JPH09255812A - Resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition improved in productivity, moldability and nonflammability, excellent in high temperature reliability and resistance to thermal shock, and useful for semiconductor device, etc., by using a specific silane compound as a silane coupling agent. SOLUTION: This composition contains (A) a filler, (B) a resin and (C) a silane compound as a silane coupling agent with a >=2C alkoxy group bound directly to silicon element. Preferably, the silane coupling agent includes a silane compound D with an alkoxy group bound directly to silicon element other than the compound defined as the component C and that the component A is an inorganic filler, esp. includes a molten silica as an essential component and is contained in a quantity of 85 to 95wt.% in this composition. Preferably, the component B comprises (b1 ) an epoxy resin as an essential component, esp. including (substituted)4,4'-bis(2,3-epoxypropoxy)biphenyl as structural units and (b2 ) a curing agent as an essential component, esp. including a phenol-based compound expressed by the formula [(n) is an integer of >=0; at least one of aromatic rings may have a halogen or hydrocarbon group subsitunent].

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a resin composition using a silane coupling agent. More specifically, it relates to a resin composition that gives a molded product excellent in productivity, moldability, flame retardancy, reliability, and thermal shock resistance.

[0002]

2. Description of the Related Art The use of silane coupling agents in resin compositions for increasing mechanical strength is well known and widely used. The silane coupling agent acts as an intermediary between the inorganic filler and the organic resin, which have contradictory properties, and improves the strength of the composition. In order to further improve the strength, developments such as introducing a functional group capable of reacting with an organic resin matrix into an organic group directly bonded to a silicon atom have been carried out.

However, if a single silane coupling agent is used, it is difficult to simultaneously satisfy productivity, moldability, flame retardancy, reliability and thermal shock resistance.

[0004] In various fields, resin compositions have been actively used as substitutes for metal parts and ceramic parts and as applications for new fields.

This is because the resin composition is superior to conventional materials in productivity, weight, and other characteristics.
A thermosetting resin is selected to ensure heat resistance, and among them, epoxy resin has excellent heat resistance, moisture resistance, electrical characteristics, adhesiveness, and the like, and since various characteristics can be imparted by the compounding formulation, It is used as an industrial material such as paints, adhesives and electrical insulation materials.

These resin compositions are secured in heat resistance by various methods. However, since they are usually flammable, they are flame retarded. Therefore, a halogen compound represented by a bromide and an antimony compound are combined. Flame retardant is added.

[0007] When the resin composition is used for electric parts, these additives have the drawbacks of impairing reliability as impurities. However, it has been difficult with the conventional techniques to ensure the required flame retardancy of the composition without adding a flame retardant.

On the other hand, as a method of sealing electronic circuit parts such as semiconductor devices, hermetic sealing using metal or ceramics and resin sealing using phenol resin, silicone resin, epoxy resin or the like have been proposed in the past. Then, from the viewpoint of the balance of economic efficiency, productivity and physical properties, resin encapsulation with an epoxy resin is mainly used.

On the other hand, recently, densification and automation have also been promoted in mounting components on a printed circuit board. Instead of the conventional "insertion mounting method" in which lead pins are inserted into holes in the substrate, the components are soldered on the surface of the substrate. "Surface mounting method" to attach is becoming popular.

Along with this, the package is also a conventional DIP.
(Dual in-line package) to thin FPP (flat plastic package) suitable for high-density mounting and surface mounting.

With the shift to the surface mounting system, the soldering process, which has not been a problem so far, has become a big problem.

That is, in the conventional pin insertion mounting method,
In the soldering process, the leads are only partially heated, but in the surface mounting method, the entire package is immersed in a heating medium and heated.

As a soldering method in this surface mounting method, immersion in a solder bath, heating with a saturated vapor of an inert gas (vapor phase method), an infrared reflow method, or the like is used.
Since the package is heated to a high temperature of 270 ° C., in a package sealed with a conventional sealing resin, cracks may occur in the resin portion during soldering, or peeling may occur between the chip and the resin. Thus, there is a problem that the reliability is lowered and the product cannot be used as a product.

The occurrence of cracks in the soldering process is
It is said that the moisture absorbed between post-curing and the mounting process explosively turns into steam and expands during soldering and heating.As a countermeasure, the post-cured package must be completely dried. A method of shipping in a sealed container is used.

