JPS5598244A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5598244A
JPS5598244A JP474879A JP474879A JPS5598244A JP S5598244 A JPS5598244 A JP S5598244A JP 474879 A JP474879 A JP 474879A JP 474879 A JP474879 A JP 474879A JP S5598244 A JPS5598244 A JP S5598244A
Authority
JP
Japan
Prior art keywords
resin
formula
resin composition
represented
modified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP474879A
Other languages
Japanese (ja)
Inventor
Katsura Adachi
Isao Watanabe
Norio Saruwatari
Kazumasa Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP474879A priority Critical patent/JPS5598244A/en
Publication of JPS5598244A publication Critical patent/JPS5598244A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: To produce a title resin composition providing for an insulating material excellent in thermal and electrical properties and moisture resistance by adding bisphenolic dicyanate, triazine resin oligomer, etc. to 1, 2-polybutadiene (medified) resin having side-chain double bonds.
CONSTITUTION: To (a) 100pts.wt. of resin such as 1, 2-polybutadiene resin having side-chain double bonds, or its cyanate-modified resin, or its epoxy-modified resin, (b) about 0.5W10pts.wt. of radical polymerization initiator such as azobisbutyronitrile, (c) bisphenolic dicyanate represented by the formula I (wherein X is O, CH2, and C(CH3)2), and (d) triazine resin oligomer represented by the formula II (Ar has the formula III), or (d) bismaleimide-modified triazine resin represented by the formula IV (Ar is the same as above) are added and mixed to provide the object thermosetting resin composition.
COPYRIGHT: (C)1980,JPO&Japio
JP474879A 1979-01-22 1979-01-22 Thermosetting resin composition Pending JPS5598244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP474879A JPS5598244A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP474879A JPS5598244A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5598244A true JPS5598244A (en) 1980-07-26

Family

ID=11592524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP474879A Pending JPS5598244A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5598244A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576388A (en) * 1994-10-11 1996-11-19 Shell Oil Company Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems
JP2007021763A (en) * 2005-07-12 2007-02-01 Hitachi Chem Co Ltd Metal foil with adhesive layer and metal clad laminated sheet
US9332637B2 (en) * 2013-11-04 2016-05-03 Novoset Llc Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576388A (en) * 1994-10-11 1996-11-19 Shell Oil Company Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems
US5804657A (en) * 1994-10-11 1998-09-08 Shell Oil Company Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems
US5880217A (en) * 1994-10-11 1999-03-09 Shell Oil Company Telechelic and heterotelechelic polymers with dual curing agents
US5910542A (en) * 1994-10-11 1999-06-08 Shell Oil Company Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems
JP2007021763A (en) * 2005-07-12 2007-02-01 Hitachi Chem Co Ltd Metal foil with adhesive layer and metal clad laminated sheet
US9332637B2 (en) * 2013-11-04 2016-05-03 Novoset Llc Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom
US9596753B2 (en) * 2013-11-04 2017-03-14 Novoset, Llc Ultra low loss dielectric thermosetting resin composition and high performance laminates manufactured therefrom

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