JPS52108496A - Preparation of polyimide resins - Google Patents

Preparation of polyimide resins

Info

Publication number
JPS52108496A
JPS52108496A JP2523576A JP2523576A JPS52108496A JP S52108496 A JPS52108496 A JP S52108496A JP 2523576 A JP2523576 A JP 2523576A JP 2523576 A JP2523576 A JP 2523576A JP S52108496 A JPS52108496 A JP S52108496A
Authority
JP
Japan
Prior art keywords
preparation
polyimide resins
solvent
diamine
prepare
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2523576A
Other languages
Japanese (ja)
Inventor
Etsuo Hosokawa
Misao Wake
Masatada Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SWCC Corp
Original Assignee
Showa Electric Wire and Cable Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Electric Wire and Cable Co filed Critical Showa Electric Wire and Cable Co
Priority to JP2523576A priority Critical patent/JPS52108496A/en
Publication of JPS52108496A publication Critical patent/JPS52108496A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare polymide resins useful as insulating coatings consisting of water as a solvent, be reaction of a specific bistrimellitic acid upon a diamine in an organic solvent having alcoholic hydroxyl groups.
COPYRIGHT: (C)1977,JPO&Japio
JP2523576A 1976-03-09 1976-03-09 Preparation of polyimide resins Pending JPS52108496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2523576A JPS52108496A (en) 1976-03-09 1976-03-09 Preparation of polyimide resins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2523576A JPS52108496A (en) 1976-03-09 1976-03-09 Preparation of polyimide resins

Publications (1)

Publication Number Publication Date
JPS52108496A true JPS52108496A (en) 1977-09-10

Family

ID=12160307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2523576A Pending JPS52108496A (en) 1976-03-09 1976-03-09 Preparation of polyimide resins

Country Status (1)

Country Link
JP (1) JPS52108496A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482299U (en) * 1977-11-22 1979-06-11
WO2001099124A1 (en) * 2000-06-21 2001-12-27 Dai Nippon Printing Co., Ltd. Laminate and use thereof
CN102985463A (en) * 2010-07-30 2013-03-20 日立化成工业株式会社 Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device
US9067906B2 (en) 2008-01-09 2015-06-30 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482299U (en) * 1977-11-22 1979-06-11
JPS583116Y2 (en) * 1977-11-22 1983-01-19 株式会社東芝 Nuclear fuel assembly for boiling water reactor
WO2001099124A1 (en) * 2000-06-21 2001-12-27 Dai Nippon Printing Co., Ltd. Laminate and use thereof
KR100795617B1 (en) * 2000-06-21 2008-01-17 다이니폰 인사츠 가부시키가이샤 Laminate and use thereof
SG148026A1 (en) * 2000-06-21 2008-12-31 Dainippon Printing Co Ltd Laminate and use thereof
US8252423B2 (en) 2000-06-21 2012-08-28 Dai Nippon Printing Co., Ltd. Laminate and use thereof
US9067906B2 (en) 2008-01-09 2015-06-30 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
CN102985463A (en) * 2010-07-30 2013-03-20 日立化成工业株式会社 Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device

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