However, the method of enclosing the dry package in the container has the drawbacks that the manufacturing process and the handling of the product are complicated, and the product price is high.

As a sealing method using an epoxy resin, a composition obtained by mixing a curing agent and an inorganic filler in an epoxy resin is used, a semiconductor element is set in a mold, and sealing is performed by a low-pressure transfer molding machine. Methods are commonly used.

The molding machine used is also changing from the conventional conventional system to the multi-plunger system with the recent trend of thinner and smaller packages and automation of molding. Here, the conventional method is to mold a large number of devices in one pot at a time and is excellent in moldability, whereas the multi-plunger method is a method in which 1-2 devices are basically molded in one pot. Although it can be automated, it is inferior to the conventional method in terms of productivity.

However, along with the shift of this molding method, the required characteristics of the moldability of the resin composition have become more severe. Specifically, the demand for thinner and smaller packages requires higher fluidity than ever, and from the viewpoint of automation and productivity, excellent curability during molding is required.
It has become quite demanding.

Further, with the miniaturization of aluminum wiring in accordance with the high integration of devices, the performance of preventing semiconductor failure when the resin-sealed semiconductor device is left in a high temperature environment, that is, high temperature reliability. However, higher prices have been demanded.

Based on such circumstances, various improvements have been hitherto made to improve the epoxy resin composition for semiconductor encapsulation. For example, a method of adding an epoxysilane coupling agent for the purpose of improving the moisture resistance reliability (Japanese Patent Publication No. 62-1764
No. 0), a method of adding an aminosilane coupling agent having a primary amino group (JP-A-57-15575).
3) and a method of adding a ureidosilane-based coupling agent (Japanese Patent Laid-Open No. 63-110212).

Further, for the purpose of improving the solder crack resistance (heat shock resistance) of the epoxy resin composition for semiconductor encapsulation, a method using a biphenyl type epoxy resin (Japanese Patent Laid-Open No. Sho 6-96).
No. 3-251419) has been proposed.

However, in order to improve reliability,
With the method of adding the epoxy silane coupling agent, the amino silane coupling agent and the ureido silane coupling agent, the effect of improving the reliability and solder heat resistance by adding these silane coupling agents is not sufficient. The improvement effect was also unsatisfactory in terms of curability, curability, and moldability such as voids.

Further, in the method using a biphenyl type epoxy resin, although the solder crack resistance is improved, it is still not at a satisfactory level, and the curability and productivity at the time of molding are deteriorated, and voids are generated. But I still had a problem.

[0024]

SUMMARY OF THE INVENTION The present invention has been achieved as a result of studying a solution to the problems of the above-mentioned conventional resin compositions.

Therefore, an object of the present invention is to provide a molded product excellent in productivity, moldability, flame retardancy, reliability, and thermal shock resistance, particularly a molded product for sealing a semiconductor element. .

[0026]

In order to achieve the above object, a resin composition comprises a filler (A), a resin (B) and a coupling agent, and the silane coupling agent has 2 or more carbon atoms. A silane compound (C) in which an organic group is directly bonded to a silicon atom as a hydrolyzable group is an essential component. More preferably, the silane compound (C) is a compound in which an alkoxy group having 2 or more carbon atoms is directly bonded to a silicon atom.

According to the present invention, when a silane coupling agent having a specific functional group is used, productivity, moldability and flame retardancy can be improved, and further reliability and thermal shock resistance can be improved. Can be improved.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described below in detail.
In the present invention, “weight” means “mass”.

Examples of the silane coupling agent used in the present invention include a hydrolyzable group such as an alkoxy group, an acetoxy group, an alkylamino group, a ketoxime group, and an isopropenoxy group, and an organic group which is not an essential component but is a silicon atom. Directly connected products and partially hydrolyzed condensates thereof are generally used. As the hydrolyzable group, an alkoxy group, especially an ethoxy group or a methoxy group is preferably used. As the organic group, a hydrocarbon group or a hydrocarbon group substituted with a nitrogen atom, an oxygen atom, a halogen atom, a sulfur atom or the like is used, and a hydrocarbon group substituted with the above atom is preferably used.

