JPH04366126A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPH04366126A JPH04366126A JP16875891A JP16875891A JPH04366126A JP H04366126 A JPH04366126 A JP H04366126A JP 16875891 A JP16875891 A JP 16875891A JP 16875891 A JP16875891 A JP 16875891A JP H04366126 A JPH04366126 A JP H04366126A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- parts
- thermosetting resin
- diaminosiloxane
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 12
- -1 diaminosiloxane Chemical class 0.000 claims abstract description 13
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract 2
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 150000002118 epoxides Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 241000156978 Erebia Species 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000010533 azeotropic distillation Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006210 cyclodehydration reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、耐湿性、低応力性、耐
熱性等に優れた熱硬化性樹脂組成物に関し、この組成物
は半導体等の電子部品の液状封止用に好適である。[Field of Industrial Application] The present invention relates to a thermosetting resin composition having excellent moisture resistance, low stress properties, heat resistance, etc., and this composition is suitable for liquid sealing of electronic components such as semiconductors. .
【０００２】0002
【従来の技術】従来、半導体等の電子部品の液状封止に
用いられる樹脂組成物としては、エポキシ樹脂が用いら
れていた。このエポキシ樹脂による液状封止は、ガラス
、金属、セラミックを用いたハーメチックシール方式に
比較して経済的に有利なために、広くＴＡＢ、ＩＣカー
ド、ハイブリッドＩＣ等の封止に実用化されている。BACKGROUND OF THE INVENTION Conventionally, epoxy resins have been used as resin compositions for liquid sealing of electronic components such as semiconductors. Liquid sealing using epoxy resin is economically advantageous compared to hermetic sealing methods using glass, metal, and ceramics, so it is widely used for sealing TABs, IC cards, hybrid ICs, etc. .
【０００３】しかしながら、近年封止材料の使用条件は
厳しくなる傾向にあり、低応力性、耐湿性、耐熱性及び
密着性が重要な特性となっている。そこで近年、低応力
性、耐湿性、耐熱性あるいは密着性の優れた樹脂組成物
が多く提案されているが、さらに一段と半導体ペレット
は大型化、高集積度化の傾向が高まり、従来のエポキシ
樹脂組成物では対応しきれなくなってきた。すなわち、
この組成物で半導体の液状封止をした場合、ペレットや
リードフレームと封止樹脂との熱膨脹係数の差に基づく
熱応力により、ペレットの反り、クラックが発生する等
の問題が生じるようになった。従って、これらのことか
ら低応力性に優れさらに耐湿性、耐熱性にも優れた液状
封止用の樹脂組成物の開発が望まれていた。However, in recent years, the usage conditions for sealing materials have tended to become stricter, and low stress, moisture resistance, heat resistance, and adhesion have become important properties. Therefore, in recent years, many resin compositions with excellent low stress, moisture resistance, heat resistance, or adhesion have been proposed. Compositions are no longer able to cope with this problem. That is,
When semiconductors are encapsulated in liquid form using this composition, problems such as warpage and cracking of the pellets occur due to thermal stress due to the difference in coefficient of thermal expansion between the pellets or lead frames and the encapsulating resin. . Therefore, for these reasons, it has been desired to develop a resin composition for liquid sealing that has excellent low stress properties and also has excellent moisture resistance and heat resistance.
【０００４】0004
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、耐湿性、密着性、低応力性と
ともに耐熱性にも優れ、また液状封止をした場合にペレ
ットの反りやクラックの発生のない、改良された熱硬化
性樹脂組成物を提供しようとするものである。Problems to be Solved by the Invention The present invention has been made in view of the above-mentioned circumstances, and has excellent moisture resistance, adhesion, low stress properties, and heat resistance. The object of the present invention is to provide an improved thermosetting resin composition that is free from warping and cracking.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと鋭意研究を重ねた結果、後述する組成
の樹脂組成物が、上記目的を達成する事を見いだし、本
発明を完成したものである。[Means for Solving the Problems] As a result of intensive research aimed at achieving the above object, the present inventors found that a resin composition having the composition described below achieves the above object, and the present invention has been completed. It is completed.
【０００６】すなわち、本発明は、（Ａ）一般式化３で
示されるジアミノシロキサンから誘導されるビスマレイ
ミドThat is, the present invention provides (A) a bismaleimide derived from a diaminosiloxane represented by the general formula 3.
