JPS52108496A - Preparation of polyimide resins - Google Patents
Preparation of polyimide resinsInfo
- Publication number
- JPS52108496A JPS52108496A JP2523576A JP2523576A JPS52108496A JP S52108496 A JPS52108496 A JP S52108496A JP 2523576 A JP2523576 A JP 2523576A JP 2523576 A JP2523576 A JP 2523576A JP S52108496 A JPS52108496 A JP S52108496A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- polyimide resins
- solvent
- diamine
- prepare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title 1
- 239000009719 polyimide resin Substances 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 1
- 230000001476 alcoholic effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Abstract
PURPOSE: To prepare polymide resins useful as insulating coatings consisting of water as a solvent, be reaction of a specific bistrimellitic acid upon a diamine in an organic solvent having alcoholic hydroxyl groups.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2523576A JPS52108496A (en) | 1976-03-09 | 1976-03-09 | Preparation of polyimide resins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2523576A JPS52108496A (en) | 1976-03-09 | 1976-03-09 | Preparation of polyimide resins |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52108496A true JPS52108496A (en) | 1977-09-10 |
Family
ID=12160307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2523576A Pending JPS52108496A (en) | 1976-03-09 | 1976-03-09 | Preparation of polyimide resins |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52108496A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482299U (en) * | 1977-11-22 | 1979-06-11 | ||
WO2001099124A1 (en) * | 2000-06-21 | 2001-12-27 | Dai Nippon Printing Co., Ltd. | Laminate and use thereof |
CN102985463A (en) * | 2010-07-30 | 2013-03-20 | 日立化成工业株式会社 | Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device |
US9067906B2 (en) | 2008-01-09 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
-
1976
- 1976-03-09 JP JP2523576A patent/JPS52108496A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482299U (en) * | 1977-11-22 | 1979-06-11 | ||
JPS583116Y2 (en) * | 1977-11-22 | 1983-01-19 | 株式会社東芝 | Nuclear fuel assembly for boiling water reactor |
WO2001099124A1 (en) * | 2000-06-21 | 2001-12-27 | Dai Nippon Printing Co., Ltd. | Laminate and use thereof |
KR100795617B1 (en) * | 2000-06-21 | 2008-01-17 | 다이니폰 인사츠 가부시키가이샤 | Laminate and use thereof |
SG148026A1 (en) * | 2000-06-21 | 2008-12-31 | Dainippon Printing Co Ltd | Laminate and use thereof |
US8252423B2 (en) | 2000-06-21 | 2012-08-28 | Dai Nippon Printing Co., Ltd. | Laminate and use thereof |
US9067906B2 (en) | 2008-01-09 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
CN102985463A (en) * | 2010-07-30 | 2013-03-20 | 日立化成工业株式会社 | Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device |
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