JPS5573726A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS5573726A
JPS5573726A JP14685978A JP14685978A JPS5573726A JP S5573726 A JPS5573726 A JP S5573726A JP 14685978 A JP14685978 A JP 14685978A JP 14685978 A JP14685978 A JP 14685978A JP S5573726 A JPS5573726 A JP S5573726A
Authority
JP
Japan
Prior art keywords
heat
resin composition
resistant resin
epoxy
bismaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14685978A
Other languages
Japanese (ja)
Other versions
JPS5634212B2 (en
Inventor
Norio Saruwatari
Isao Watanabe
Kazumasa Saito
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14685978A priority Critical patent/JPS5573726A/en
Publication of JPS5573726A publication Critical patent/JPS5573726A/en
Publication of JPS5634212B2 publication Critical patent/JPS5634212B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: A heat-resistant resin composition having improved adhesiveness, heat resistance, and dielectric properties, obtained by heat-curing a blend of an epoxy- modified 1,2-polybutadiene, a carboxylic acid anhydride, and a bismaleimide.
CONSTITUTION: A heat-resistant resin composition obtained by heat-curing (A) 100 parts by wt. of an epoxy-modified 1, 2-polybutadiene of formula I: (n is an integer 1W200; m is an integer 1W20) and (B) 50W200 parts by wt. of a bismaleimide of formula II: (R is ≥2C bifunctional hydrocarbon), in the presence of an organic peroxide. The ratio of the number of the epoxy group in (A) to that of the acid anhydride group in (B) is preferably 0.9W1.1:1.
COPYRIGHT: (C)1980,JPO&Japio
JP14685978A 1978-11-28 1978-11-28 Heat-resistant resin composition Granted JPS5573726A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14685978A JPS5573726A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14685978A JPS5573726A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS5573726A true JPS5573726A (en) 1980-06-03
JPS5634212B2 JPS5634212B2 (en) 1981-08-08

Family

ID=15417167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14685978A Granted JPS5573726A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS5573726A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127425A (en) * 1979-03-24 1980-10-02 Fujitsu Ltd Heat-resistant resin composition and heat-resistant laminated sheet
JPS6479216A (en) * 1987-09-22 1989-03-24 Toshiba Chem Corp Heat-resistant resin composition and preparation thereof
JPH01121356A (en) * 1987-11-04 1989-05-15 Hitachi Ltd Thermosetting resin composition and prepreg and laminated board produced by using same
JPH04366126A (en) * 1991-06-13 1992-12-18 Toshiba Chem Corp Thermosetting resin composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037740U (en) * 1983-08-24 1985-03-15 株式会社日立製作所 air conditioner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4955800A (en) * 1972-10-02 1974-05-30
JPS49121900A (en) * 1973-03-27 1974-11-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4955800A (en) * 1972-10-02 1974-05-30
JPS49121900A (en) * 1973-03-27 1974-11-21

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127425A (en) * 1979-03-24 1980-10-02 Fujitsu Ltd Heat-resistant resin composition and heat-resistant laminated sheet
JPS5634215B2 (en) * 1979-03-24 1981-08-08
JPS6479216A (en) * 1987-09-22 1989-03-24 Toshiba Chem Corp Heat-resistant resin composition and preparation thereof
JPH01121356A (en) * 1987-11-04 1989-05-15 Hitachi Ltd Thermosetting resin composition and prepreg and laminated board produced by using same
JPH04366126A (en) * 1991-06-13 1992-12-18 Toshiba Chem Corp Thermosetting resin composition
JPH0776259B2 (en) * 1991-06-13 1995-08-16 東芝ケミカル株式会社 Thermosetting resin composition

Also Published As

Publication number Publication date
JPS5634212B2 (en) 1981-08-08

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