JPS641771A - Epoxy resin powder coating composition - Google Patents
Epoxy resin powder coating compositionInfo
- Publication number
- JPS641771A JPS641771A JP62158638A JP15863887A JPS641771A JP S641771 A JPS641771 A JP S641771A JP 62158638 A JP62158638 A JP 62158638A JP 15863887 A JP15863887 A JP 15863887A JP S641771 A JPS641771 A JP S641771A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- softening point
- novolak resin
- coating composition
- powder coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/934—Powdered coating composition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To obtain the titled composition applicable by low-temperature coating and suitable for the coating of a film capacitor, by compounding a specific mixed epoxy resin with a phenolic novolak resin triphenylphosphine, inorganic powder and ultrafine silica powder at specific ratios. CONSTITUTION:The objective composition is composed of (A) 100pts.wt. of a mixed epoxy resin having a softening point of 60-75 deg.C and composed of 50-70wt.% of a bisphenol A-type epoxy resin having an average molecular weight of 900-1,200, preferably 950-1,100 and 50-30wt.% of a cresol novolak resin (preferably having a softening point of 65-80 deg.C), (B) 5-80pts.wt. (preferably 10-30pts.wt. especially when a moisture-resistance is highly required) of a phenolic novolak resin (preferably having a softening point of 70-100 deg.C) as a hardener, (C) 0.5-5pts.wt. of triphenylphosphine, (D) 60-200pts.wt. of inorganic powder (preferably silica) and (E) 0.01-2pts.wt. of ultrafine silica powder.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62158638A JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
CA000570433A CA1325299C (en) | 1987-06-25 | 1988-06-24 | Epoxy resin based powder coating composition |
KR1019880007635A KR960008475B1 (en) | 1987-06-25 | 1988-06-24 | Epoxy resin based powder coating composition |
US07/437,134 US5049596A (en) | 1987-06-25 | 1989-11-16 | Epoxy resin based powder coating composition with mixed filler including microfine silica |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62158638A JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JPH011771A JPH011771A (en) | 1989-01-06 |
JPS641771A true JPS641771A (en) | 1989-01-06 |
JPH07100766B2 JPH07100766B2 (en) | 1995-11-01 |
Family
ID=15676085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62158638A Expired - Lifetime JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
Country Status (4)
Country | Link |
---|---|
US (1) | US5049596A (en) |
JP (1) | JPH07100766B2 (en) |
KR (1) | KR960008475B1 (en) |
CA (1) | CA1325299C (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
JPH051204A (en) * | 1991-06-25 | 1993-01-08 | Sumitomo Durez Co Ltd | Epoxy resin composition suited for carbon dioxide laser printing |
JPH09502466A (en) * | 1993-07-06 | 1997-03-11 | ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト | Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes |
JP2007504336A (en) * | 2003-09-02 | 2007-03-01 | ゼネラル・エレクトリック・カンパニイ | Non-flow underfill material with low coefficient of thermal expansion and excellent solder ball melting performance |
JP2014169372A (en) * | 2013-03-02 | 2014-09-18 | Arakawa Chem Ind Co Ltd | Heat-releasing powdery coating material composition and heat-releasing coating film |
JP2014237805A (en) * | 2013-03-02 | 2014-12-18 | 荒川化学工業株式会社 | Heat radiating powder coating composition, heat radiating coating film and object to be coated |
JP2018044129A (en) * | 2016-09-16 | 2018-03-22 | ソマール株式会社 | Powdered paint |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5143950A (en) * | 1987-02-07 | 1992-09-01 | Somar Corporation | Power coating of epoxy resin mixture and polyvinyl butyral or formal resin |