In the present invention, a silane compound (C) having an alkoxy group having 2 or more carbon atoms directly bonded to a silicon atom is used. Examples of the chemical structure include those having a structure represented by the following general formula (I), or hydrolysis-condensation products thereof.

Embedded image (However, R ^{1 to} R ³ each represent an organic group and may be the same or different. However, R ² is an organic group having 1 or more carbon atoms, and 2 or more carbon atoms, preferably 2 to 6 carbon atoms. It is essential that at least one of the organic groups is N. 1 to 3.) Further, together with the silane compound (C), the silane compound (C) is not defined and the alkoxy group is a silicon atom. The silane compound (D) directly bonded can be blended. Substantially, the alkoxy group becomes a methoxy group. Examples of such a compound include those represented by the following general formula (II), or hydrolysis-condensation products thereof.

Embedded image (However, R ^{1 and} R ² each represent an organic group and may be the same or different. N: 1 to 3) The ratio of the silane compound (C) to the silane compound (D) is 10
0/0 to 2/98 is preferable. If the amount of the silane compound (D) exceeds this range, the resin composition cannot be produced, or the voids of the molded product increase and the moldability deteriorates.

When a plurality of types of silane coupling agents are used, they may be added individually or mixed, or may be mixed with other components contained in the resin composition in advance to react them. Can also be used.

Examples of the silane compound having a hydrolyzable group having 2 or more carbon atoms included in the silane compound (C) are as follows.

Tetraethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, diphenyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane,
3-ureidopropyltriethoxysilane, 3-aminopropyltris (2-methoxyethoxyethoxy) silane, 3-4,5 dihydroimidazolepropyltriethoxysilane, 3-mercaptopropyltriethoxysilane, 3-chloropropyltriethoxysilane, 3-cyanopropyltriethoxysilane, vinyltri (2-methoxyethoxy) silane, octyltriethoxysilane, methyltri (methacryloyloxyethoxy) silane, methyltri (glycidyloxy) silane, tetraethylsilicate, vinyltriacetoxysilane, γchloropropylmethyldi Examples include ethoxysilane and γ-chloropropyltriethoxysilane.

The silane compound (C) of the present invention is preferably a compound in which an organic group to which at least one selected from oxygen atom, sulfur atom and nitrogen atom is bonded is directly bonded to a silicon atom. It is preferable to use one having an organic group having at least one of a (glycidyl group), an amino group and a mercapto group from the viewpoint of thermal shock resistance.

More preferably, a silane compound having an ethoxy group as a hydrolyzable group having 2 or more carbon atoms is preferably used from the viewpoint of handleability.

There are many silane compounds (D) that can be used in combination with the above silane compound (C), but examples include tetramethoxysilane, methyltrimethoxysilane, vinyltrimethoxysila, dimethyldimethoxysilane, phenyltrimethoxysilane and diphenyltrimethoxy. Silane, 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-ureidopropyltrimethoxysilane, 3-4,5 dihydroimidazolepropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyl Trimethoxysilane, 3-chloropropyltrimethoxysilane, 3
-Chloropropylmethyldimethoxysilane, 3-cyanopropyltrimethoxysilane, octyltrimethoxysilane, γchloropropylmethyldimethoxysilane, γchloropropyltrimethoxysilane, γmethacryloxypropyltrimethoxysilane, β- (3,4 epoxycyclohexyl) ) Ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β
(Aminoethyl) γ-aminopropylmethyldimethoxysilane, N-phenyl-γaminopropyltrimethoxysilane, γmercaptopropyltrimethoxysilane, tetramethoxysilane, N-methyl3-aminopropyltrimethoxysilane, N-aminoethyl-3- Aminopropylmethyl-dimethoxysilane, triaminopropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, and the like. The silane compound (D) of the present invention is preferably a compound in which an organic group to which one or more kinds selected from oxygen atom, sulfur atom and nitrogen atom are bonded is directly bonded to a silicon atom, and further, an epoxy group (glycidyl group) ), An organic group having at least one of an amino group and a mercapto group is used from the viewpoint of thermal shock resistance.

The amount of the silane coupling agent added is preferably 0.5 to 6% by weight, more preferably 0.7 to 2% by weight, based on the filler (A).

