JPS57147513A - Varnish composition - Google Patents

Varnish composition

Info

Publication number
JPS57147513A
JPS57147513A JP3442781A JP3442781A JPS57147513A JP S57147513 A JPS57147513 A JP S57147513A JP 3442781 A JP3442781 A JP 3442781A JP 3442781 A JP3442781 A JP 3442781A JP S57147513 A JPS57147513 A JP S57147513A
Authority
JP
Japan
Prior art keywords
compound
dicyandiamide
dissolving
epoxy resin
cure accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3442781A
Other languages
Japanese (ja)
Inventor
Kunimasa Kamio
Koichi Okuno
Satoru Haraguchi
Hiroyuki Yamaguchi
Koichi Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP3442781A priority Critical patent/JPS57147513A/en
Publication of JPS57147513A publication Critical patent/JPS57147513A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prepare the titled composition having excellent adhesivity, heat resistance, and storage stability, and useful as an adhesive, etc., by dissolving an epoxy resin, dicyandiamide, etc., a specific cure accelerator, and a urea compound having a specific structure.
CONSTITUTION: The objective composition is prepared by dissolving (A) an epoxy resin, (B) a dicyandiamide and/or hydrazide compound (e.g. succinic acid hydrazide) as a curing agent, (C) an addition compound of an epoxy compound and a dialkylamine (e.g. dimethylamine) or a neutralized product of said additive compound with an acidic substance (e.g. hydrochloric acid) as a cure accelerator and (D) a urea compound of formula (X and Y are H, Cl, CH3, etc.; R1 and R2 are alkyl, alkenyl, etc.) (e.g. 3-phenyl-1,1-dimethylurea), in an organic solvent (e.g. acetone). The amounts of the components (B), (C) and (D) are preferably 1W2pts.wt., 0.1W30pts., and 0.5W15pts. per 100pts. of the component (A), respectively.
COPYRIGHT: (C)1982,JPO&Japio
JP3442781A 1981-03-09 1981-03-09 Varnish composition Pending JPS57147513A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3442781A JPS57147513A (en) 1981-03-09 1981-03-09 Varnish composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3442781A JPS57147513A (en) 1981-03-09 1981-03-09 Varnish composition

Publications (1)

Publication Number Publication Date
JPS57147513A true JPS57147513A (en) 1982-09-11

Family

ID=12413907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3442781A Pending JPS57147513A (en) 1981-03-09 1981-03-09 Varnish composition

Country Status (1)

Country Link
JP (1) JPS57147513A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60202116A (en) * 1984-03-28 1985-10-12 Toho Rayon Co Ltd Epoxy resin composition
JPS6140317A (en) * 1984-08-01 1986-02-26 Toho Rayon Co Ltd Production of prepreg
JPS6143618A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPS6143619A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPS6143616A (en) * 1984-08-08 1986-03-03 Toho Rayon Co Ltd Epoxy resin composition
JPS6143617A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPS62285913A (en) * 1986-06-05 1987-12-11 Ajinomoto Co Inc Epoxy resin composition
JPS63132041A (en) * 1986-11-21 1988-06-04 日立化成工業株式会社 Method of treating copper foil
JP2002210985A (en) * 2001-01-15 2002-07-31 Konica Corp Ink jet head and its manufacturing method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440378B2 (en) * 1984-03-28 1992-07-02 Toho Rayon Kk
JPS60202116A (en) * 1984-03-28 1985-10-12 Toho Rayon Co Ltd Epoxy resin composition
JPS6140317A (en) * 1984-08-01 1986-02-26 Toho Rayon Co Ltd Production of prepreg
JPH0449568B2 (en) * 1984-08-01 1992-08-11 Toho Rayon Kk
JPS6143619A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPS6143617A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPS6143618A (en) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg thereof
JPH0586422B2 (en) * 1984-08-07 1993-12-13 Mitsubishi Rayon Co
JPH0586420B2 (en) * 1984-08-07 1993-12-13 Mitsubishi Rayon Co
JPH0586421B2 (en) * 1984-08-07 1993-12-13 Mitsubishi Rayon Co
JPH024607B2 (en) * 1984-08-08 1990-01-29 Toho Rayon Kk
JPS6143616A (en) * 1984-08-08 1986-03-03 Toho Rayon Co Ltd Epoxy resin composition
JPS62285913A (en) * 1986-06-05 1987-12-11 Ajinomoto Co Inc Epoxy resin composition
JPS63132041A (en) * 1986-11-21 1988-06-04 日立化成工業株式会社 Method of treating copper foil
JP2002210985A (en) * 2001-01-15 2002-07-31 Konica Corp Ink jet head and its manufacturing method

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