JPS57180633A - Curable polyimide resin composition - Google Patents

Curable polyimide resin composition

Info

Publication number
JPS57180633A
JPS57180633A JP6417981A JP6417981A JPS57180633A JP S57180633 A JPS57180633 A JP S57180633A JP 6417981 A JP6417981 A JP 6417981A JP 6417981 A JP6417981 A JP 6417981A JP S57180633 A JPS57180633 A JP S57180633A
Authority
JP
Japan
Prior art keywords
polyimide
curable
acid
resin composition
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6417981A
Other languages
Japanese (ja)
Inventor
Shunichi Numata
Koji Fujisaki
Akio Nishikawa
Daisuke Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6417981A priority Critical patent/JPS57180633A/en
Publication of JPS57180633A publication Critical patent/JPS57180633A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A curable polyimide resin composition having excellent solvent resistance and low moisture absorption and being suitable as a protective coating material for semiconductor devices, prepared by mixing a polyimide or a polyamide-acid with a curable resin.
CONSTITUTION: An organic tetracarboxylic acid dianhydride (e.g., pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride) is reacted with an organic diamine (e.g., m-phenylenediamine, 1,5-diaminonaphthalene) to produce a polyamide-acid or the latter is further ring-closed by dehydration to form a polyimide. Then, the resulting polyimide or polyamide-acid is mixed with a curable resin (e.g., phenol resin, epoxy resin) to form the purpose curable polyimide resin composition. Thus, the polyimide skeleton which is poor in solvent resistance is fixed in a three-dimensional network, and its solvent resistance is improved.
COPYRIGHT: (C)1982,JPO&Japio
JP6417981A 1981-04-30 1981-04-30 Curable polyimide resin composition Pending JPS57180633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6417981A JPS57180633A (en) 1981-04-30 1981-04-30 Curable polyimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6417981A JPS57180633A (en) 1981-04-30 1981-04-30 Curable polyimide resin composition

Publications (1)

Publication Number Publication Date
JPS57180633A true JPS57180633A (en) 1982-11-06

Family

ID=13250569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6417981A Pending JPS57180633A (en) 1981-04-30 1981-04-30 Curable polyimide resin composition

Country Status (1)

Country Link
JP (1) JPS57180633A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168030A (en) * 1983-03-15 1984-09-21 Hitachi Chem Co Ltd Production of thermoplastic polyether-imide
WO1984004102A1 (en) * 1983-04-11 1984-10-25 Hitachi Ltd Fluorine-containing polyamic acids and polyimides
JPS6211727A (en) * 1985-07-09 1987-01-20 Ube Ind Ltd Aromatic polyimide and composition thereof
US4952662A (en) * 1988-02-12 1990-08-28 Huels Aktiengaellscaft Molding compounds comprising a thermoplastically processible, aromatic polyamide
CN111440440A (en) * 2020-04-17 2020-07-24 华北电力大学 Film applied to high-frequency transformer cladding insulation and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168030A (en) * 1983-03-15 1984-09-21 Hitachi Chem Co Ltd Production of thermoplastic polyether-imide
JPH0433809B2 (en) * 1983-03-15 1992-06-04 Hitachi Chemical Co Ltd
WO1984004102A1 (en) * 1983-04-11 1984-10-25 Hitachi Ltd Fluorine-containing polyamic acids and polyimides
JPS6211727A (en) * 1985-07-09 1987-01-20 Ube Ind Ltd Aromatic polyimide and composition thereof
JPH0374702B2 (en) * 1985-07-09 1991-11-27
US4952662A (en) * 1988-02-12 1990-08-28 Huels Aktiengaellscaft Molding compounds comprising a thermoplastically processible, aromatic polyamide
CN111440440A (en) * 2020-04-17 2020-07-24 华北电力大学 Film applied to high-frequency transformer cladding insulation and preparation method thereof

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