【０００７】[0007]
【化３】
（但し、式中Ｒ１ 及びＲ２ は２ 価の炭化水素基、
Ｒ３ 及びＲ４ は１ 価の炭化水素基を示しＲ１ と
Ｒ２ 、Ｒ３ とＲ４ とは、それぞれ同一でも異なっ
てもよく、ｎは１〜５ の整数を表す）[Chemical formula 3] (However, in the formula, R1 and R2 are divalent hydrocarbon groups,
R3 and R4 represent monovalent hydrocarbon groups, R1 and R2, R3 and R4 may be the same or different, and n represents an integer of 1 to 5)
【０００８】（Ｂ）構造式化４で示される １，２ポリ
ブタジエンのエポキシ化物(B) Epoxidized product of 1,2 polybutadiene represented by structural formula 4
【０００９】[0009]
【化４】
を必須成分としてなることを特徴とする熱硬化性樹脂組
成物である。This is a thermosetting resin composition characterized by comprising [Image Omitted] as an essential component.
【００１０】以下、本発明を詳細に声明する。The present invention will now be described in detail.
【００１１】本発明に用いる（Ａ）成分のジアミノシロ
キサンから誘導されるビスマレイミドは硬化物にイミド
骨格とシロキサン骨格を導入する成分であって、ジアミ
ノシロキサンとマレイン酸とを公知の方法により縮合・
脱水環化反応して、容易に製造することができる。この
ようなジアミノシロキサンの代表例として、次の化５お
よび化６に示すものが挙げられる。Bismaleimide derived from diaminosiloxane, which is component (A) used in the present invention, is a component for introducing an imide skeleton and a siloxane skeleton into the cured product, and is obtained by condensing diaminosiloxane and maleic acid by a known method.
It can be easily produced by cyclodehydration reaction. Representative examples of such diaminosiloxanes include those shown in the following chemical formulas 5 and 6.
【００１２】0012
【化５】[C5]
【００１３】[0013]
【化６】[C6]
【００１４】本発明の硬化物にポリブタジエン構造を導
入するに用いる（Ｂ）１，２−ポリブタジエンのエポキ
シ化物は、分子中にエポキシ基とビニル基とを含有する
反応性の高いオリゴマーであって、その構造は化７のよ
うに推定される。The epoxidized product of 1,2-polybutadiene (B) used to introduce a polybutadiene structure into the cured product of the present invention is a highly reactive oligomer containing an epoxy group and a vinyl group in the molecule, and Its structure is estimated as shown in chemical formula 7.
【００１５】[0015]
【化７】[C7]
【００１６】このエポキシ化物は、１，２−ポリブタジ
エンを過酸化水素法によってエポキシ化して得られ、具
体的な化合物としてＢＦ−１０００（アデカ・アーガス
化学社製、商品名）等がある。This epoxidized product is obtained by epoxidizing 1,2-polybutadiene by a hydrogen peroxide method, and specific examples include BF-1000 (manufactured by Adeka Argus Chemical Co., Ltd., trade name).
【００１７】上述した（Ａ）のビスマレイミドと（Ｂ）
のエポキシ化物の配合割合は、前者５０〜９５重量部に
対して後者を ５〜５０重量部配合することが望ましく
、より好ましくは前者８０〜９０重量部に対して後者を
１０〜２０重量部配合する。[0017] The above-mentioned bismaleimide (A) and (B)
The blending ratio of the epoxide is preferably 5 to 50 parts by weight of the latter to 50 to 95 parts by weight of the former, more preferably 10 to 20 parts by weight of the latter to 80 to 90 parts by weight of the former. do.
【００１８】本発明に用いる熱硬化性樹脂組成物は、ビ
スマレイミドとエポキシ化物とを必須成分として配合さ
れ熱硬化させるが、本発明の目的に反しない程度におい
て、また必要に応じてシリカ、炭酸カルシウム、水酸化
アルミニウム等の充填剤、顔料、消泡剤、その他の成分
を配合することができる。この熱硬化性樹脂組成物は、
上述した各成分を配合して均一に混合攪拌して製造する
ことができる。熱硬化性樹脂組成物は硬化剤を用いなく
ても硬化するが、イミダゾール誘導体やマレイン化触媒
を使用することもできる。The thermosetting resin composition used in the present invention contains bismaleimide and an epoxide as essential components and is thermally cured, but silica and carbonate may be added to an extent that does not contradict the purpose of the present invention and as necessary. Fillers such as calcium and aluminum hydroxide, pigments, antifoaming agents, and other components can be blended. This thermosetting resin composition is
It can be manufactured by blending the above-mentioned components and uniformly mixing and stirring. Although the thermosetting resin composition can be cured without using a curing agent, an imidazole derivative or a maleation catalyst can also be used.
【００１９】[0019]
【実施例】次に、本発明を実施例によって具体的に説明
するが、本発明はこれらの実施例によって限定されるも
のではない。実施例及び比較例において「部」とは特に
説明が無い限り「重量部」を意味する。[Examples] Next, the present invention will be specifically explained by examples, but the present invention is not limited to these examples. In Examples and Comparative Examples, "parts" means "parts by weight" unless otherwise specified.
