JPS5578013A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5578013A
JPS5578013A JP15183778A JP15183778A JPS5578013A JP S5578013 A JPS5578013 A JP S5578013A JP 15183778 A JP15183778 A JP 15183778A JP 15183778 A JP15183778 A JP 15183778A JP S5578013 A JPS5578013 A JP S5578013A
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
room temperature
resin composition
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15183778A
Other languages
Japanese (ja)
Other versions
JPS5720327B2 (en
Inventor
Toshihiro Suzuki
Takashi Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Priority to JP15183778A priority Critical patent/JPS5578013A/en
Publication of JPS5578013A publication Critical patent/JPS5578013A/en
Publication of JPS5720327B2 publication Critical patent/JPS5720327B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an epoxy resin composition with low toxicity and viscosity, by mixing an imidazole curing agent which is a liquid at room temperature with a curable epoxy compound and a specific reactive diluent.
CONSTITUTION: (A) 50W100 Parts by wt. of a polyhydric phenol polyglycidyl ether epoxy resin is mixed with (B) 5W50 parts by wt. of a mono- or di-tert-(and/ or sec)butyl phenyl glycidyl ether as a reactive diluent, and (C) 2 parts by wt. of an imidazole curing agent, e.g. 2-ethyl-4-methylimidazole, which is a liquid at room temperature, to give the objective composition.
EFFECT: Usable as wet laminating vanishes because of no solvent, and high operating efficiency due to quick curability without polluting the working atmosphere. Relatively long pot life.
COPYRIGHT: (C)1980,JPO&Japio
JP15183778A 1978-12-06 1978-12-06 Epoxy resin composition Granted JPS5578013A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15183778A JPS5578013A (en) 1978-12-06 1978-12-06 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15183778A JPS5578013A (en) 1978-12-06 1978-12-06 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5578013A true JPS5578013A (en) 1980-06-12
JPS5720327B2 JPS5720327B2 (en) 1982-04-28

Family

ID=15527375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15183778A Granted JPS5578013A (en) 1978-12-06 1978-12-06 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5578013A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495317A (en) * 1980-04-25 1985-01-22 Deft Chemical Coatings, Inc. Warer reducible epoxy coating composition
JPS61221279A (en) * 1985-03-28 1986-10-01 Nippon Retsuku Kk One-pack type insulating adhesive for metal and flexible film
WO2017030988A1 (en) * 2015-08-14 2017-02-23 Cytec Industries Inc. Fast-cure pre-preg

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495317A (en) * 1980-04-25 1985-01-22 Deft Chemical Coatings, Inc. Warer reducible epoxy coating composition
JPS61221279A (en) * 1985-03-28 1986-10-01 Nippon Retsuku Kk One-pack type insulating adhesive for metal and flexible film
JPH0325468B2 (en) * 1985-03-28 1991-04-08 Nippon Retsuku Kk
WO2017030988A1 (en) * 2015-08-14 2017-02-23 Cytec Industries Inc. Fast-cure pre-preg
US11149125B2 (en) 2015-08-14 2021-10-19 Cytec Industries Inc. Fast-cure pre-preg

Also Published As

Publication number Publication date
JPS5720327B2 (en) 1982-04-28

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