JPS5573726A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS5573726A JPS5573726A JP14685978A JP14685978A JPS5573726A JP S5573726 A JPS5573726 A JP S5573726A JP 14685978 A JP14685978 A JP 14685978A JP 14685978 A JP14685978 A JP 14685978A JP S5573726 A JPS5573726 A JP S5573726A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin composition
- resistant resin
- epoxy
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: A heat-resistant resin composition having improved adhesiveness, heat resistance, and dielectric properties, obtained by heat-curing a blend of an epoxy- modified 1,2-polybutadiene, a carboxylic acid anhydride, and a bismaleimide.
CONSTITUTION: A heat-resistant resin composition obtained by heat-curing (A) 100 parts by wt. of an epoxy-modified 1, 2-polybutadiene of formula I: (n is an integer 1W200; m is an integer 1W20) and (B) 50W200 parts by wt. of a bismaleimide of formula II: (R is ≥2C bifunctional hydrocarbon), in the presence of an organic peroxide. The ratio of the number of the epoxy group in (A) to that of the acid anhydride group in (B) is preferably 0.9W1.1:1.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14685978A JPS5573726A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14685978A JPS5573726A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5573726A true JPS5573726A (en) | 1980-06-03 |
JPS5634212B2 JPS5634212B2 (en) | 1981-08-08 |
Family
ID=15417167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14685978A Granted JPS5573726A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5573726A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127425A (en) * | 1979-03-24 | 1980-10-02 | Fujitsu Ltd | Heat-resistant resin composition and heat-resistant laminated sheet |
JPS6479216A (en) * | 1987-09-22 | 1989-03-24 | Toshiba Chem Corp | Heat-resistant resin composition and preparation thereof |
JPH01121356A (en) * | 1987-11-04 | 1989-05-15 | Hitachi Ltd | Thermosetting resin composition and prepreg and laminated board produced by using same |
JPH04366126A (en) * | 1991-06-13 | 1992-12-18 | Toshiba Chem Corp | Thermosetting resin composition |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037740U (en) * | 1983-08-24 | 1985-03-15 | 株式会社日立製作所 | air conditioner |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4955800A (en) * | 1972-10-02 | 1974-05-30 | ||
JPS49121900A (en) * | 1973-03-27 | 1974-11-21 |
-
1978
- 1978-11-28 JP JP14685978A patent/JPS5573726A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4955800A (en) * | 1972-10-02 | 1974-05-30 | ||
JPS49121900A (en) * | 1973-03-27 | 1974-11-21 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127425A (en) * | 1979-03-24 | 1980-10-02 | Fujitsu Ltd | Heat-resistant resin composition and heat-resistant laminated sheet |
JPS5634215B2 (en) * | 1979-03-24 | 1981-08-08 | ||
JPS6479216A (en) * | 1987-09-22 | 1989-03-24 | Toshiba Chem Corp | Heat-resistant resin composition and preparation thereof |
JPH01121356A (en) * | 1987-11-04 | 1989-05-15 | Hitachi Ltd | Thermosetting resin composition and prepreg and laminated board produced by using same |
JPH04366126A (en) * | 1991-06-13 | 1992-12-18 | Toshiba Chem Corp | Thermosetting resin composition |
JPH0776259B2 (en) * | 1991-06-13 | 1995-08-16 | 東芝ケミカル株式会社 | Thermosetting resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5634212B2 (en) | 1981-08-08 |
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