JPS5647434A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5647434A
JPS5647434A JP12318779A JP12318779A JPS5647434A JP S5647434 A JPS5647434 A JP S5647434A JP 12318779 A JP12318779 A JP 12318779A JP 12318779 A JP12318779 A JP 12318779A JP S5647434 A JPS5647434 A JP S5647434A
Authority
JP
Japan
Prior art keywords
compound
resin composition
thermosetting resin
catalyst
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12318779A
Other languages
Japanese (ja)
Other versions
JPS6030338B2 (en
Inventor
Yutaka Ito
Akio Takahashi
Motoyo Wajima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12318779A priority Critical patent/JPS6030338B2/en
Publication of JPS5647434A publication Critical patent/JPS5647434A/en
Publication of JPS6030338B2 publication Critical patent/JPS6030338B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polyethers (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)

Abstract

PURPOSE: To prepare a thermosetting resin composition having shortened gel time and giving a varnish with improved pot life, by compounding a bis(trioxaspirononyl) compound and a tertiary amine compound.
CONSTITUTION: A bis[1,4,6-trioxaspiro(4.4)nonyl] compound of formula (R is bivalent organic group) is prepared by reacting a bifunctional epoxy compound with γ-butyrolactone in the presence of a cationic catalyst such as BF3.ether complex. The objective thermosetting resin composition is obtained by adding ≤10wt% of a curing catalyst comprising a tertiary amine compound such as tetramethylbutanediamine to the compound prepared above. The catalyst may be a mixture of two or more compounds.
USE: Sealing of electronic parts, molding of printed circuit board, etc.
COPYRIGHT: (C)1981,JPO&Japio
JP12318779A 1979-09-27 1979-09-27 thermosetting resin composition Expired JPS6030338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12318779A JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12318779A JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS5647434A true JPS5647434A (en) 1981-04-30
JPS6030338B2 JPS6030338B2 (en) 1985-07-16

Family

ID=14854338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12318779A Expired JPS6030338B2 (en) 1979-09-27 1979-09-27 thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS6030338B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190003085A (en) * 2017-06-30 2019-01-09 삼성전자주식회사 Electronic device for providing service and operating mehtod thereof

Also Published As

Publication number Publication date
JPS6030338B2 (en) 1985-07-16

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