JPS55115442A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS55115442A JPS55115442A JP2136979A JP2136979A JPS55115442A JP S55115442 A JPS55115442 A JP S55115442A JP 2136979 A JP2136979 A JP 2136979A JP 2136979 A JP2136979 A JP 2136979A JP S55115442 A JPS55115442 A JP S55115442A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- resin
- resin composition
- thermosetting resin
- hardening agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To provide a thermosetting resin composition giving a hardened resin with excellent adhesibility to metal, dielectric property and heat resistance which comprises an epoxy resin, an epoxidized 1,2-polybutadiene resin and a hardening agent.
CONSTITUTION: A thermosetting resin composition comprises (A) an epoxy resin, (B) an epoxidized 1,2-polybutadiene resin and (C) a hardening agent. Herein, (B) is pref. one of which the number of epoxy groups is 10W50% of the number to total functional groups (the number of epoxy groups plus the number of vinyl groups) and a compounding ratio of (A) to (B) is pref. 1:0.5W1:3 (wt. ratio). As a hardening agent, it is necessary to use two kinds of hardening agents comprising an acid anhydride or amine for opening epoxy rings and an org. peroxide for reacting pendant double bonds of (B).
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2136979A JPS55115442A (en) | 1979-02-27 | 1979-02-27 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2136979A JPS55115442A (en) | 1979-02-27 | 1979-02-27 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55115442A true JPS55115442A (en) | 1980-09-05 |
Family
ID=12053176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2136979A Pending JPS55115442A (en) | 1979-02-27 | 1979-02-27 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55115442A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4628022A (en) * | 1983-07-13 | 1986-12-09 | At&T Technologies, Inc. | Multilayer circuit board fabrication process and polymer insulator used therein |
EP0232873A2 (en) * | 1986-02-12 | 1987-08-19 | Teroson GmbH | Sealing and adhesion agent |
US5084531A (en) * | 1989-08-31 | 1992-01-28 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
US5093424A (en) * | 1989-08-07 | 1992-03-03 | Kansai Paint Co., Ltd. | Coating of epoxidized polybutadiene and bisphenol-capped epoxy resin |
US5225486A (en) * | 1989-08-31 | 1993-07-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
JP2001122945A (en) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP2002232148A (en) * | 2001-02-02 | 2002-08-16 | Taiyo Ink Mfg Ltd | Thermosetting resin composition for wiring board, its molding and multilayer printed wiring board |
JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
-
1979
- 1979-02-27 JP JP2136979A patent/JPS55115442A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4628022A (en) * | 1983-07-13 | 1986-12-09 | At&T Technologies, Inc. | Multilayer circuit board fabrication process and polymer insulator used therein |
EP0232873A2 (en) * | 1986-02-12 | 1987-08-19 | Teroson GmbH | Sealing and adhesion agent |
US5093424A (en) * | 1989-08-07 | 1992-03-03 | Kansai Paint Co., Ltd. | Coating of epoxidized polybutadiene and bisphenol-capped epoxy resin |
US5084531A (en) * | 1989-08-31 | 1992-01-28 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
US5225486A (en) * | 1989-08-31 | 1993-07-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
JP2001122945A (en) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP4534280B2 (en) * | 1999-10-27 | 2010-09-01 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
JP2002232148A (en) * | 2001-02-02 | 2002-08-16 | Taiyo Ink Mfg Ltd | Thermosetting resin composition for wiring board, its molding and multilayer printed wiring board |
JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
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