As the filler (A) used in the present invention,
Inorganic substances are commonly used. Metals such as fused silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, and inorganic substances such as asbestos, glass fiber and glass spheres Can be used. These fillers may be powders or fibers and their shape is not specified.

Among these fillers, silica is preferably used, and amorphous silica is preferably used because it has a large effect of lowering the coefficient of linear expansion by heat and is effective in reducing stress. Examples of the amorphous silica include fused silica produced by fusing quartz, and crushed or spherical silica is used.

The fused silica as used herein generally means an amorphous silica having a true specific gravity of 2.3 or less. In the production of the fused silica, it is not always necessary to go through a molten state, and any production method can be used. For example, it can be produced by a method of melting crystalline silica or a method of synthesizing from various raw materials.

The blending ratio of the filler (A) is in the order of 80% by weight or more, 85% by weight or more and 87% by weight or more of the entire resin composition in consideration of the moldability and the thermal shock resistance of the obtained molding. On the other hand, 98% by weight or less, 97% by weight or less, and 95% by weight or less are preferable in this order, and these ranges can be used.

In the present invention, although not an essential component,
A halogen compound can be added. It is usually added as a flame-retardant material to the resin composition and is not particularly limited, and known materials can be used. As an example, a halogenated resin, especially a brominated resin can be cited.

In the present invention, although not an essential component,
An antimony compound can be added. It usually acts as a flame retardant aid in combination with a halogen compound,
Antimony oxide such as diantimony trioxide or diantimony tetroxide is used.

The flame retardant such as a halogen compound and an antimony compound added for the purpose of imparting flame retardancy is 150
Corrodes metals at high temperatures of ~ 200 ° C. Therefore, when the resin composition is used for the purpose of encapsulating a semiconductor device, it becomes a cause of lowering the reliability of the device, that is, the high temperature reliability. Therefore, the amount of the halogen compound added is 0.5 in terms of halogen atoms, based on the entire resin composition.
% By weight or less is preferred. Also, regarding the antimony compound, the addition amount is preferably 0.1% by weight or less in terms of antimony atoms based on the entire resin composition.

In the present invention, it is preferable that the flame retardant composed of a halogen compound and an antimony compound is not substantially added in the range where the amount of the filler (A) added exceeds 88% by weight.

The resin (B) used in the present invention is not particularly limited, and known materials can be used. The resin is polyester,
Polypropylene, polystyrene nylon, silicone,
There are various elastomers such as olefin copolymers, modified nitrile rubber and modified polybutadiene rubber, various thermoplastic resins such as polyethylene, and thermosetting resins such as acrylic, alkyd, melamine, epoxy, polyamide, phenol, and urethane. Thermosetting resins are preferable in terms of heat resistance and thermal shock resistance. More preferably, a combination of the epoxy resin (E) and its curing agent (F) is selected from the viewpoints of heat resistance, adhesiveness and mechanical strength.

When a thermosetting resin is used, the oxygen index of the resin composition of the present invention after thermosetting is 42%.
It is preferable that it is above.

The epoxy resin (E) of the present invention has two or more epoxy groups (glycidyl groups) in one molecule and is not particularly limited. Specific examples thereof include, for example, cresol novolac type epoxy resin and phenol. Novolac type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, and spiro ring-containing epoxy resin and halogenation Examples thereof include epoxy resin.

Among the epoxy resins (E), those which are particularly preferably used in the present invention are those in which a phenolbonolac-based epoxy resin is an essential component because they are excellent in economy and solder heat resistance. Here, the phenol is not limited to phenol, and those substituted with an alkyl group such as cresol and those substituted with naphthol can also be used.

On the other hand, preferably, substituted or non-substituted 4,4'-bis (2,3-epoxypropoxy) biphenyl (hereinafter referred to as biphenyl type epoxy resin) is selected from the viewpoint of filling property of the filler and high temperature reliability. Be done. Here, as the substituent, an aromatic carbon of the biphenyl type epoxy resin is substituted with an alkyl group or a halogen atom.

(In the formula, R1 to R8 represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a halogen atom).

