JPS5458795A - Preparation of curing agent for epoxy resin - Google Patents
Preparation of curing agent for epoxy resinInfo
- Publication number
- JPS5458795A JPS5458795A JP12445477A JP12445477A JPS5458795A JP S5458795 A JPS5458795 A JP S5458795A JP 12445477 A JP12445477 A JP 12445477A JP 12445477 A JP12445477 A JP 12445477A JP S5458795 A JPS5458795 A JP S5458795A
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- novolak
- affording
- heating
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare the title curing agent stable at room temperatuer, with good curing potentioal, also copable of affording cured products of high monisture resistance, by heat treatment of a mixture of a novolak phenolic resin and a tetra pheuyl phosphorium-tetraphenyl borate.
CONSTITUTION: (A) a novolak phenolic resin of an average molecular weight of 300-1500 and (B) a tetraphenyl phosphonium-tetraphenyl borate are mixed in such a weight ratio (A): (B) of 1: 0.02-1 and then treated by heating to at least the softening point of said novolak pherolic resin.
EFFECT: Extremely stable near room temperature, effecting rapid cure on heating, affording a cured product of good moisture resistance
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12445477A JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12445477A JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5458795A true JPS5458795A (en) | 1979-05-11 |
JPS5645491B2 JPS5645491B2 (en) | 1981-10-27 |
Family
ID=14885911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12445477A Granted JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5458795A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387329A (en) * | 1977-01-10 | 1978-08-01 | Sumitomo Chem Co Ltd | Preparation of hydroperoxide |
JPS56112924A (en) * | 1980-02-13 | 1981-09-05 | Matsushita Electric Works Ltd | Epoxy resin composition |
JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
JP2001348488A (en) * | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part |
US6664344B1 (en) * | 1999-07-22 | 2003-12-16 | Sumitomo Bakelite Company Limited | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100586763B1 (en) | 1998-07-02 | 2006-06-08 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Phosphoniumborate Compounds, Methods of Producing the Same, Curing Catalysts for Epoxy Resin Composotions and Epoxy Resin Composotions |
JP4452071B2 (en) | 2003-12-04 | 2010-04-21 | 日東電工株式会社 | Method for producing epoxy resin composition for semiconductor encapsulation |
-
1977
- 1977-10-19 JP JP12445477A patent/JPS5458795A/en active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387329A (en) * | 1977-01-10 | 1978-08-01 | Sumitomo Chem Co Ltd | Preparation of hydroperoxide |
JPS56112924A (en) * | 1980-02-13 | 1981-09-05 | Matsushita Electric Works Ltd | Epoxy resin composition |
JPS6150970B2 (en) * | 1980-02-13 | 1986-11-06 | Matsushita Electric Works Ltd | |
JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
JPS616786B2 (en) * | 1980-12-27 | 1986-02-28 | Toshiba Chem Prod | |
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
JPH0379370B2 (en) * | 1982-10-12 | 1991-12-18 | Tokyo Shibaura Electric Co | |
US6664344B1 (en) * | 1999-07-22 | 2003-12-16 | Sumitomo Bakelite Company Limited | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
JP2001348488A (en) * | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part |
Also Published As
Publication number | Publication date |
---|---|
JPS5645491B2 (en) | 1981-10-27 |
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