JPS55115442A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS55115442A
JPS55115442A JP2136979A JP2136979A JPS55115442A JP S55115442 A JPS55115442 A JP S55115442A JP 2136979 A JP2136979 A JP 2136979A JP 2136979 A JP2136979 A JP 2136979A JP S55115442 A JPS55115442 A JP S55115442A
Authority
JP
Japan
Prior art keywords
epoxy
resin
resin composition
thermosetting resin
hardening agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2136979A
Other languages
Japanese (ja)
Inventor
Kazumasa Saito
Isao Watanabe
Norio Saruwatari
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2136979A priority Critical patent/JPS55115442A/en
Publication of JPS55115442A publication Critical patent/JPS55115442A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a thermosetting resin composition giving a hardened resin with excellent adhesibility to metal, dielectric property and heat resistance which comprises an epoxy resin, an epoxidized 1,2-polybutadiene resin and a hardening agent.
CONSTITUTION: A thermosetting resin composition comprises (A) an epoxy resin, (B) an epoxidized 1,2-polybutadiene resin and (C) a hardening agent. Herein, (B) is pref. one of which the number of epoxy groups is 10W50% of the number to total functional groups (the number of epoxy groups plus the number of vinyl groups) and a compounding ratio of (A) to (B) is pref. 1:0.5W1:3 (wt. ratio). As a hardening agent, it is necessary to use two kinds of hardening agents comprising an acid anhydride or amine for opening epoxy rings and an org. peroxide for reacting pendant double bonds of (B).
COPYRIGHT: (C)1980,JPO&Japio
JP2136979A 1979-02-27 1979-02-27 Thermosetting resin composition Pending JPS55115442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2136979A JPS55115442A (en) 1979-02-27 1979-02-27 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2136979A JPS55115442A (en) 1979-02-27 1979-02-27 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS55115442A true JPS55115442A (en) 1980-09-05

Family

ID=12053176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2136979A Pending JPS55115442A (en) 1979-02-27 1979-02-27 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS55115442A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
EP0232873A2 (en) * 1986-02-12 1987-08-19 Teroson GmbH Sealing and adhesion agent
US5084531A (en) * 1989-08-31 1992-01-28 Amoco Corporation Epoxy resins containing epoxidized polybutenes
US5093424A (en) * 1989-08-07 1992-03-03 Kansai Paint Co., Ltd. Coating of epoxidized polybutadiene and bisphenol-capped epoxy resin
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
JP2001122945A (en) * 1999-10-27 2001-05-08 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP2002232148A (en) * 2001-02-02 2002-08-16 Taiyo Ink Mfg Ltd Thermosetting resin composition for wiring board, its molding and multilayer printed wiring board
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
EP0232873A2 (en) * 1986-02-12 1987-08-19 Teroson GmbH Sealing and adhesion agent
US5093424A (en) * 1989-08-07 1992-03-03 Kansai Paint Co., Ltd. Coating of epoxidized polybutadiene and bisphenol-capped epoxy resin
US5084531A (en) * 1989-08-31 1992-01-28 Amoco Corporation Epoxy resins containing epoxidized polybutenes
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
JP2001122945A (en) * 1999-10-27 2001-05-08 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP4534280B2 (en) * 1999-10-27 2010-09-01 日立化成工業株式会社 Epoxy resin molding material for sealing and electronic component device
JP2002232148A (en) * 2001-02-02 2002-08-16 Taiyo Ink Mfg Ltd Thermosetting resin composition for wiring board, its molding and multilayer printed wiring board
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component

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