【００２０】実施例１
攪拌機、温度計及びディーンスターク共沸蒸溜トラップ
を装着した反応容器に、化８に示されるジアミノシロキ
サン １００部と無水マレイン酸８０部を装入し、窒素
ガスを通気させながら昇温した。容器内温度 １００℃
で３時間反応後、 １８０℃でキシロール還流法により
生成する水を系外に除去した。この状態で ２時間反応
後、減圧蒸溜によりキシロールを系外に除去し冷却する
ことによりジアミノシロキサンから誘導される淡黄色の
ビスマレイミドを合成した。Example 1 A reaction vessel equipped with a stirrer, a thermometer, and a Dean-Stark azeotropic distillation trap was charged with 100 parts of the diaminosiloxane shown in Chemical Formula 8 and 80 parts of maleic anhydride, and heated while bubbling nitrogen gas. The temperature rose. Container temperature 100℃
After reacting for 3 hours at 180°C, the produced water was removed from the system by xylene reflux method. After reacting in this state for 2 hours, xylene was removed from the system by distillation under reduced pressure, and by cooling, pale yellow bismaleimide derived from diaminosiloxane was synthesized.
【００２１】[0021]
【化８】[Chemical formula 8]
【００２２】このビスマレイミド８５部に、エポキシ化
物ＢＦ−１０００（アデカ・アーガス化学社製、商品名
）１５部、酸化防止剤 ０．１部を加えて均一になるま
でよく攪拌して熱硬化性樹脂組成物を製造した。To 85 parts of this bismaleimide, 15 parts of epoxide BF-1000 (manufactured by Adeka Argus Chemical Co., Ltd., trade name) and 0.1 part of an antioxidant were added, and the mixture was thoroughly stirred until homogeneous. A resin composition was produced.
【００２３】実施例２
化９に示したジアミノシロキサン １００部と無水マレ
イン酸７０部を用いて実施例１と同様にして反応させ、
ジアミノシロキサンから誘導される淡黄色のビスマレイ
ミドを合成した。Example 2 100 parts of the diaminosiloxane shown in Chemical Formula 9 and 70 parts of maleic anhydride were reacted in the same manner as in Example 1.
A pale yellow bismaleimide derived from diaminosiloxane was synthesized.
【００２４】[0024]
【化９】[Chemical formula 9]
【００２５】このビスマレイミド９０部に、エポキシ化
物ＢＦ−１０００（アデカ・アーガス化学社製、商品名
）１０部、酸化防止剤 ０．１部を加えて均一になるま
でよく攪拌して熱硬化性樹脂組成物を製造した。To 90 parts of this bismaleimide, 10 parts of epoxide BF-1000 (manufactured by Adeka Argus Chemical Co., Ltd., trade name) and 0.1 part of an antioxidant were added, and stirred well until homogeneous to obtain a thermosetting material. A resin composition was produced.
【００２６】実施例３
化１０に示したジアミノシロキサン １００部と無水マ
レイン酸４０部を用いて実施例１と同様にして反応させ
、ジアミノシロキサンから誘導される淡黄色のビスマレ
イミドを合成した。Example 3 100 parts of the diaminosiloxane shown in Chemical Formula 10 and 40 parts of maleic anhydride were reacted in the same manner as in Example 1 to synthesize pale yellow bismaleimide derived from the diaminosiloxane.
【００２７】[0027]
【化１０】[Chemical formula 10]
【００２８】このビスマレイミド８５部に、エポキシ化
物ＢＦ−１０００（アデカ・アーガス化学社製、商品名
）１５部、酸化防止剤 ０．１部を加えて均一になるま
でよく攪拌して熱硬化性樹脂組成物を製造した。To 85 parts of this bismaleimide, 15 parts of epoxide BF-1000 (manufactured by Adeka Argus Chemical Co., Ltd., trade name) and 0.1 part of an antioxidant were added, and stirred well until homogeneous to obtain a thermosetting material. A resin composition was produced.
【００２９】比較例
ビスフェノールＡ型エポキシ樹脂（イミダゾール触媒硬
化）の液状封止用組成物を入手した。Comparative Example A liquid sealing composition of bisphenol A type epoxy resin (imidazole catalyst curing) was obtained.
