JPS5647434A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5647434A
JPS5647434A JP12318779A JP12318779A JPS5647434A JP S5647434 A JPS5647434 A JP S5647434A JP 12318779 A JP12318779 A JP 12318779A JP 12318779 A JP12318779 A JP 12318779A JP S5647434 A JPS5647434 A JP S5647434A
Authority
JP
Japan
Prior art keywords
compound
resin composition
thermosetting resin
catalyst
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12318779A
Other languages
Japanese (ja)
Other versions
JPS6030338B2 (en
Inventor
Yutaka Ito
Akio Takahashi
Motoyo Wajima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12318779A priority Critical patent/JPS6030338B2/en
Publication of JPS5647434A publication Critical patent/JPS5647434A/en
Publication of JPS6030338B2 publication Critical patent/JPS6030338B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polyethers (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)

Abstract

PURPOSE: To prepare a thermosetting resin composition having shortened gel time and giving a varnish with improved pot life, by compounding a bis(trioxaspirononyl) compound and a tertiary amine compound.
CONSTITUTION: A bis[1,4,6-trioxaspiro(4.4)nonyl] compound of formula (R is bivalent organic group) is prepared by reacting a bifunctional epoxy compound with γ-butyrolactone in the presence of a cationic catalyst such as BF3.ether complex. The objective thermosetting resin composition is obtained by adding ≤10wt% of a curing catalyst comprising a tertiary amine compound such as tetramethylbutanediamine to the compound prepared above. The catalyst may be a mixture of two or more compounds.
USE: Sealing of electronic parts, molding of printed circuit board, etc.
COPYRIGHT: (C)1981,JPO&Japio
JP12318779A 1979-09-27 1979-09-27 thermosetting resin composition Expired JPS6030338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12318779A JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12318779A JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS5647434A true JPS5647434A (en) 1981-04-30
JPS6030338B2 JPS6030338B2 (en) 1985-07-16

Family

ID=14854338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12318779A Expired JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS6030338B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190003085A (en) * 2017-06-30 2019-01-09 삼성전자주식회사 Electronic device for providing service and operating mehtod thereof

Also Published As

Publication number Publication date
JPS6030338B2 (en) 1985-07-16

Similar Documents

Publication Publication Date Title
MY120945A (en) Modified epoxy resin, epoxy resin composition and cured product thereof
JPS562319A (en) Epoxy resin composition
JPS57131223A (en) Resin composition
JPS5657820A (en) Curable epoxy resin composition
JPS5647434A (en) Thermosetting resin composition
JPS5734122A (en) Thermosetting resin composition
JPS5426000A (en) Epoxy resin composition
JPS57147513A (en) Varnish composition
JPS5647433A (en) Thermosetting resin composition
ES454388A1 (en) Moulding compositions containing a novolak phenolic resin and an amine-boric acid stabilizer-catalyst
JPS5681333A (en) Epoxy resin composition
DE3370160D1 (en) Improvements in or relating to the curing of epoxide resins
JPS5659834A (en) Thermosetting resin composition
JPS5467000A (en) Transparent thermosetting resin composition
JPS5738851A (en) Thermosetting resin composition
JPS56127625A (en) Crosslinking agent
JPS5659841A (en) Epoxy resin composition
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS5728129A (en) Curing agent for epoxy resin
JPS56109222A (en) Cold quick-curing epoxy resin
JPS5638318A (en) Heat-resistant resin composition
JPS56131620A (en) Epoxy resin composition
JPS5466999A (en) Transparent thermosetting resin composition
JPS57190018A (en) Epoxy resin composition
JPS5767628A (en) Curable composition containing spiro-orthoester compound