JPS5277151A - Process for surface treating of fillers for molding materials - Google Patents

Process for surface treating of fillers for molding materials

Info

Publication number
JPS5277151A
JPS5277151A JP15327875A JP15327875A JPS5277151A JP S5277151 A JPS5277151 A JP S5277151A JP 15327875 A JP15327875 A JP 15327875A JP 15327875 A JP15327875 A JP 15327875A JP S5277151 A JPS5277151 A JP S5277151A
Authority
JP
Japan
Prior art keywords
fillers
surface treating
molding materials
dipped
dried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15327875A
Other languages
Japanese (ja)
Inventor
Yoichi Matsuda
Masanori Segawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15327875A priority Critical patent/JPS5277151A/en
Publication of JPS5277151A publication Critical patent/JPS5277151A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A process for surface treating of fillers for the improvement in humidity resistance of resinous molded products which contain fillers, wherein inorganic filler are dipped in a diluted solution of a silane coupling agent, air-dried, and then treated with heat a at a specific temperature.
COPYRIGHT: (C)1977,JPO&Japio
JP15327875A 1975-12-24 1975-12-24 Process for surface treating of fillers for molding materials Pending JPS5277151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15327875A JPS5277151A (en) 1975-12-24 1975-12-24 Process for surface treating of fillers for molding materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15327875A JPS5277151A (en) 1975-12-24 1975-12-24 Process for surface treating of fillers for molding materials

Publications (1)

Publication Number Publication Date
JPS5277151A true JPS5277151A (en) 1977-06-29

Family

ID=15558962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15327875A Pending JPS5277151A (en) 1975-12-24 1975-12-24 Process for surface treating of fillers for molding materials

Country Status (1)

Country Link
JP (1) JPS5277151A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481360A (en) * 1977-12-12 1979-06-28 Toshiba Corp Insulating resin composition
JPS58136636A (en) * 1982-02-06 1983-08-13 Daihachi Kagaku Kogyosho:Kk Synthetic resin composition
JPS58157835A (en) * 1982-03-12 1983-09-20 Nippon Fueroo Kk Molded article of transparent thermosetting resin
FR2829495A1 (en) * 2001-09-12 2003-03-14 Bosch Gmbh Robert Casting composition comprising an epoxy resin and an initiator, useful for encapsulating electronic and electrical devices, includes a silanized quartz filler

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481360A (en) * 1977-12-12 1979-06-28 Toshiba Corp Insulating resin composition
JPS58136636A (en) * 1982-02-06 1983-08-13 Daihachi Kagaku Kogyosho:Kk Synthetic resin composition
JPS58157835A (en) * 1982-03-12 1983-09-20 Nippon Fueroo Kk Molded article of transparent thermosetting resin
FR2829495A1 (en) * 2001-09-12 2003-03-14 Bosch Gmbh Robert Casting composition comprising an epoxy resin and an initiator, useful for encapsulating electronic and electrical devices, includes a silanized quartz filler

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