Preferred specific examples of the epoxy resin skeleton represented by the above formula (V) include 4,4'-bis (2,3-).
Epoxypropoxy) biphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'
Tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethyl-2-chlorobiphenyl, 4,4'-bis (2,3-
Epoxypropoxy) -3,3 ', 5,5'-tetramethyl-2-bromobiphenyl, 4,4'-bis (2,3
-Epoxypropoxy) -3,3 ', 5,5'-tetraethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetrabutylbiphenyl, 4,4 '-Bis (2,3-epoxypropoxy) biphenyl and 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetramethylbiphenyl, etc. , Or even when used in a mixed system.

The curing agent (F) used in combination with the epoxy resin in the resin (B) used in the present invention is not particularly limited as long as it reacts with the epoxy resin (E) and is cured. For example, phenol novolac resin, cresol novolac resin, phenol p-
Xylylene copolymers, various novolac resins synthesized from bisphenol A and resorcin, various polyphenol compounds such as polyvinylphenol, acid anhydrides such as maleic anhydride, phthalic anhydride and pyromellitic anhydride, and metaphenylenediamine, diamino Examples thereof include aromatic diamines such as diphenylmethane and diaminodiphenyl sulfone.

As the curing agent (F) for the epoxy resin (E), from the viewpoint of heat resistance, moisture resistance and storage stability, a phenol type novolac resin (phenol may be substituted with an alkyl group), the following formula ( The phenol p-xylylene copolymer represented by VII) and the curing agent represented by the following formula (VIII) are preferably used, and two or more curing agents may be used in combination depending on the application.

Embedded image

[Chemical 6] (In formulas VII and VIII, n is an integer of 0 or more.)

In the present invention, the above epoxy resin (E)
Is usually 3 to 15% by weight, preferably 3 to 10% by weight.
% By weight. Epoxy resin (E) content is 3% by weight
If it is less than 15%, the moldability and adhesiveness will be insufficient, and if it exceeds 15% by weight, the coefficient of linear expansion will increase, and it tends to be difficult to reduce the stress.

The content of the curing agent (F) is usually 2 to 15% by weight, preferably 2 to 10% by weight, more preferably 2 to
8% by weight.

Further, in the resin (B), the compounding ratio of the epoxy resin (E) and the curing agent (F) is such that the chemical equivalent ratio of the curing agent to the epoxy resin is 0.5-0.5 from the viewpoint of mechanical properties.
It is preferably in the range of 1.6, particularly 0.8 to 1.3.

The resin composition of the present invention may contain a curing accelerator for promoting the reaction between the epoxy resin and the curing agent.

The curing accelerator is not particularly limited as long as it accelerates the curing reaction, and specific examples thereof include 2-methylimidazole, 2,4-dimethylimidazole and 2
Imidazole compounds such as -ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α
Tertiary amine compounds such as -methylbenzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol and 1,8-diazabicyclo (5,4,0) undecene-7 , Zirconium tetramethoxide, zirconium tetrapropoxide, organometallic compounds such as tetrakis (acetylacetonato) zirconium and tri (acetylacetonato) aluminum, and triphenylphosphine, trimethylphosphine, triethylphosphine,
Organic phosphine compounds such as tributylphosphine, tri (p-methylphenyl) phosphine, and tri (nonylphenyl) phosphine are included.

Among these curing accelerators, 1,8-diazabicyclo (5,4,0) undecene-7 is preferable from the viewpoint of moldability, and more preferable from the viewpoint of productivity.
Triphenylphosphine is used.

Two or more of these curing accelerators may be used in combination depending on the intended use, and the addition amount thereof is preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin.

The resin composition of the present invention may further contain various additives described below. Various colorants and pigments such as carbon black and iron oxide. Long chain fatty acids, metal salts of long chain fatty acids, esters of long chain fatty acids,
Various release agents such as amides of long chain fatty acids and paraffin wax, and cross-linking agents such as organic peroxides.

When the silane coupling agent, which is a feature of the present invention, is added, the following reaction may occur in the composition, but the silane coupling agent is chemically converted in the composition. However, the action of the present invention is exhibited.

Hydrolytic condensation due to the hydrolyzable groups of the silane coupling agent. Condensation reaction between the hydrolyzable group of the silane coupling agent and the surface layer of the inorganic filler. Reaction of epoxy group of silane coupling agent with curing agent (E). Reaction of amino group of silane coupling agent with epoxy resin (E). Reaction of the epoxy groups of the silane coupling agent with other functional groups (eg amino groups) of the silane coupling agent. Reaction of amino groups of silane coupling agent with other functional groups of silane coupling agent. Reaction of silane coupling agent with optionally added silicone.

