JPS57121026A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57121026A JPS57121026A JP649581A JP649581A JPS57121026A JP S57121026 A JPS57121026 A JP S57121026A JP 649581 A JP649581 A JP 649581A JP 649581 A JP649581 A JP 649581A JP S57121026 A JPS57121026 A JP S57121026A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- compound
- formamide
- resin composition
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare the titled resin composition curable rapidly even at a low temperature, having excellent affinity and adhesivity to various organic and inorganic materials, and suitable for various adhesives, coating materials, etc., by using a formamide compound and an epoxy compound as essential components.
CONSTITUTION: The objective epoxy resisn composition is prepared by compounding (A) a formamide compound (e.g. N,N'-dimethyl-4,4'-diaminodiphenylmethane-bisformamide) with (B) an epoxy compound (e.g. bisphenol A-type epoxy resin), and adding triethylamine, etc. as a cure accelerator to the mixture. The amount of the formamide group of the component (A) is pref. 0.1W1 equivalent per 1 equivalent of the epoxy group of the component (B).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP649581A JPS57121026A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP649581A JPS57121026A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57121026A true JPS57121026A (en) | 1982-07-28 |
Family
ID=11640034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP649581A Pending JPS57121026A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57121026A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143420A (en) * | 1984-12-17 | 1986-07-01 | Mitsubishi Rayon Co Ltd | Resin composition and intermediate for composite material |
EP0469550A2 (en) * | 1990-07-30 | 1992-02-05 | Dainippon Ink And Chemicals, Inc. | A thermally curable mixture |
-
1981
- 1981-01-21 JP JP649581A patent/JPS57121026A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143420A (en) * | 1984-12-17 | 1986-07-01 | Mitsubishi Rayon Co Ltd | Resin composition and intermediate for composite material |
JPH06838B2 (en) * | 1984-12-17 | 1994-01-05 | 三菱レイヨン株式会社 | Resin composition |
EP0469550A2 (en) * | 1990-07-30 | 1992-02-05 | Dainippon Ink And Chemicals, Inc. | A thermally curable mixture |
US5395911A (en) * | 1990-07-30 | 1995-03-07 | Dainippon Ink And Chemicals, Inc. | Thermally curable mixture containing epoxy and formamide compounds |
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