JPS57135859A - Polyphenylene sulfide resin composition for sealing electronic part - Google Patents

Polyphenylene sulfide resin composition for sealing electronic part

Info

Publication number
JPS57135859A
JPS57135859A JP2113881A JP2113881A JPS57135859A JP S57135859 A JPS57135859 A JP S57135859A JP 2113881 A JP2113881 A JP 2113881A JP 2113881 A JP2113881 A JP 2113881A JP S57135859 A JPS57135859 A JP S57135859A
Authority
JP
Japan
Prior art keywords
polyphenylene sulfide
sulfide resin
electronic part
compd
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2113881A
Other languages
Japanese (ja)
Inventor
Osamu Kuriyama
Yoshihiro Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2113881A priority Critical patent/JPS57135859A/en
Publication of JPS57135859A publication Critical patent/JPS57135859A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: The titled composition with large adhesion to the frame of an electronic part, etc., improved moisture resistance and reduced molding cycle time, reusable after scrapped, which comprises a polyphenylene sulfide resin, an organphosphorus compd. and an inorg. filler.
CONSTITUTION: The titled composition prepd. by the addition of 0.01W40pts.wt. organophosphorus compd. such as a compd. of formulaIor II and 50W300pts.wt. inorg. filler such as precipitated silica, Al2O3, CaCO3 or a glass fiber to 100pts.wt. polyphenylene sulfide resin. Said composition has large adhesion (interlocking property) to the frame or lead wire of an IC, transistor or diode and others, and is remarkably improved in moisture resistance, reduced in molding cycle time and capable of being reused after scrapped.
COPYRIGHT: (C)1982,JPO&Japio
JP2113881A 1981-02-16 1981-02-16 Polyphenylene sulfide resin composition for sealing electronic part Pending JPS57135859A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2113881A JPS57135859A (en) 1981-02-16 1981-02-16 Polyphenylene sulfide resin composition for sealing electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2113881A JPS57135859A (en) 1981-02-16 1981-02-16 Polyphenylene sulfide resin composition for sealing electronic part

Publications (1)

Publication Number Publication Date
JPS57135859A true JPS57135859A (en) 1982-08-21

Family

ID=12046530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2113881A Pending JPS57135859A (en) 1981-02-16 1981-02-16 Polyphenylene sulfide resin composition for sealing electronic part

Country Status (1)

Country Link
JP (1) JPS57135859A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181408A (en) * 1983-03-18 1984-10-15 フイリツプス・ペトロリユ−ム・コンパニ− Composition for sealing electronic part and collor shift preventing method
JPS6363752A (en) * 1986-09-01 1988-03-22 インペリアル・ケミカル・インダストリーズ・ピーエルシー Polymer concentrate and its production
JPS6361110U (en) * 1986-10-13 1988-04-22
JPH02105857A (en) * 1988-10-14 1990-04-18 Polyplastics Co Polyarylene sulfide resin composition and molding of combination thereof with metal
WO1991004566A1 (en) * 1989-09-21 1991-04-04 Toray Industries, Inc. Film capacitor and its manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181408A (en) * 1983-03-18 1984-10-15 フイリツプス・ペトロリユ−ム・コンパニ− Composition for sealing electronic part and collor shift preventing method
JPH0441441B2 (en) * 1983-03-18 1992-07-08 Phillips Petroleum Co
JPS6363752A (en) * 1986-09-01 1988-03-22 インペリアル・ケミカル・インダストリーズ・ピーエルシー Polymer concentrate and its production
JPS6361110U (en) * 1986-10-13 1988-04-22
JPH02105857A (en) * 1988-10-14 1990-04-18 Polyplastics Co Polyarylene sulfide resin composition and molding of combination thereof with metal
WO1991004566A1 (en) * 1989-09-21 1991-04-04 Toray Industries, Inc. Film capacitor and its manufacturing method

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