JPS5458795A - Preparation of curing agent for epoxy resin - Google Patents

Preparation of curing agent for epoxy resin

Info

Publication number
JPS5458795A
JPS5458795A JP12445477A JP12445477A JPS5458795A JP S5458795 A JPS5458795 A JP S5458795A JP 12445477 A JP12445477 A JP 12445477A JP 12445477 A JP12445477 A JP 12445477A JP S5458795 A JPS5458795 A JP S5458795A
Authority
JP
Japan
Prior art keywords
curing agent
novolak
affording
heating
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12445477A
Other languages
Japanese (ja)
Other versions
JPS5645491B2 (en
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12445477A priority Critical patent/JPS5458795A/en
Publication of JPS5458795A publication Critical patent/JPS5458795A/en
Publication of JPS5645491B2 publication Critical patent/JPS5645491B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the title curing agent stable at room temperatuer, with good curing potentioal, also copable of affording cured products of high monisture resistance, by heat treatment of a mixture of a novolak phenolic resin and a tetra pheuyl phosphorium-tetraphenyl borate.
CONSTITUTION: (A) a novolak phenolic resin of an average molecular weight of 300-1500 and (B) a tetraphenyl phosphonium-tetraphenyl borate are mixed in such a weight ratio (A): (B) of 1: 0.02-1 and then treated by heating to at least the softening point of said novolak pherolic resin.
EFFECT: Extremely stable near room temperature, effecting rapid cure on heating, affording a cured product of good moisture resistance
COPYRIGHT: (C)1979,JPO&Japio
JP12445477A 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin Granted JPS5458795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12445477A JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12445477A JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Publications (2)

Publication Number Publication Date
JPS5458795A true JPS5458795A (en) 1979-05-11
JPS5645491B2 JPS5645491B2 (en) 1981-10-27

Family

ID=14885911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12445477A Granted JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Country Status (1)

Country Link
JP (1) JPS5458795A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JP2001348488A (en) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part
US6664344B1 (en) * 1999-07-22 2003-12-16 Sumitomo Bakelite Company Limited Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586763B1 (en) 1998-07-02 2006-06-08 신에쓰 가가꾸 고교 가부시끼가이샤 Phosphoniumborate Compounds, Methods of Producing the Same, Curing Catalysts for Epoxy Resin Composotions and Epoxy Resin Composotions
JP4452071B2 (en) 2003-12-04 2010-04-21 日東電工株式会社 Method for producing epoxy resin composition for semiconductor encapsulation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS6150970B2 (en) * 1980-02-13 1986-11-06 Matsushita Electric Works Ltd
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS616786B2 (en) * 1980-12-27 1986-02-28 Toshiba Chem Prod
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
US6664344B1 (en) * 1999-07-22 2003-12-16 Sumitomo Bakelite Company Limited Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
JP2001348488A (en) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part

Also Published As

Publication number Publication date
JPS5645491B2 (en) 1981-10-27

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