The resin composition of the present invention is preferably melt-kneaded. For example, a Banbury mixer, a kneader,
It is produced by melt-kneading using a known kneading method such as a roll, a single-screw or twin-screw extruder, and a kneader. It may also be tablet shaped for use in transfer molding.

The resin composition of the present invention thus constituted can give a molded product excellent in productivity, moldability (void), flame retardancy, reliability, and thermal shock resistance (solder heat resistance).

[0067]

EXAMPLES The present invention will be described in more detail below with reference to examples.

The types of silane coupling agent, filler, epoxy resin, curing agent, and other additives are shown below. It was dry blended by a mixer in the weight proportions shown in Tables 1 and 2.

A. Filler I: Fractured fused silica having an average particle diameter of 6 μm II: Spherical fused silica having an average particle diameter of 1 μm III: Spherical fused silica having an average particle diameter of 12 μm B. Resin a. Epoxy resin I ... Orthocresol novolac type epoxy resin having an epoxy equivalent of 200 ... 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl b. Curing agent I: Phenol novolac resin having a hydroxyl equivalent of 107 II: Phenol aralkyl resin having a hydroxyl equivalent of 175 represented by the following formula

[0070]

[Formula 7] (In the formula, n is an integer of 0 or more.) III ... Tris (hydroxyphenyl) methane C.I. Silane compound I ・ ・ ・ Vinyltrimethoxysilane II ・ ・ ・ γ-glycidoxypropyltriethoxysilane III ・ ・ ・ γ-aminopropyltriethoxysilane IV ・ ・ ・ γ-glycidoxypropyltrimethoxysilane V ・ ・-Γ-aminopropyltrimethoxysilane VI ... N-phenyl-γ-aminopropyltrimethoxysilane VII ... N-β (aminoethyl) γ-aminopropyltrimethoxysilane VIII ・ ・ ・ γ-mercaptopropyltri Methoxysilane D.I. Flame retardant ・ ・ ・ Epoxy equivalent 400, bromine content 49
% Brominated bisphenol A type epoxy resin E. Flame-retardant aid ・ ・ ・ Antimony trioxide F. Curing accelerator I ... Triphenylphosphine II ... 1,8-Diazabicyclo (5,4,0) undecene-7 G. Other additives a. Release agent: Carnauba wax (added amount: 0.5% by weight in the composition) b. Coloring agent: carbon black (amount added: 0.5% by weight in the composition)

[0071]

[Table 1]

[0072]

[Table 2]

Each of these mixtures was heated at a roll temperature of 90 ° C.
The mixture was heated and kneaded for 5 minutes using a mixing roll, and then cooled and pulverized to produce a resin composition.

Each of these resin compositions was molded by a low pressure transfer molding method under the conditions of a molding temperature of 175 ° C. and a transfer pressure of 70 kg / cm ^2.
Post-curing was carried out under the conditions of 75 ° C. for 5 hours, and the physical properties of each composition were measured by the following physical property measuring methods. The results are shown in Tables 3 and 4.

Oxygen index (OI): 6.5 × 3.2 × 12
A 0 mm test piece was molded and post-cured at 175 ° C. for 5 hours. According to JIS K7201, the test piece was used to determine the volume concentration of each gas at the combustion limit point, and to obtain it according to the following formula. Oxygen index [%] = (oxygen) / (oxygen + nitrogen) × 100

Molding cycle (productivity): The time of one cycle in molding with a low-pressure transfer molding machine was measured.

External voids in the package (moldability): The semiconductor element was sealed, 48 PinTSOP was molded, the outside of the package was visually observed, and pinholes generated in 10 packages were counted as voids.

Flame retardance test: 5 × (1/2) × (1/1
6) A combustion test piece of [inch] was molded and post-cured at 175 ° C. for 5 hours. The test pieces were evaluated according to the UL94 standard.

High temperature reliability: 1 equipped with a simulated semiconductor element
Using 6PinDIP, the high temperature reliability was evaluated at 170 ° C., the point at which the resistance value of 0.2Ω was indicated as a failure, and the time at which the cumulative failure rate became 63% was determined to be the high temperature characteristic life.

