JPS5684717A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS5684717A
JPS5684717A JP16145179A JP16145179A JPS5684717A JP S5684717 A JPS5684717 A JP S5684717A JP 16145179 A JP16145179 A JP 16145179A JP 16145179 A JP16145179 A JP 16145179A JP S5684717 A JPS5684717 A JP S5684717A
Authority
JP
Japan
Prior art keywords
epoxy resin
wax
molding material
esterified
esterified wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16145179A
Other languages
Japanese (ja)
Other versions
JPS6136771B2 (en
Inventor
Goro Tanaka
Yasuhide Sugawara
Masahiro Kitamura
Hiroshi Suzuki
Hideo Inayoshi
Isao Araki
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16145179A priority Critical patent/JPS5684717A/en
Publication of JPS5684717A publication Critical patent/JPS5684717A/en
Publication of JPS6136771B2 publication Critical patent/JPS6136771B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To improve mold release, etc., by adding tetraphenylphosphonium tetraphenylborate and an esterified wax to titled molding material which uses a phenol resin as a curing agent and which is useful for molding semiconductors.
CONSTITUTION: To 100pts.wt. of an epoxy resin such as a bisphenol A type epoxy resin or a novolak type epoxy resin are added a phenol resin as a curing agent, about 0.5W5pts.wt. of tetraphenyl-phosphonium tetraphenylborate as a cure accelerator and 0.3W1pt.wt. of an esterified wax as a mold releasing agent. In this way, titled molding material showing good mold release at a low addition level on account of the synergistic action between the tetraphenylphosphonium tetraphenylborate and the esterified wax, and being almost freed from fouling of metal molds is obtained. The esterified wax is a wax consisting of long-chain (about C15WC40) hydrocarbon segments linked through ester bonds.
COPYRIGHT: (C)1981,JPO&Japio
JP16145179A 1979-12-14 1979-12-14 Epoxy resin molding material Granted JPS5684717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16145179A JPS5684717A (en) 1979-12-14 1979-12-14 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16145179A JPS5684717A (en) 1979-12-14 1979-12-14 Epoxy resin molding material

Publications (2)

Publication Number Publication Date
JPS5684717A true JPS5684717A (en) 1981-07-10
JPS6136771B2 JPS6136771B2 (en) 1986-08-20

Family

ID=15735347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16145179A Granted JPS5684717A (en) 1979-12-14 1979-12-14 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS5684717A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6360775U (en) * 1986-10-09 1988-04-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co

Also Published As

Publication number Publication date
JPS6136771B2 (en) 1986-08-20

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