【００３０】実施例１〜３及び比較例で得た熱硬化性樹
脂組成物について、熱分解温度、吸水率、硬度、純度を
試験した。本発明はいずれも優れており、本発明の効果
が確認された。また液状封止をした半導体ペレットは、
ペレットの反り、クラックが激減することも認められた
。The thermosetting resin compositions obtained in Examples 1 to 3 and Comparative Examples were tested for thermal decomposition temperature, water absorption, hardness, and purity. The present invention was excellent in all cases, and the effects of the present invention were confirmed. In addition, semiconductor pellets with liquid sealing are
It was also observed that pellet warping and cracking were drastically reduced.
【００３１】[0031]
【表１】
＊１ ：ＴＧＡ法（１０℃／ｍｉｎ ，１０％重量減少
点）、＊２ ：ＪＩＳ−Ｋ−７２０９ 常温２４時間
放置、＊３ ：塗膜の鉛筆硬度で示した。[Table 1] *1: TGA method (10° C./min, 10% weight loss point), *2: JIS-K-7209 left at room temperature for 24 hours, *3: Pencil hardness of coating film.
【００３２】[0032]
【発明の効果】以上の説明及び表１からも明らかなよう
に本発明の熱硬化性樹脂組成物は、耐湿性、密着性、低
応力性に優れ、かつ耐熱性にも優れ、またこの組成物に
よって液状封止をした半導体ペレットは反りやクラック
の発生のないものである。Effects of the Invention As is clear from the above explanation and Table 1, the thermosetting resin composition of the present invention has excellent moisture resistance, adhesion, and low stress properties, as well as excellent heat resistance. Semiconductor pellets sealed in liquid form do not warp or crack.
Claims (1)
シロキサンから誘導されるビスマレイミド【化１】 （但し、式中Ｒ１ 及びＲ２ は２ 価の炭化水素基を
、Ｒ３ 及びＲ４ は１ 価の炭化水素基を示し、Ｒ１
とＲ２ 、Ｒ３ とＲ４ とは、それぞれ同一でも異
なってもよく、ｎは １〜５ の整数を表す） （Ｂ）構造式化２で示される１，２−ポリブタジエンの
エポキシ化物 【化２】 を必須成分としてなることを特徴とする熱硬化性樹脂組
成物。Claim 1: (A) Bismaleimide derived from a diaminosiloxane represented by the general formula 1 [Chemical formula 1] (wherein, R1 and R2 are divalent hydrocarbon groups, and R3 and R4 are monovalent hydrocarbon groups) represents a hydrocarbon group, R1
and R2, R3 and R4 may be the same or different, and n represents an integer of 1 to 5. A thermosetting resin composition characterized in that it is an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3168758A JPH0776259B2 (en) | 1991-06-13 | 1991-06-13 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3168758A JPH0776259B2 (en) | 1991-06-13 | 1991-06-13 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04366126A true JPH04366126A (en) | 1992-12-18 |
| JPH0776259B2 JPH0776259B2 (en) | 1995-08-16 |
Family
ID=15873892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3168758A Expired - Lifetime JPH0776259B2 (en) | 1991-06-13 | 1991-06-13 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0776259B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002040490A1 (en) * | 2000-11-15 | 2002-05-23 | Andras Varga | Substituted disiloxanes, method for the production thereof and the use thereof for reversal of multidrug resistance (mdr) |
| CN114231230A (en) * | 2021-12-30 | 2022-03-25 | 黑龙江省科学院石油化学研究院 | Adhesive for reducing stress and improving temperature resistance and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5573728A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
| JPS5573726A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
| JPH02238053A (en) * | 1989-03-13 | 1990-09-20 | Toshiba Corp | Maleimide resin composition and resin sealing type semiconductor device |
| JPH04175334A (en) * | 1990-11-08 | 1992-06-23 | Fujitsu Ltd | Epoxy resin composition |
-
1991
- 1991-06-13 JP JP3168758A patent/JPH0776259B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5573728A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
| JPS5573726A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
| JPH02238053A (en) * | 1989-03-13 | 1990-09-20 | Toshiba Corp | Maleimide resin composition and resin sealing type semiconductor device |
| JPH04175334A (en) * | 1990-11-08 | 1992-06-23 | Fujitsu Ltd | Epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002040490A1 (en) * | 2000-11-15 | 2002-05-23 | Andras Varga | Substituted disiloxanes, method for the production thereof and the use thereof for reversal of multidrug resistance (mdr) |
| CN114231230A (en) * | 2021-12-30 | 2022-03-25 | 黑龙江省科学院石油化学研究院 | Adhesive for reducing stress and improving temperature resistance and preparation method thereof |
| CN114231230B (en) * | 2021-12-30 | 2023-10-20 | 黑龙江省科学院石油化学研究院 | Adhesive capable of reducing stress and improving temperature resistance and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0776259B2 (en) | 1995-08-16 |
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