Solder heat resistance (heat shock resistance): 16 with a chip size of 9 × 9 mm and a package size of 28 × 28 mm on which a simulated semiconductor element having aluminum vapor-deposited is mounted.
20 pin 0 QFP are molded and post cured, 8
After humidification at 5 ° C./85% RH for 120 hours, heat treatment was performed in an IR reflow furnace having a maximum temperature of 240 ° C., and the number of external cracks was examined.

[0081]

[Table 3]

[0082]

[Table 4]

In Comparative Examples 2 and 3, the moldability was poor and a molded product having a desired shape could not be obtained. Table 3,
As is clear from the result of No. 4, the resin composition of the present invention is excellent in productivity, moldability, flame retardancy reliability, and thermal shock resistance.

[0084]

As described above, in the resin composition of the present invention, in the silane coupling agent to be used, productivity can be represented by moldability by specifying the silane compound.
It has excellent moldability represented by void generation, flame retardancy, high temperature reliability when used in semiconductor devices, and thermal shock resistance when soldered.

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location C08L 101/00 C08L 101/00

Claims (21)

[Claims] 1. A resin composition containing a filler (A), a resin (B), and a silane coupling agent, wherein the silane coupling agent is a silane in which an alkoxy group having 2 or more carbon atoms is directly bonded to a silicon atom. A resin composition containing the compound (C). 2. The resin composition according to claim 1, wherein the silane coupling agent further contains a silane compound (D) which is not defined as the silane compound (C) and has an alkoxy group directly bonded to a silicon atom. Stuff. 3. The filler (A) is 85% by weight to 98% by weight.
The resin composition according to claim 1, which contains. 4. The resin composition according to claim 1, wherein the filler (A) is an inorganic filler. 5. The resin composition according to claim 1, wherein the filler (A) contains fused silica as an essential component. 6. The resin composition according to claim 1, wherein the content of antimony atoms in the resin composition is 0.1% by weight or less in the resin composition. 7. The resin composition according to claim 1, wherein the halogen atom in the resin composition is 0.5% by weight or less. 8. The silane compound (C) or the silane compound (D) contains as an essential component a compound in which an organic group to which one or more kinds selected from an oxygen atom, a sulfur atom and a nitrogen atom are bonded is directly bonded to a silicon atom. Item 7. The resin composition according to any one of Items 1 to 7. 9. The organic group to which at least one selected from oxygen atom, sulfur atom and nitrogen atom is bonded is an organic group to which at least one selected from epoxy group, amino group and mercapto group is bonded. The resin composition described. 10. The resin composition according to claim 1, wherein the resin (B) is a thermosetting resin. 11. The resin composition according to claim 1, wherein the resin (B) is composed of an epoxy resin (E) and a curing agent (F) thereof. 12. The resin composition according to claim 11, wherein the epoxy resin (E) contains a phenolbonolac epoxy resin as an essential component. 13. The resin composition according to claim 11, wherein the epoxy resin (E) contains substituted or unsubstituted 4,4′-bis (2,3-epoxypropoxy) biphenyl as an essential component. 14. The resin composition according to claim 11, wherein the curing agent (F) contains a phenolic novolac resin as an essential component. 15. The curing agent (F) contains a phenolic compound represented by the chemical formula (VII) as an essential component.
The resin composition according to any one of to 13. Embedded image (In the above formula, n is an integer of 0 or more. The aromatic ring may be substituted with a halogen atom or a hydrocarbon group.) 16. The curing agent (F) contains a phenolic compound represented by the chemical formula (VIII) as an essential component.
The resin composition according to any one of to 13. Embedded image (In the above formula, n is an integer of 0 or more. The aromatic ring may be substituted with a halogen atom or a hydrocarbon group.) 17. The resin composition according to claim 11, wherein the composition has an oxygen index of 42 or more after heat curing. 18. A precision component comprising the resin composition according to claim 1. 19. The resin composition according to claim 1, which is for encapsulating a semiconductor. 20. A semiconductor device, wherein a semiconductor element is encapsulated with the resin composition for encapsulating a semiconductor according to claim 19. 21. A method for producing a resin composition for semiconductor encapsulation, which comprises mixing the composition components of the resin composition according to any one of claims 11 to 17.