing agent for epoxy resin
JPS54110297A (en) * 1978-02-17 1979-08-29 Hitachi Chem Co Ltd Epoxy resin composition for encapsulating semiconductor device
JPS5645491A (en) * 1979-08-08 1981-04-25 M & T Chemicals Inc Novel organosilicon compound and manufacture thereof
JPS5659841A (en) * 1979-10-19 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5684717A (en) * 1979-12-14 1981-07-10 Hitachi Chem Co Ltd Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS57153022A (en) * 1981-03-18 1982-09-21 Toshiba Corp Resin-sealed semiconductor device
JPS57153454A (en) * 1981-03-18 1982-09-22 Toshiba Corp Resin molded type semiconductor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123800A (en) * 1974-03-08 1975-09-29
JPS51132267A (en) * 1975-04-18 1976-11-17 Hitachi Chem Co Ltd An epoxy resin composition for sealing semi-conductor elements
JPS52132100A (en) * 1976-04-28 1977-11-05 Hitachi Chem Co Ltd Epoxy resin molding materials for sealing semiconductors
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Chem Co Ltd Preparation of curing agent for epoxy resin
JPS54110297A (en) * 1978-02-17 1979-08-29 Hitachi Chem Co Ltd Epoxy resin composition for encapsulating semiconductor device
JPS5645491A (en) * 1979-08-08 1981-04-25 M & T Chemicals Inc Novel organosilicon compound and manufacture thereof
JPS5659841A (en) * 1979-10-19 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5684717A (en) * 1979-12-14 1981-07-10 Hitachi Chem Co Ltd Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS57153022A (en) * 1981-03-18 1982-09-21 Toshiba Corp Resin-sealed semiconductor device
JPS57153454A (en) * 1981-03-18 1982-09-22 Toshiba Corp Resin molded type semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105019A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPS59105018A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPH0249329B2 (en) * 1982-12-07 1990-10-29 Toshiba Chem Prod
JPH01168781A (en) * 1987-12-25 1989-07-04 Nok Corp Vulcanizing adhesive composition
JPH04300914A (en) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
US7637336B2 (en) 2005-03-22 2009-12-29 Aisin Aw Co., Ltd. Hydraulic circuit device and hybrid drive system using that hydraulic circuit device

Also Published As

Publication number Publication date
JPH0379370B2 (en) 1991-12-18

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