JPS6466282A - Adhesive composition for bonding electronic part - Google Patents
Adhesive composition for bonding electronic partInfo
- Publication number
- JPS6466282A JPS6466282A JP22585187A JP22585187A JPS6466282A JP S6466282 A JPS6466282 A JP S6466282A JP 22585187 A JP22585187 A JP 22585187A JP 22585187 A JP22585187 A JP 22585187A JP S6466282 A JPS6466282 A JP S6466282A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy polymer
- type epoxy
- compounding
- butadiene
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE:To obtain the titled composition having excellent moisture and heat- resistance and adhesive characteristics and good curability and storage stability, by compounding an o-cresol novolak-type epoxy polymer having low epoxy equivalent with a specific reaction product and fine powder of dispersible hardener. CONSTITUTION:The objective composition is produced by compounding (A) an o-cresol novolak-type epoxy polymer having an epoxy equivalent of 190-230g/eg and a softening point of 75-100 deg.C with (B) a reaction product having an epoxy equivalent of 800-2,000g/eg and a softening point of 80-105 deg.C and produced by reacting a bisphenol A-type epoxy polymer with a butadiene- acrylonitrile copolymer having carboxyl groups at both terminals and (C) fine powder of a dispersible hardener for epoxy polymer. The amount of the component A is 22.5-65pts.wt. and the content of butadiene-acrylonitrile copolymer in the component B is 5-25pts.wt. per 100pts.wt. of the whole epoxy polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22585187A JPS6466282A (en) | 1987-09-08 | 1987-09-08 | Adhesive composition for bonding electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22585187A JPS6466282A (en) | 1987-09-08 | 1987-09-08 | Adhesive composition for bonding electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6466282A true JPS6466282A (en) | 1989-03-13 |
Family
ID=16835835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22585187A Pending JPS6466282A (en) | 1987-09-08 | 1987-09-08 | Adhesive composition for bonding electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466282A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6242083B1 (en) | 1994-06-07 | 2001-06-05 | Cytec Industries Inc. | Curable compositions |
| JP2006520848A (en) * | 2003-03-04 | 2006-09-14 | エルアンドエル・プロダクツ・インコーポレイテッド | Epoxy / elastomer adduct, method of forming the same, and materials and articles formed using the same |
| JP2010006921A (en) * | 2008-06-26 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | Adhesive composition as well as adhesive sheet and coverlay film using it |
| JP2014177645A (en) * | 2007-11-21 | 2014-09-25 | Sika Technology Ag | Impact strength improving agent for epoxy resin composition |
-
1987
- 1987-09-08 JP JP22585187A patent/JPS6466282A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6242083B1 (en) | 1994-06-07 | 2001-06-05 | Cytec Industries Inc. | Curable compositions |
| JP2006520848A (en) * | 2003-03-04 | 2006-09-14 | エルアンドエル・プロダクツ・インコーポレイテッド | Epoxy / elastomer adduct, method of forming the same, and materials and articles formed using the same |
| JP2014177645A (en) * | 2007-11-21 | 2014-09-25 | Sika Technology Ag | Impact strength improving agent for epoxy resin composition |
| US9796809B2 (en) | 2007-11-21 | 2017-10-24 | Sika Technology Ag | Impact strength improving agent for epoxy resin compositions |
| JP2010006921A (en) * | 2008-06-26 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | Adhesive composition as well as adhesive sheet and coverlay film using it |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS641771A (en) | Epoxy resin powder coating composition | |
| ES8700297A1 (en) | Chemically curable resins derived from 1-oxa-3-aza-tetralin groups containing compounds and cycloaliphatic epoxy resins, process for their preparation and cure as well as the use of such resins. | |
| DE69023088D1 (en) | Thermosetting powder coating composition. | |
| ES8107288A1 (en) | Liquid or pasty, pregellable and thermo-hardening adhesive based on an epoxy resin, and its use. | |
| GB8409670D0 (en) | Coating | |
| ZA871070B (en) | Fast curing epoxy resins and a process for their preparation | |
| US20010014399A1 (en) | Conductive uv-curable epoxy formulations | |
| US3948849A (en) | Adhesive compositions | |
| MY102900A (en) | Advanced epoxy resins and coating compositions containing advanced epoxy resins. | |
| JPS6466282A (en) | Adhesive composition for bonding electronic part | |
| JPS5721450A (en) | Epoxy resin composition | |
| EP0193246A3 (en) | Heat-curable epoxy resin composition | |
| EP0138609A3 (en) | Resin compositions for laminated boards | |
| JPS5659837A (en) | Epoxy resin composition | |
| EP0317367A3 (en) | Epoxy resins and electrostatographic toner containing the same as binder | |
| JPS56166225A (en) | Epoxy resin composition | |
| US5183592A (en) | Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin | |
| EP0467258A3 (en) | Copolymerisable composition, curable resin composition containing this and their use | |
| ES8504887A1 (en) | Powder coating. | |
| JPS56109261A (en) | Expansion type rust-inhibiting material | |
| US3003981A (en) | Epoxidized polyene polymers | |
| JPS5556155A (en) | Thermoplastic polymer composition and filmy adhesive | |
| JPS6431862A (en) | Polymer composition having excellent heat resistance and solvent resistance | |
| JPS5552341A (en) | Polyethylene terephthalate resin composition | |
| JPS6462369A (en) | Epoxy polymer composition for powder coating |