JPS5647434A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5647434A JPS5647434A JP12318779A JP12318779A JPS5647434A JP S5647434 A JPS5647434 A JP S5647434A JP 12318779 A JP12318779 A JP 12318779A JP 12318779 A JP12318779 A JP 12318779A JP S5647434 A JPS5647434 A JP S5647434A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- thermosetting resin
- catalyst
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyethers (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Abstract
PURPOSE: To prepare a thermosetting resin composition having shortened gel time and giving a varnish with improved pot life, by compounding a bis(trioxaspirononyl) compound and a tertiary amine compound.
CONSTITUTION: A bis[1,4,6-trioxaspiro(4.4)nonyl] compound of formula (R is bivalent organic group) is prepared by reacting a bifunctional epoxy compound with γ-butyrolactone in the presence of a cationic catalyst such as BF3.ether complex. The objective thermosetting resin composition is obtained by adding ≤10wt% of a curing catalyst comprising a tertiary amine compound such as tetramethylbutanediamine to the compound prepared above. The catalyst may be a mixture of two or more compounds.
USE: Sealing of electronic parts, molding of printed circuit board, etc.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12318779A JPS6030338B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12318779A JPS6030338B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5647434A true JPS5647434A (en) | 1981-04-30 |
JPS6030338B2 JPS6030338B2 (en) | 1985-07-16 |
Family
ID=14854338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12318779A Expired JPS6030338B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6030338B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190003085A (en) * | 2017-06-30 | 2019-01-09 | 삼성전자주식회사 | Electronic device for providing service and operating mehtod thereof |
-
1979
- 1979-09-27 JP JP12318779A patent/JPS6030338B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6030338B2 (en) | 1985-07-16 |
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