JPS57121026A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57121026A
JPS57121026A JP649581A JP649581A JPS57121026A JP S57121026 A JPS57121026 A JP S57121026A JP 649581 A JP649581 A JP 649581A JP 649581 A JP649581 A JP 649581A JP S57121026 A JPS57121026 A JP S57121026A
Authority
JP
Japan
Prior art keywords
epoxy
compound
formamide
resin composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP649581A
Other languages
Japanese (ja)
Inventor
Shiyuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP649581A priority Critical patent/JPS57121026A/en
Publication of JPS57121026A publication Critical patent/JPS57121026A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare the titled resin composition curable rapidly even at a low temperature, having excellent affinity and adhesivity to various organic and inorganic materials, and suitable for various adhesives, coating materials, etc., by using a formamide compound and an epoxy compound as essential components.
CONSTITUTION: The objective epoxy resisn composition is prepared by compounding (A) a formamide compound (e.g. N,N'-dimethyl-4,4'-diaminodiphenylmethane-bisformamide) with (B) an epoxy compound (e.g. bisphenol A-type epoxy resin), and adding triethylamine, etc. as a cure accelerator to the mixture. The amount of the formamide group of the component (A) is pref. 0.1W1 equivalent per 1 equivalent of the epoxy group of the component (B).
COPYRIGHT: (C)1982,JPO&Japio
JP649581A 1981-01-21 1981-01-21 Epoxy resin composition Pending JPS57121026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP649581A JPS57121026A (en) 1981-01-21 1981-01-21 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP649581A JPS57121026A (en) 1981-01-21 1981-01-21 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57121026A true JPS57121026A (en) 1982-07-28

Family

ID=11640034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP649581A Pending JPS57121026A (en) 1981-01-21 1981-01-21 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57121026A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143420A (en) * 1984-12-17 1986-07-01 Mitsubishi Rayon Co Ltd Resin composition and intermediate for composite material
EP0469550A2 (en) * 1990-07-30 1992-02-05 Dainippon Ink And Chemicals, Inc. A thermally curable mixture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143420A (en) * 1984-12-17 1986-07-01 Mitsubishi Rayon Co Ltd Resin composition and intermediate for composite material
JPH06838B2 (en) * 1984-12-17 1994-01-05 三菱レイヨン株式会社 Resin composition
EP0469550A2 (en) * 1990-07-30 1992-02-05 Dainippon Ink And Chemicals, Inc. A thermally curable mixture
US5395911A (en) * 1990-07-30 1995-03-07 Dainippon Ink And Chemicals, Inc. Thermally curable mixture containing epoxy and formamide compounds

Similar Documents

Publication Publication Date Title
KR860700038A (en) Curable coating composition and epoxy resin additive useful therefor
FI950034A0 (en) Method and composition enabling the use of substituted melamines as hardeners for novolak resins
JPS5426000A (en) Epoxy resin composition
JPS57121026A (en) Epoxy resin composition
JPS57202318A (en) Curable resin composition
JPS56141310A (en) Curable resin composition
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
JPS57147513A (en) Varnish composition
JPS5359798A (en) Epoxy resin composition of excellent warm-water resistance
JPS55116731A (en) Coating composition for molded polycarbonate article
JPS6448877A (en) Underwater adhesive composition
JPS5653119A (en) Curable resin composition
JPS57121025A (en) Epoxy resin composition
JPS5398400A (en) Epoxy resin composition
JPS5723624A (en) Epoxy resin composition
JPS5747323A (en) Epoxy resin composition having improved resistance to hot water at high temperature
JPS5647445A (en) Epoxy resin composition
JPS5432542A (en) Adhesive composition
JPS5418838A (en) Preparation of water-dilutive coating composition
JPS53118452A (en) Curable organopolysiloxane composition
JPS5767628A (en) Curable composition containing spiro-orthoester compound
JPS544994A (en) Epoxy resin composition
JPS5740576A (en) Epoxy resin adhesive composition
JPS57108123A (en) Flame-retarding resin composition
JPS5319400A (en) Bituminous epoxy resin compositions