JPS56106949A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS56106949A JPS56106949A JP916480A JP916480A JPS56106949A JP S56106949 A JPS56106949 A JP S56106949A JP 916480 A JP916480 A JP 916480A JP 916480 A JP916480 A JP 916480A JP S56106949 A JPS56106949 A JP S56106949A
- Authority
- JP
- Japan
- Prior art keywords
- prepolymer
- resin
- maleimide
- ester
- polyfunctional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare a curable resin composition having remarkably improved adhesivity, heat resistance, mechanical strength, chemical resistance, moisture-resistance, processability, and electrical characteristics, by mixing a polyfunctional maleimide to a resin having phenolic hydroxyl groups and a resin composed of cyanic ester.
CONSTITUTION: The objective composition is prepared by compounding (A) a resin having phenolic hydroxyl groups, (B) a polyfunctional cyanic acid ester, prepolymer of said ester or a prepolymer of said ester with a polyamine, (C) a polyfunctional maleimide, a prepolymer of said maleimide, or a prepolymer of said maleimide with an amine, and if necessary, (D) an epoxy resin. The addition of the epoxy resin improves the adhesivity and enables the control of the viscosity. The compounding can be carried out either by the simple mixing of the components or by the preliminary reaction of the components.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP916480A JPS56106949A (en) | 1980-01-29 | 1980-01-29 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP916480A JPS56106949A (en) | 1980-01-29 | 1980-01-29 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56106949A true JPS56106949A (en) | 1981-08-25 |
JPS6335663B2 JPS6335663B2 (en) | 1988-07-15 |
Family
ID=11712968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP916480A Granted JPS56106949A (en) | 1980-01-29 | 1980-01-29 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56106949A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6390531A (en) * | 1986-10-03 | 1988-04-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing use |
JPH01158039A (en) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
-
1980
- 1980-01-29 JP JP916480A patent/JPS56106949A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6390531A (en) * | 1986-10-03 | 1988-04-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing use |
JPH01158039A (en) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6335663B2 (en) | 1988-07-15 |
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