DE3913966B4 (en) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Adhesive dispersion for electroless plating, and use for producing a printed circuit |
JPH0493362A (en) * | 1990-08-10 | 1992-03-26 | Toshiba Ceramics Co Ltd | Filler for sealing electronic part and production thereof |
JP2524011B2 (en) * | 1991-05-23 | 1996-08-14 | 株式会社日立製作所 | Thermosetting resin composition for high-voltage coil casting, mold coil and panel obtained by casting and curing with the composition |
DE4204266C2 (en) * | 1992-02-13 | 1996-04-18 | Basf Lacke & Farben | Powder coating and process for the interior coating of packaging containers |
EP0633286A1 (en) * | 1993-07-09 | 1995-01-11 | Ciba-Geigy Ag | Curable filled epoxy resin composition |
US6710105B1 (en) | 1993-07-09 | 2004-03-23 | Jens Awe | Curable epoxy resin composition comprising fillers |
JPH09255896A (en) * | 1996-03-26 | 1997-09-30 | Nippon Paint Co Ltd | Powdery coating material composition to be readily screened |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6168859B1 (en) | 1998-01-29 | 2001-01-02 | The Dow Chemical Company | Filler powder comprising a partially coated alumina powder and process to make the filler powder |
WO1999064513A1 (en) * | 1998-06-09 | 1999-12-16 | Nitto Denko Corporation | Semiconductor sealing epoxy resin composition and semiconductor device using the same |
DE19857317A1 (en) * | 1998-12-11 | 2000-06-15 | Inst Neue Mat Gemein Gmbh | domestic appliances |
KR100554352B1 (en) * | 1998-12-31 | 2006-12-19 | 주식회사 케이씨씨 | Method for producing a noblock modified epoxy resin and powder coating composition using the same |
EP2053908B1 (en) * | 1999-08-12 | 2011-12-21 | Ibiden Co., Ltd. | Multilayer printed wiring board with a solder resist composition |
DE10152829A1 (en) * | 2001-10-25 | 2003-05-15 | Basf Coatings Ag | Powdery coating material and functional coatings for high long-term use temperatures |
US6548576B1 (en) | 2001-11-07 | 2003-04-15 | Bourns, Inc. | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
KR100501798B1 (en) * | 2002-02-09 | 2005-07-20 | 서해조 | epoxy resin composite and manufacturing method for covering forming of electromagnetic parts |
US7052541B2 (en) * | 2002-06-19 | 2006-05-30 | Board Of Regents, The University Of Texas System | Color compositions |
AT412555B (en) * | 2003-01-24 | 2005-04-25 | Tigerwerk Lack Und Farbenfabri | PLASTIC BINDER FOR PRODUCING POWDER COATS |
JP4250996B2 (en) * | 2003-03-28 | 2009-04-08 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
CN100371403C (en) * | 2003-04-21 | 2008-02-27 | 索玛株式会社 | mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof |
JP4003780B2 (en) * | 2004-09-17 | 2007-11-07 | カシオ計算機株式会社 | Semiconductor device and manufacturing method thereof |
US7425235B2 (en) * | 2005-02-11 | 2008-09-16 | The Board Of Regents Of The University Of Texas System | Color compositions and methods of manufacture |
JP4799883B2 (en) * | 2005-03-01 | 2011-10-26 | 日東電工株式会社 | Epoxy resin composition cured body, method for producing the same, and optical semiconductor device using the same |
US10041176B2 (en) | 2005-04-07 | 2018-08-07 | Momentive Performance Materials Inc. | No-rinse pretreatment methods and compositions |
CA2615514A1 (en) * | 2005-06-17 | 2006-12-28 | The Board Of Regents Of The University Of Texas System | Organic/inorganic lewis acid composite materials |
NO327763B1 (en) * | 2006-09-15 | 2009-09-21 | Elkem As | Procedure for cementing gas and oil wells and cement slurry |
KR101708941B1 (en) * | 2009-10-14 | 2017-02-21 | 스미토모 베이클리트 컴퍼니 리미티드 | Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
