JPS57184242A - Molding material for sealing electronic part - Google Patents

Molding material for sealing electronic part

Info

Publication number
JPS57184242A
JPS57184242A JP56069651A JP6965181A JPS57184242A JP S57184242 A JPS57184242 A JP S57184242A JP 56069651 A JP56069651 A JP 56069651A JP 6965181 A JP6965181 A JP 6965181A JP S57184242 A JPS57184242 A JP S57184242A
Authority
JP
Japan
Prior art keywords
groups
epoxy resin
property
molding material
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56069651A
Other languages
Japanese (ja)
Other versions
JPH0234181B2 (en
Inventor
Munetomo Torii
Kenichi Tateno
Mami Yokozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56069651A priority Critical patent/JPS57184242A/en
Publication of JPS57184242A publication Critical patent/JPS57184242A/en
Publication of JPH0234181B2 publication Critical patent/JPH0234181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the molding material for sealing having excellent wetproof property by adding a specified organic silicon compound to an epoxy resin molding material, material preserving property thereof is improved. CONSTITUTION:There are bisphenol A type epoxy resin, novolac type epoxy resin, etc. as epoxy resin, an amine group curing agent, fatty polyamine, etc. as a curing agent and glass fiber, metallic whisker, etc. as fillers. A substance obtained by adding the organic silicon compound shown in a constitutional formula to stearic acid, zinc stearate, etc. is used as additives, 0.01-3% is preferable as the quantity, the effect of improvement of wetproof property is small when said quantity is little, and adhesive property with metals lowers when said quantity is much. Rs In the constitutional formula show dydrogen proups, methyl groups or phenyl groups, but it is prefereable that partial Rs are denatured by dydroxyl groups, amine groups or epoxy groups.
JP56069651A 1981-05-08 1981-05-08 Molding material for sealing electronic part Granted JPS57184242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56069651A JPS57184242A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56069651A JPS57184242A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Publications (2)

Publication Number Publication Date
JPS57184242A true JPS57184242A (en) 1982-11-12
JPH0234181B2 JPH0234181B2 (en) 1990-08-01

Family

ID=13408952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56069651A Granted JPS57184242A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Country Status (1)

Country Link
JP (1) JPS57184242A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129252A (en) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd Epoxy resin molding material
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS61127723A (en) * 1984-11-27 1986-06-16 Sumitomo Bakelite Co Ltd Molded article of luminescent or receiving element
JPS61183314A (en) * 1985-02-12 1986-08-16 Sumitomo Bakelite Co Ltd Epoxy resin composition
US4719255A (en) * 1984-08-23 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition for encapsulation of semi-conductor device
JPS63249315A (en) * 1987-04-03 1988-10-17 松下電器産業株式会社 Metallized film capacitor
JPS6465120A (en) * 1987-09-07 1989-03-10 Sumitomo Bakelite Co Liquid epoxy resin composition
JPH0291965A (en) * 1988-09-29 1990-03-30 Nitto Denko Corp Semiconductor device
JPH02269159A (en) * 1987-09-24 1990-11-02 Basf Corp Thermosetting resin system containing modifier comprising siloxane having terminal secondary amine group
JPH02305455A (en) * 1989-05-19 1990-12-19 Nitto Denko Corp Semiconductor device
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
JPH05175259A (en) * 1991-12-25 1993-07-13 Sumitomo Bakelite Co Ltd Tablet manufacturing method of semiconductor sealing epoxy resin composition
JP2002322343A (en) * 2001-04-24 2002-11-08 Hitachi Chem Co Ltd Thermosetting resin composition and method for producing the same
JP2005239911A (en) * 2004-02-27 2005-09-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2011144386A (en) * 2011-03-18 2011-07-28 Hitachi Chem Co Ltd Thermosetting resin composition and method for producing the same
JP2012031431A (en) * 2011-11-04 2012-02-16 Hitachi Chem Co Ltd Thermosetting resin composition and method of producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710621A (en) * 1980-06-24 1982-01-20 Toshiba Corp Catalyst for polymerizing epoxy compound

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710621A (en) * 1980-06-24 1982-01-20 Toshiba Corp Catalyst for polymerizing epoxy compound

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6315295B2 (en) * 1983-01-14 1988-04-04 Matsushita Electric Works Ltd
JPS59129252A (en) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd Epoxy resin molding material
US4719255A (en) * 1984-08-23 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition for encapsulation of semi-conductor device
JPH0564181B2 (en) * 1984-09-11 1993-09-14 Mitsubishi Electric Corp
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS61127723A (en) * 1984-11-27 1986-06-16 Sumitomo Bakelite Co Ltd Molded article of luminescent or receiving element
JPS61183314A (en) * 1985-02-12 1986-08-16 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS63249315A (en) * 1987-04-03 1988-10-17 松下電器産業株式会社 Metallized film capacitor
JPH0782960B2 (en) * 1987-04-03 1995-09-06 松下電器産業株式会社 Metallized film capacitors
JPS6465120A (en) * 1987-09-07 1989-03-10 Sumitomo Bakelite Co Liquid epoxy resin composition
JPH02269159A (en) * 1987-09-24 1990-11-02 Basf Corp Thermosetting resin system containing modifier comprising siloxane having terminal secondary amine group
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
JPH0291965A (en) * 1988-09-29 1990-03-30 Nitto Denko Corp Semiconductor device
JPH02305455A (en) * 1989-05-19 1990-12-19 Nitto Denko Corp Semiconductor device
JPH05175259A (en) * 1991-12-25 1993-07-13 Sumitomo Bakelite Co Ltd Tablet manufacturing method of semiconductor sealing epoxy resin composition
JP2002322343A (en) * 2001-04-24 2002-11-08 Hitachi Chem Co Ltd Thermosetting resin composition and method for producing the same
JP2005239911A (en) * 2004-02-27 2005-09-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2011144386A (en) * 2011-03-18 2011-07-28 Hitachi Chem Co Ltd Thermosetting resin composition and method for producing the same
JP2012031431A (en) * 2011-11-04 2012-02-16 Hitachi Chem Co Ltd Thermosetting resin composition and method of producing the same

Also Published As

Publication number Publication date
JPH0234181B2 (en) 1990-08-01

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