JPS56106949A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS56106949A
JPS56106949A JP916480A JP916480A JPS56106949A JP S56106949 A JPS56106949 A JP S56106949A JP 916480 A JP916480 A JP 916480A JP 916480 A JP916480 A JP 916480A JP S56106949 A JPS56106949 A JP S56106949A
Authority
JP
Japan
Prior art keywords
prepolymer
resin
maleimide
ester
polyfunctional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP916480A
Other languages
Japanese (ja)
Other versions
JPS6335663B2 (en
Inventor
Nobuyuki Ikeguchi
Yasunari Osaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP916480A priority Critical patent/JPS56106949A/en
Publication of JPS56106949A publication Critical patent/JPS56106949A/en
Publication of JPS6335663B2 publication Critical patent/JPS6335663B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a curable resin composition having remarkably improved adhesivity, heat resistance, mechanical strength, chemical resistance, moisture-resistance, processability, and electrical characteristics, by mixing a polyfunctional maleimide to a resin having phenolic hydroxyl groups and a resin composed of cyanic ester.
CONSTITUTION: The objective composition is prepared by compounding (A) a resin having phenolic hydroxyl groups, (B) a polyfunctional cyanic acid ester, prepolymer of said ester or a prepolymer of said ester with a polyamine, (C) a polyfunctional maleimide, a prepolymer of said maleimide, or a prepolymer of said maleimide with an amine, and if necessary, (D) an epoxy resin. The addition of the epoxy resin improves the adhesivity and enables the control of the viscosity. The compounding can be carried out either by the simple mixing of the components or by the preliminary reaction of the components.
COPYRIGHT: (C)1981,JPO&Japio
JP916480A 1980-01-29 1980-01-29 Curable resin composition Granted JPS56106949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP916480A JPS56106949A (en) 1980-01-29 1980-01-29 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP916480A JPS56106949A (en) 1980-01-29 1980-01-29 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS56106949A true JPS56106949A (en) 1981-08-25
JPS6335663B2 JPS6335663B2 (en) 1988-07-15

Family

ID=11712968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP916480A Granted JPS56106949A (en) 1980-01-29 1980-01-29 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS56106949A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390531A (en) * 1986-10-03 1988-04-21 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing use
JPH01158039A (en) * 1987-04-27 1989-06-21 Mitsubishi Gas Chem Co Inc Curable resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390531A (en) * 1986-10-03 1988-04-21 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing use
JPH01158039A (en) * 1987-04-27 1989-06-21 Mitsubishi Gas Chem Co Inc Curable resin composition

Also Published As

Publication number Publication date
JPS6335663B2 (en) 1988-07-15

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