JP7360079B2 (en) * | 2020-06-17 | 2023-10-12 | 日本製鉄株式会社 | Coating composition for electrical steel sheets, electrical steel sheets, laminated cores, and rotating electric machines |
US20230312938A1 (en) * | 2020-07-31 | 2023-10-05 | Sumitomo Bakelite Co., Ltd. | Powder coating material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55156341A (en) * | 1979-05-23 | 1980-12-05 | Matsushita Electric Ind Co Ltd | Resin composition for realing electronic parts |
JPS59226065A (en) * | 1983-06-08 | 1984-12-19 | Sumitomo Deyurezu Kk | Epoxy resin powder coating composition |
JPS60250075A (en) * | 1984-05-28 | 1985-12-10 | Dainippon Toryo Co Ltd | Powder coating composition for reinforcing iron rod |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2338430C3 (en) * | 1973-07-28 | 1978-10-12 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Heat-curable, thickened epoxy resin compounds |
CH606252A5 (en) * | 1977-01-07 | 1978-10-31 | Ciba Geigy Ag | |
JPS60260611A (en) * | 1984-06-08 | 1985-12-23 | Mitsubishi Petrochem Co Ltd | Production of high-molecular weight cresol novolak resin |
US4720515A (en) * | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
JPH0676474B2 (en) * | 1986-12-23 | 1994-09-28 | 住友ベークライト株式会社 | Insulating resin paste for semiconductors |
-
1987
- 1987-06-25 JP JP62158638A patent/JPH07100766B2/en not_active Expired - Lifetime
-
1988
- 1988-06-24 CA CA000570433A patent/CA1325299C/en not_active Expired - Fee Related
- 1988-06-24 KR KR1019880007635A patent/KR960008475B1/en not_active IP Right Cessation
-
1989
- 1989-11-16 US US07/437,134 patent/US5049596A/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55156341A (en) * | 1979-05-23 | 1980-12-05 | Matsushita Electric Ind Co Ltd | Resin composition for realing electronic parts |
JPS59226065A (en) * | 1983-06-08 | 1984-12-19 | Sumitomo Deyurezu Kk | Epoxy resin powder coating composition |
JPS60250075A (en) * | 1984-05-28 | 1985-12-10 | Dainippon Toryo Co Ltd | Powder coating composition for reinforcing iron rod |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
EP0496618A3 (en) * | 1991-01-25 | 1992-12-23 | Somar Corporation | Powder epoxy resin coating composition |
US5418265A (en) * | 1991-01-25 | 1995-05-23 | Somar Corporation | Powder epoxy resin coating composition |
JPH051204A (en) * | 1991-06-25 | 1993-01-08 | Sumitomo Durez Co Ltd | Epoxy resin composition suited for carbon dioxide laser printing |
JP2600029B2 (en) * | 1991-06-25 | 1997-04-16 | 住友デュレズ株式会社 | Epoxy resin composition suitable for carbon dioxide laser printing |
JPH09502466A (en) * | 1993-07-06 | 1997-03-11 | ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト | Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes |
JP2007504336A (en) * | 2003-09-02 | 2007-03-01 | ゼネラル・エレクトリック・カンパニイ | Non-flow underfill material with low coefficient of thermal expansion and excellent solder ball melting performance |
JP2014169372A (en) * | 2013-03-02 | 2014-09-18 | Arakawa Chem Ind Co Ltd | Heat-releasing powdery coating material composition and heat-releasing coating film |
JP2014237805A (en) * | 2013-03-02 | 2014-12-18 | 荒川化学工業株式会社 | Heat radiating powder coating composition, heat radiating coating film and object to be coated |
JP2018044129A (en) * | 2016-09-16 | 2018-03-22 | ソマール株式会社 | Powdered paint |
Also Published As
Publication number | Publication date |
---|---|
CA1325299C (en) | 1993-12-14 |
KR960008475B1 (en) | 1996-06-26 |
JPH07100766B2 (en) | 1995-11-01 |
US5049596A (en) | 1991-09-17 |
KR890000613A (en) | 1989-03-15 |
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Legal Events
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